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SVF4N65DTR
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Hangzhou Silan Microelectronics MOSFETs, TO-252-2(DPAK). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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SVF4N65DTR
Hangzhou Silan Microelectronics · MOSFETs · TO-252-2(DPAK)
SVF4N65DTR from Hangzhou Silan Microelectronics, in a TO-252-2(DPAK). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the N-channel MOSFET; gate-source voltage VGS is rated at ±30 V maximum. |
| 2 | D | passive | Drain of the N-channel MOSFET; drain-source voltage is rated at 650 V maximum with continuous drain current of 4.0 A at TC=25°C. |
| 3 | S | passive | Source of the N-channel MOSFET; source current IS is rated at 4.0 A continuous and 16 A pulsed. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Hangzhou Silan Microelectronics |
| Package | TO-252-2(DPAK) |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS | 650 | V | 2 | |||
| Gate-source voltage | VGS | -30 | 30 | V | 2 | ||
| Drain current (continuous) | ID | 4 | A | TC=25°C | 2 | ||
| Drain current (continuous) | ID | 2.5 | A | TC=100°C | 2 | ||
| Drain pulse current | IDM | 16 | A | 2 | |||
| Power dissipation (SVF4N65CAM/D column) | PD | 77 | W | TC=25°C | 2 | ||
| Single pulse avalanche energy | EAS | 215 | mJ | L=30mH, IAS=3.6A, VDD=100V, RG=25Ω, TJ=25°C (note 1) | 2 | ||
| Operating junction temperature range | TJ | -55 | 150 | °C | 2 | ||
| Storage temperature range | Tstg | -55 | 150 | °C | 2 | ||
| Drain-source breakdown voltage | BVDSS | 650 | V | VGS=0V, ID=250µA | 2 | ||
| Drain-source leakage current | IDSS | 1 | µA | VDS=650V, VGS=0V | 2 | ||
| Gate-source leakage current | IGSS | -100 | 100 | nA | VGS=±30V, VDS=0V | 2 | |
| Gate threshold voltage | VGS(th) | 2 | 4 | V | VGS=VDS, ID=250µA | 2 | |
| Static drain-source on-resistance | RDS(on) | 2.3 | 2.7 | Ω | VGS=10V, ID=2.0A | 2 | |
| Input capacitance | Ciss | 315 | 410 | 533 | pF | VDS=25V, VGS=0V, f=1.0MHz | 2 |
| Continuous source current (body diode) | IS | 4 | A | 3 | |||
| Source pulse current (body diode) | ISM | 16 | A | 3 | |||
| Source-drain diode forward voltage | VSD | 1.4 | V | IS=4.0A, VGS=0V | 3 | ||
| Power dissipation derating (SVF4N65CAM/D column) | PD | 0.62 | W/°C | Derate above 25°C | 2 | ||
| Thermal resistance, junction to case (SVF4N65CAM/D column) | RθJC | 1.62 | °C/W | 2 | |||
| Thermal resistance, junction to ambient (SVF4N65CAM/D column) | RθJA | 62 | °C/W | 2 | |||
| Output capacitance | Coss | 55 | pF | VDS=25V, VGS=0V, f=1.0MHz | 2 | ||
| Reverse transfer capacitance | Crss | 5.8 | pF | VDS=25V, VGS=0V, f=1.0MHz | 2 | ||
| Turn-on delay time | td(on) | 12.5 | ns | VDD=325V, VGS=10V, RG=25Ω, ID=4A | 2 | ||
| Turn-on rise time | tr | 22.3 | ns | VDD=325V, VGS=10V, RG=25Ω, ID=4A | 2 | ||
| Turn-off delay time | td(off) | 39.5 | ns | VDD=325V, VGS=10V, RG=25Ω, ID=4A | 2 | ||
| Turn-off fall time | tf | 22.8 | ns | VDD=325V, VGS=10V, RG=25Ω, ID=4A | 2 | ||
| Total gate charge | Qg | 12.8 | nC | VDD=520V, VGS=10V, ID=4A | 2 | ||
| Gate-source charge | Qgs | 2.7 | nC | VDD=520V, VGS=10V, ID=4A | 2 | ||
| Gate-drain charge | Qgd | 6.65 | nC | VDD=520V, VGS=10V, ID=4A | 2 | ||
| Reverse recovery time | trr | 423 | ns | IS=4.0A, VGS=0V, dIF/dt=100A/µs | 3 | ||
| Reverse recovery charge | Qrr | 1.87 | µC | 3 |
CAD (KiCad official)
- Symbol:
SVF4N65DTR - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252-2(DPAK) (KiCad packages3D, STEP)
- 3D model files:
svf4n65dtr-etched.step/svf4n65dtr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);svf4n65dtr.step/svf4n65dtr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Hangzhou Silan Microelectronics datasheet (8 pp, sha256
