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SY59119A1FCC

Silergy Corp · LED Drivers · SOP-8-EP

SY59119A1FCC from Silergy Corp, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 LX2 passive Drain of the bleeding MOS; the absolute maximum rating for LX2 is -0.3 V to 700 V (page 3).
2 HVCC power_in High-voltage power supply pin; the absolute maximum rating for HVCC is -0.3 V to 700 V (page 3).
3 NC unconnected No connect.
4 LX1 passive Drain of the main MOS; the absolute maximum rating for LX1 is -0.3 V to 500 V (page 3).
5 TFB passive Thermal foldback setting pin, set by a resistor from the datasheet TFB table (RTFB); the absolute maximum rating is -0.3 V to 3.6 V (page 3).
6 ISEN1 input Main MOS current sense pin used to set the output current together with ISEN2; the absolute maximum rating is -0.3 V to 3.6 V (page 3).
7 ISEN2 input BLD MOS current sense pin used to adjust the latching current via RISEN2, with a recommended value RISEN2 > 0.7 ohm; the absolute maximum rating is -0.3 V to 3.6 V (page 3).
8 VCC power_in Power supply pin; the absolute maximum rating for VCC is -0.3 V to 22 V (page 3).
9 GND power_in Ground reference pin.

Key specifications

Parameter Value
Manufacturer Silergy Corp
Package SOP-8-EP
Category LED Drivers
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VIN Turn-on Threshold VVIN_ON 11 12.1 13.2 V 4
VIN Turn-off Threshold VVIN_OFF 7.8 8.8 9.8 V 4
Quiescent Current IQ 210 280 350 µA 4
Internal Reference Voltage VREF 0.291 0.3 0.309 V 4
Voltage on LX2, HVCC (absolute maximum) -0.3 700 V 3
Voltage on LX1 (absolute maximum) -0.3 500 V 3
Voltage on TFB, ISEN1, ISEN2 (absolute maximum) -0.3 3.6 V 3
Voltage on VCC (absolute maximum) -0.3 22 V 3
Power Dissipation SO8E 3.3 W @ TA = 25°C, SO8E 3
Junction Temperature Range (absolute maximum) -40 150 °C 3
Lead Temperature (soldering) 260 °C Soldering, 10 sec. 3
Storage Temperature Range -65 150 °C 3
Junction Temperature Range (recommended operating) -40 150 °C 3
Ambient Temperature Range (recommended operating) -40 120 °C 3
Clamped Current of LX1 MOS ICLP 32 mA 4
BV of LX1 MOS VBV_LX1 500 V 4
BV of LX2 MOS VBV_LX2 700 V 4
Minimum Thermal Foldback Temperature TFB1 115 °C 4
Maximum Thermal Foldback Temperature TFB2 155 °C 4
Package Thermal Resistance Junction-to-Ambient SO8E θJA 30 °C/W Note 2: natural convection, TA = 25°C, JEDEC 51-3 test board 3
Package Thermal Resistance Junction-to-Case SO8E θJC 10 °C/W 3

CAD (KiCad official)

  • Symbol: SY59119A1FCC
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: sy59119a1fcc-etched.step / sy59119a1fcc-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sy59119a1fcc.step / sy59119a1fcc.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Silergy Corp datasheet (9 pp, sha256 868552747361fd4a, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF