# STTH12R06G

**STMicroelectronics** · Diodes - Fast Recovery Rectifiers · D2PAK

STTH12R06G from STMicroelectronics, in a D2PAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection; this lead is marked NC on the D2PAK (STTH12R06G) package picture. |
| 2 | K | passive | Cathode, connected to the D2PAK tab; the device is rated for VRRM 600 V and IF(AV) 12 A (Tc = 125 °C). |
| 3 | A | passive | Anode lead of the ultrafast rectifier, with a maximum junction temperature of 175 °C. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | D2PAK |
| Category | Diodes |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive peak reverse voltage | VRRM |  |  | 600 | V |  | 2 |
| Forward rms current (TO-220AC / TO-220FPAC / D2PAK) | IF(RMS) |  |  | 30 | A |  | 2 |
| Average forward current (TO-220AC / D2PAK) | IF(AV) |  |  | 12 | A | δ = 0.5, Tc = 125 °C | 2 |
| Surge non repetitive forward current | IFSM |  |  | 100 | A | tp = 10 ms sinusoidal | 2 |
| Storage temperature range | Tstg | -65 |  | 175 | °C |  | 2 |
| Maximum operating junction temperature | Tj |  |  | 175 | °C |  | 2 |
| Thermal resistance junction to case (TO-220AC / D2PAK) | Rth(j-c) |  |  | 1.7 | °C/W |  | 2 |
| Reverse leakage current | IR |  |  | 45 | µA | Tj = 25 °C, VR = VRRM | 2 |
| Reverse leakage current | IR |  | 50 | 600 | µA | Tj = 125 °C, VR = VRRM | 2 |
| Forward voltage drop | VF |  |  | 2.9 | V | Tj = 25 °C, IF = 12 A | 2 |
| Forward voltage drop | VF |  | 1.4 | 1.8 | V | Tj = 125 °C, IF = 12 A | 2 |
| Reverse recovery time | trr |  |  | 25 | ns | Tj = 25 °C, IF = 0.5 A, Irr = 0.25 A, IR = 1 A | 3 |
| Reverse recovery time | trr |  |  | 45 | ns | IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V | 3 |
| Reverse recovery current | IRM |  | 7 | 8.4 | A | Tj = 125 °C, IF = 12 A, VR = 400 V, dIF/dt = -200 A/µs | 3 |

## CAD (KiCad official)

- Symbol: `STTH12R06G`
- Footprint: `Package_TO_SOT_SMD:TO-263-2`
- 3D model: D2PAK (KiCad packages3D, STEP)
- 3D model files: `stth12r06g-etched.step` / `stth12r06g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `stth12r06g.step` / `stth12r06g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [STMicroelectronics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590454556837371904) (11 pp, sha256 `076421899b5b8332`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/stth12r06g-datasheet.pdf)