843d5549bbdf7754, retrieved 2026-10-16, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SVF4N65DTR
**Hangzhou Silan Microelectronics** · MOSFETs · TO-252-2(DPAK)
SVF4N65DTR from Hangzhou Silan Microelectronics, in a TO-252-2(DPAK). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the N-channel MOSFET; gate-source voltage VGS is rated at ±30 V maximum. |
| 2 | D | passive | Drain of the N-channel MOSFET; drain-source voltage is rated at 650 V maximum with continuous drain current of 4.0 A at TC=25°C. |
| 3 | S | passive | Source of the N-channel MOSFET; source current IS is rated at 4.0 A continuous and 16 A pulsed. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Hangzhou Silan Microelectronics |
| Package | TO-252-2(DPAK) |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS | | | 650 | V | | 2 |
| Gate-source voltage | VGS | -30 | | 30 | V | | 2 |
| Drain current (continuous) | ID | | | 4 | A | TC=25°C | 2 |
| Drain current (continuous) | ID | | | 2.5 | A | TC=100°C | 2 |
| Drain pulse current | IDM | | | 16 | A | | 2 |
| Power dissipation (SVF4N65CAM/D column) | PD | | | 77 | W | TC=25°C | 2 |
| Single pulse avalanche energy | EAS | | | 215 | mJ | L=30mH, IAS=3.6A, VDD=100V, RG=25Ω, TJ=25°C (note 1) | 2 |
| Operating junction temperature range | TJ | -55 | | 150 | °C | | 2 |
| Storage temperature range | Tstg | -55 | | 150 | °C | | 2 |
| Drain-source breakdown voltage | BVDSS | 650 | | | V | VGS=0V, ID=250µA | 2 |
| Drain-source leakage current | IDSS | | | 1 | µA | VDS=650V, VGS=0V | 2 |
| Gate-source leakage current | IGSS | -100 | | 100 | nA | VGS=±30V, VDS=0V | 2 |
| Gate threshold voltage | VGS(th) | 2 | | 4 | V | VGS=VDS, ID=250µA | 2 |
| Static drain-source on-resistance | RDS(on) | | 2.3 | 2.7 | Ω | VGS=10V, ID=2.0A | 2 |
| Input capacitance | Ciss | 315 | 410 | 533 | pF | VDS=25V, VGS=0V, f=1.0MHz | 2 |
| Continuous source current (body diode) | IS | | | 4 | A | | 3 |
| Source pulse current (body diode) | ISM | | | 16 | A | | 3 |
| Source-drain diode forward voltage | VSD | | | 1.4 | V | IS=4.0A, VGS=0V | 3 |
| Power dissipation derating (SVF4N65CAM/D column) | PD | | 0.62 | | W/°C | Derate above 25°C | 2 |
| Thermal resistance, junction to case (SVF4N65CAM/D column) | RθJC | | 1.62 | | °C/W | | 2 |
| Thermal resistance, junction to ambient (SVF4N65CAM/D column) | RθJA | | 62 | | °C/W | | 2 |
| Output capacitance | Coss | | 55 | | pF | VDS=25V, VGS=0V, f=1.0MHz | 2 |
| Reverse transfer capacitance | Crss | | 5.8 | | pF | VDS=25V, VGS=0V, f=1.0MHz | 2 |
| Turn-on delay time | td(on) | | 12.5 | | ns | VDD=325V, VGS=10V, RG=25Ω, ID=4A | 2 |
| Turn-on rise time | tr | | 22.3 | | ns | VDD=325V, VGS=10V, RG=25Ω, ID=4A | 2 |
| Turn-off delay time | td(off) | | 39.5 | | ns | VDD=325V, VGS=10V, RG=25Ω, ID=4A | 2 |
| Turn-off fall time | tf | | 22.8 | | ns | VDD=325V, VGS=10V, RG=25Ω, ID=4A | 2 |
| Total gate charge | Qg | | 12.8 | | nC | VDD=520V, VGS=10V, ID=4A | 2 |
| Gate-source charge | Qgs | | 2.7 | | nC | VDD=520V, VGS=10V, ID=4A | 2 |
| Gate-drain charge | Qgd | | 6.65 | | nC | VDD=520V, VGS=10V, ID=4A | 2 |
| Reverse recovery time | trr | | 423 | | ns | IS=4.0A, VGS=0V, dIF/dt=100A/µs | 3 |
| Reverse recovery charge | Qrr | | 1.87 | | µC | | 3 |
## CAD (KiCad official)
- Symbol: `SVF4N65DTR`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252-2(DPAK) (KiCad packages3D, STEP)
- 3D model files: `svf4n65dtr-etched.step` / `svf4n65dtr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `svf4n65dtr.step` / `svf4n65dtr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Hangzhou Silan Microelectronics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8586175091558256640) (8 pp, sha256 `843d5549bbdf7754`, retrieved 2026-10-16, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/svf4n65dtr-datasheet.pdf)