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STTH5L06B-TR

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by adom

STMicroelectronics Diodes - General Purpose, DPAK. Pinout reviewed by a person against the datasheet, KiCad symbol/footprint/3D.

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STTH5L06B-TR

STMicroelectronics · Diodes - General Purpose · DPAK

STTH5L06B-TR from STMicroelectronics, in a DPAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode; VRRM = 600 V, IF(AV) = 5 A at TC = 150 °C (DPAK, δ = 0.5 square wave), IFSM = 60 A (tp = 10 ms sinusoidal), IR(max) = 125 µA at Tj = 150 °C.
2 NC unconnected No internal connection; centre lead of the DPAK three-lead frame, must be left unconnected.
3 K passive Cathode; electrically identical to pin 1, VRRM = 600 V; both outer leads provide the cathode connection.
Tab A passive Anode; exposed thermal tab, VF(typ) = 0.85 V at Tj = 150 °C / IF = 5 A, trr(typ) = 65 ns; Rth(j-c) = 3.5 °C/W (DPAK).

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package DPAK
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 600 V 2
Forward rms current (DPAK) IF(RMS) 10 A DPAK 2
Average forward current (TO-220AC, DPAK) IF(AV) 5 A δ = 0.5, square wave; TC = 150 °C 2
Repetitive peak forward current IFRM 65 A tP = 5 μs, F = 5 kHz square 2
Surge non repetitive forward current (DPAK) IFSM 60 A tp = 10 ms sinusoidal 2
Storage temperature range Tstg -65 175 °C 2
Maximum operating junction temperature Tj 175 °C 2
Junction to case (TO-220AC / DPAK) Rth(j-c) 3.5 °C/W TO-220AC / DPAK 2
Junction to ambient Rth(j-a) 75 °C/W 2
Reverse leakage current IR 5 µA Tj = 25 °C, VR = 600 V 3
Reverse leakage current (DPAK) IR 10 125 µA Tj = 150 °C, VR = 600 V; pulse test tp = 5 ms, δ < 2% 3
Forward voltage drop VF 1.3 V Tj = 25 °C, IF = 5 A; pulse test tp = 380 µs, δ < 2% 3
Forward voltage drop VF 0.85 1.05 V Tj = 150 °C, IF = 5 A; pulse test tp = 380 µs, δ < 2% 3
Reverse recovery time trr 65 95 ns Tj = 25 °C, IF = 1 A, VR = 30 V, dIF/dt = -50 A/µs 3
Forward recovery time tfr 150 ns Tj = 25 °C, IF = 5 A, VFR = 1.1 x VFmax, dIF/dt = 100 A/µs 3
Forward recovery voltage VFP 7 V IF = 5 A, dIF/dt = 100 A/µs 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper Figure 15: Thermal resistance junction to ambient versus copper surface under each lead 6

CAD (KiCad official)

  • Symbol: STTH5L06B-TR
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: DPAK (KiCad packages3D, STEP)
  • 3D model files: stth5l06b-tr-etched.step / stth5l06b-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stth5l06b-tr.step / stth5l06b-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (15 pp, sha256 ced142cb01f4aadd, retrieved 2026-10-20, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF