component
STP10N95K5
Public Made by Adomby adom
STMicroelectronics MOSFETs, TO-220. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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STP10N95K5
STMicroelectronics · MOSFETs · TO-220
STP10N95K5 from STMicroelectronics, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the MOSFET; the datasheet rates the gate-source voltage at ±30 V. |
| 2 | D | passive | Drain of the MOSFET, also connected to the TAB; the datasheet rates drain-source breakdown voltage V(BR)DSS at 950 V and continuous drain current at 8 A at TC = 25 °C. |
| 3 | S | passive | Source of the MOSFET; the datasheet gives the gate-source voltage rating of ±30 V and the source-drain diode forward voltage of 1.5 V at 8 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | TO-220 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate-source voltage | VGS | -30 | 30 | V | 2 | ||
| Drain current (continuous) at TC = 25 °C | ID | 8 | A | TC = 25 °C | 2 | ||
| Drain current (continuous) at TC = 100 °C | ID | 5 | A | TC = 100 °C | 2 | ||
| Drain current (pulsed) | IDM | 32 | A | Pulse width limited by safe operating area | 2 | ||
| Total power dissipation at TC = 25 °C | PTOT | 130 | W | TC = 25 °C | 2 | ||
| Peak diode recovery voltage slope | dv/dt | 4.5 | V/ns | ISD ≤ 8 A, di/dt ≤ 100 A/µs, VDS (peak) < V(BR)DSS | 2 | ||
| MOSFET dv/dt ruggedness | dv/dt | 50 | V/ns | VDD ≤ 760 V | 2 | ||
| Insulation withstand voltage (RMS) from all three leads to external heat sink | VISO | 2.5 | kV | t = 1 s; TC = 25 °C | 2 | ||
| Operating junction temperature range | TJ | -55 | 150 | °C | 2 | ||
| Thermal resistance, junction-to-case | RthJC | 0.96 | °C/W | 2 | |||
| Thermal resistance, junction-to-ambient (TO-220) | RthJA | 62.5 | °C/W | 2 | |||
| Avalanche current, repetitive or non-repetitive | IAR | 2.5 | A | Pulse width limited by TJ max. | 2 | ||
| Single pulse avalanche energy | EAS | 122 | mJ | Starting TJ = 25 °C, ID = IAR, VDD = 50 V | 2 | ||
| Drain-source breakdown voltage | V(BR)DSS | 950 | V | ID = 1 mA, VGS = 0 V | 3 | ||
| Zero gate voltage drain current | IDSS | 1 | µA | VGS = 0 V, VDS = 950 V | 3 | ||
| Zero gate voltage drain current at TC = 125 °C | IDSS | 50 | µA | VGS = 0 V, VDS = 950 V, TC = 125 °C | 3 | ||
| Gate body leakage current | IGSS | -10 | 10 | µA | VGS = ±20 V, VDS = 0 V | 3 | |
| Gate threshold voltage | VGS(th) | 3 | 4 | 5 | V | VDS = VGS, ID = 100 µA | 3 |
| Static drain-source on-resistance | RDS(on) | 650 | 800 | mΩ | VGS = 10 V, ID = 4 A | 3 | |
| Input capacitance | Ciss | 630 | pF | VDS = 100 V, f = 1 MHz, VGS = 0 V | 3 | ||
| Output capacitance | Coss | 50 | pF | 3 | |||
| Reverse transfer capacitance | Crss | 0.6 | pF | 3 | |||
| Equivalent capacitance time related | Co(tr) | 77 | pF | VDS = 0 to 760 V, VGS = 0 V | 3 | ||
| Equivalent capacitance energy related | Co(er) | 28 | pF | 3 | |||
| Gate input resistance | Rg | 6.5 | Ω | f = 1 MHz, ID = 0 A | 3 | ||
| Total gate charge | Qg | 22 | nC | VDD = 760 V, ID = 8 A, VGS = 0 to 10 V | 3 | ||
| Gate-source charge | Qgs | 5 | nC | 3 | |||
| Gate-drain charge | Qgd | 15 | nC | 3 | |||
| Turn-on delay time | td(on) | 22 | ns | VDD = 475 V, ID = 4 A, RG = 4.7 Ω, VGS = 10 V | 3 | ||
| Rise time | tr | 14 | ns | 3 | |||
| Turn-off delay time | td(off) | 51 | ns | 3 | |||
| Fall time | tf | 15 | ns | 3 | |||
| Source-drain current | ISD | 8 | A | 4 | |||
| Source-drain current (pulsed) | ISDM | 32 | A | 4 | |||
| Forward on voltage | VSD | 1.5 | V | ISD = 8 A, VGS = 0 V | 4 | ||
| Reverse recovery time | trr | 404 | ns | ISD = 8 A, di/dt = 100 A/µs, VDD = 60 V | 4 | ||
| Reverse recovery charge | Qrr | 5.2 | µC | 4 | |||
| Reverse recovery current | IRRM | 25.5 | A | 4 | |||
| Reverse recovery time at TJ = 150 °C | trr | 596 | ns | ISD = 8 A, di/dt = 100 A/µs, VDD = 60 V, TJ = 150 °C | 4 | ||
| Reverse recovery charge at TJ = 150 °C | Qrr | 6.9 | µC | 4 | |||
| Reverse recovery current at TJ = 150 °C | IRRM | 23 | A | 4 |
CAD (KiCad official)
- Symbol:
STP10N95K5 - Footprint:
Package_TO_SOT_THT:TO-220-3_Vertical - 3D model: TO-220 (KiCad packages3D, STEP)
- 3D model files:
stp10n95k5-etched.step/stp10n95k5-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);stp10n95k5.step/stp10n95k5.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (22 pp, sha256
4ea0ef302a1271a7, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).