component
STTH5L06B-TR
Public Made by Adomby adom
STMicroelectronics Diodes - General Purpose, DPAK. Pinout reviewed by a person against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownSTTH5L06B-TR
STMicroelectronics · Diodes - General Purpose · DPAK
STTH5L06B-TR from STMicroelectronics, in a DPAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode; VRRM = 600 V, IF(AV) = 5 A at TC = 150 °C (DPAK, δ = 0.5 square wave), IFSM = 60 A (tp = 10 ms sinusoidal), IR(max) = 125 µA at Tj = 150 °C. |
| 2 | NC | unconnected | No internal connection; centre lead of the DPAK three-lead frame, must be left unconnected. |
| 3 | K | passive | Cathode; electrically identical to pin 1, VRRM = 600 V; both outer leads provide the cathode connection. |
| Tab | A | passive | Anode; exposed thermal tab, VF(typ) = 0.85 V at Tj = 150 °C / IF = 5 A, trr(typ) = 65 ns; Rth(j-c) = 3.5 °C/W (DPAK). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | DPAK |
| Category | Diodes |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive peak reverse voltage | VRRM | 600 | V | 2 | |||
| Forward rms current (DPAK) | IF(RMS) | 10 | A | DPAK | 2 | ||
| Average forward current (TO-220AC, DPAK) | IF(AV) | 5 | A | δ = 0.5, square wave; TC = 150 °C | 2 | ||
| Repetitive peak forward current | IFRM | 65 | A | tP = 5 μs, F = 5 kHz square | 2 | ||
| Surge non repetitive forward current (DPAK) | IFSM | 60 | A | tp = 10 ms sinusoidal | 2 | ||
| Storage temperature range | Tstg | -65 | 175 | °C | 2 | ||
| Maximum operating junction temperature | Tj | 175 | °C | 2 | |||
| Junction to case (TO-220AC / DPAK) | Rth(j-c) | 3.5 | °C/W | TO-220AC / DPAK | 2 | ||
| Junction to ambient | Rth(j-a) | 75 | °C/W | 2 | |||
| Reverse leakage current | IR | 5 | µA | Tj = 25 °C, VR = 600 V | 3 | ||
| Reverse leakage current (DPAK) | IR | 10 | 125 | µA | Tj = 150 °C, VR = 600 V; pulse test tp = 5 ms, δ < 2% | 3 | |
| Forward voltage drop | VF | 1.3 | V | Tj = 25 °C, IF = 5 A; pulse test tp = 380 µs, δ < 2% | 3 | ||
| Forward voltage drop | VF | 0.85 | 1.05 | V | Tj = 150 °C, IF = 5 A; pulse test tp = 380 µs, δ < 2% | 3 | |
| Reverse recovery time | trr | 65 | 95 | ns | Tj = 25 °C, IF = 1 A, VR = 30 V, dIF/dt = -50 A/µs | 3 | |
| Forward recovery time | tfr | 150 | ns | Tj = 25 °C, IF = 5 A, VFR = 1.1 x VFmax, dIF/dt = 100 A/µs | 3 | ||
| Forward recovery voltage | VFP | 7 | V | IF = 5 A, dIF/dt = 100 A/µs | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | Figure 15: Thermal resistance junction to ambient versus copper surface under each lead | 6 |
CAD (KiCad official)
- Symbol:
STTH5L06B-TR - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: DPAK (KiCad packages3D, STEP)
- 3D model files:
stth5l06b-tr-etched.step/stth5l06b-tr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);stth5l06b-tr.step/stth5l06b-tr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (15 pp, sha256
ced142cb01f4aadd, retrieved 2026-10-20, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).