component
SVF4N65DTR
Public Made by Adomby adom
Hangzhou Silan Microelectronics MOSFETs, TO-252-2(DPAK). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 17d ago |
| viewers | 17d ago |
| package.json | 17d ago |
| page.json | 17d ago |
| README.md | 17d ago |
| svf4n65dtr-etched.glb | 17d ago |
| svf4n65dtr-etched.step | 17d ago |
| svf4n65dtr-hero.glb | 17d ago |
| svf4n65dtr-hero.overlay.json | 17d ago |
| svf4n65dtr.glb | 17d ago |
| svf4n65dtr.kicad_mod | 17d ago |
| svf4n65dtr.kicad_sym | 17d ago |
| svf4n65dtr.lbr | 17d ago |
| svf4n65dtr.step | 17d ago |
SVF4N65DTR
Hangzhou Silan Microelectronics · MOSFETs · TO-252-2(DPAK)
SVF4N65DTR from Hangzhou Silan Microelectronics, in a TO-252-2(DPAK). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the N-channel MOSFET; gate-source voltage VGS is rated at ±30 V maximum. |
| 2 | D | passive | Drain of the N-channel MOSFET; drain-source voltage is rated at 650 V maximum with continuous drain current of 4.0 A at TC=25°C. |
| 3 | S | passive | Source of the N-channel MOSFET; source current IS is rated at 4.0 A continuous and 16 A pulsed. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Hangzhou Silan Microelectronics |
| Package | TO-252-2(DPAK) |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS | 650 | V | 2 | |||
| Gate-source voltage | VGS | -30 | 30 | V | 2 | ||
| Drain current (continuous) | ID | 4 | A | TC=25°C | 2 | ||
| Drain current (continuous) | ID | 2.5 | A | TC=100°C | 2 | ||
| Drain pulse current | IDM | 16 | A | 2 | |||
| Power dissipation (SVF4N65CAM/D column) | PD | 77 | W | TC=25°C | 2 | ||
| Single pulse avalanche energy | EAS | 215 | mJ | L=30mH, IAS=3.6A, VDD=100V, RG=25Ω, TJ=25°C (note 1) | 2 | ||
| Operating junction temperature range | TJ | -55 | 150 | °C | 2 | ||
| Storage temperature range | Tstg | -55 | 150 | °C | 2 | ||
| Drain-source breakdown voltage | BVDSS | 650 | V | VGS=0V, ID=250µA | 2 | ||
| Drain-source leakage current | IDSS | 1 | µA | VDS=650V, VGS=0V | 2 | ||
| Gate-source leakage current | IGSS | -100 | 100 | nA | VGS=±30V, VDS=0V | 2 | |
| Gate threshold voltage | VGS(th) | 2 | 4 | V | VGS=VDS, ID=250µA | 2 | |
| Static drain-source on-resistance | RDS(on) | 2.3 | 2.7 | Ω | VGS=10V, ID=2.0A | 2 | |
| Input capacitance | Ciss | 315 | 410 | 533 | pF | VDS=25V, VGS=0V, f=1.0MHz | 2 |
| Continuous source current (body diode) | IS | 4 | A | 3 | |||
| Source pulse current (body diode) | ISM | 16 | A | 3 | |||
| Source-drain diode forward voltage | VSD | 1.4 | V | IS=4.0A, VGS=0V | 3 | ||
| Power dissipation derating (SVF4N65CAM/D column) | PD | 0.62 | W/°C | Derate above 25°C | 2 | ||
| Thermal resistance, junction to case (SVF4N65CAM/D column) | RθJC | 1.62 | °C/W | 2 | |||
| Thermal resistance, junction to ambient (SVF4N65CAM/D column) | RθJA | 62 | °C/W | 2 | |||
| Output capacitance | Coss | 55 | pF | VDS=25V, VGS=0V, f=1.0MHz | 2 | ||
| Reverse transfer capacitance | Crss | 5.8 | pF | VDS=25V, VGS=0V, f=1.0MHz | 2 | ||
| Turn-on delay time | td(on) | 12.5 | ns | VDD=325V, VGS=10V, RG=25Ω, ID=4A | 2 | ||
| Turn-on rise time | tr | 22.3 | ns | VDD=325V, VGS=10V, RG=25Ω, ID=4A | 2 | ||
| Turn-off delay time | td(off) | 39.5 | ns | VDD=325V, VGS=10V, RG=25Ω, ID=4A | 2 | ||
| Turn-off fall time | tf | 22.8 | ns | VDD=325V, VGS=10V, RG=25Ω, ID=4A | 2 | ||
| Total gate charge | Qg | 12.8 | nC | VDD=520V, VGS=10V, ID=4A | 2 | ||
| Gate-source charge | Qgs | 2.7 | nC | VDD=520V, VGS=10V, ID=4A | 2 | ||
| Gate-drain charge | Qgd | 6.65 | nC | VDD=520V, VGS=10V, ID=4A | 2 | ||
| Reverse recovery time | trr | 423 | ns | IS=4.0A, VGS=0V, dIF/dt=100A/µs | 3 | ||
| Reverse recovery charge | Qrr | 1.87 | µC | 3 |
CAD (KiCad official)
- Symbol:
SVF4N65DTR - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252-2(DPAK) (KiCad packages3D, STEP)
- 3D model files:
svf4n65dtr-etched.step/svf4n65dtr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);svf4n65dtr.step/svf4n65dtr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Hangzhou Silan Microelectronics datasheet (8 pp, sha256
843d5549bbdf7754, retrieved 2026-10-16, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).