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STTH12R06G

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by adom

STMicroelectronics Diodes - Fast Recovery Rectifiers, D2PAK. Pinout reviewed by a person against the datasheet, KiCad symbol/footprint/3D.

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STTH12R06G

STMicroelectronics · Diodes - Fast Recovery Rectifiers · D2PAK

STTH12R06G from STMicroelectronics, in a D2PAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection; this lead is marked NC on the D2PAK (STTH12R06G) package picture.
2 K passive Cathode, connected to the D2PAK tab; the device is rated for VRRM 600 V and IF(AV) 12 A (Tc = 125 °C).
3 A passive Anode lead of the ultrafast rectifier, with a maximum junction temperature of 175 °C.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package D2PAK
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 600 V 2
Forward rms current (TO-220AC / TO-220FPAC / D2PAK) IF(RMS) 30 A 2
Average forward current (TO-220AC / D2PAK) IF(AV) 12 A δ = 0.5, Tc = 125 °C 2
Surge non repetitive forward current IFSM 100 A tp = 10 ms sinusoidal 2
Storage temperature range Tstg -65 175 °C 2
Maximum operating junction temperature Tj 175 °C 2
Thermal resistance junction to case (TO-220AC / D2PAK) Rth(j-c) 1.7 °C/W 2
Reverse leakage current IR 45 µA Tj = 25 °C, VR = VRRM 2
Reverse leakage current IR 50 600 µA Tj = 125 °C, VR = VRRM 2
Forward voltage drop VF 2.9 V Tj = 25 °C, IF = 12 A 2
Forward voltage drop VF 1.4 1.8 V Tj = 125 °C, IF = 12 A 2
Reverse recovery time trr 25 ns Tj = 25 °C, IF = 0.5 A, Irr = 0.25 A, IR = 1 A 3
Reverse recovery time trr 45 ns IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V 3
Reverse recovery current IRM 7 8.4 A Tj = 125 °C, IF = 12 A, VR = 400 V, dIF/dt = -200 A/µs 3

CAD (KiCad official)

  • Symbol: STTH12R06G
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: D2PAK (KiCad packages3D, STEP)
  • 3D model files: stth12r06g-etched.step / stth12r06g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); stth12r06g.step / stth12r06g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (11 pp, sha256 076421899b5b8332, retrieved 2026-10-21, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF