# SSP61CN1902MR

**Shanghai Siproin Microelectronics** · Monitors & Reset Circuits · SOT-23

SSP61CN1902MR from Shanghai Siproin Microelectronics, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUT | output | N-channel open-drain detector output that is Hi-Z when VDD is above VDET(+) and pulled to VSS when VDD is at or below VDET(-), with 1 mA typ sink current at VOUT=0.2V and a 2V supply, and needs an external pull-up resistor (100kΩ shown in the application circuit). |
| 2 | GND | power_in | Ground (VSS) reference pin of the voltage detector. |
| 3 | VIN | power_in | Supply and voltage-sense input (VDD) with 0.7V to 10V operating voltage and an absolute maximum rating of -0.3V to 8V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shanghai Siproin Microelectronics |
| Package | SOT-23 |
| Category | Power Management ICs |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage |  | -0.3 |  | 8 | V |  | 5 |
| Operating Temperature |  | -40 |  | 85 | ℃ |  | 5 |
| Storage Temperature |  | -50 |  | 125 | ℃ |  | 5 |
| Operating Voltage | VDD | 0.7 |  | 10 | V |  | 5 |
| Output Sink Current | IOL | 0.5 | 1 |  | mA | 2V VOUT=0.2V | 5 |
| Operating Current | IDD |  | 0.7 | 2.3 | μA | Vin=1.5V | 5 |
| Operating Current | IDD |  | 0.8 | 2.7 | μA | Vin=2.0V | 5 |
| Operating Current | IDD |  | 0.9 | 3 | μA | Vin=3.0V | 5 |
| Operating Current | IDD |  | 1 | 3.2 | μA | Vin=4.0V | 5 |
| Operating Current | IDD |  | 1.1 | 3.6 | μA | Vin=5.0V | 5 |
| Detection Voltage Temperature Coefficient |  | -100 |  | 100 | ppm/℃ | -25℃<Ta<125℃ | 5 |
| Thermal Resistance, Junction to Ambient (SOT23-3) | θJA |  |  | 500 | ℃/W | No ambient airflow, no heat sink | 5 |
| Power Dissipation (SOT23-3) | PD |  |  | 0.2 | W | Ta=25℃ | 5 |

## CAD (KiCad official)

- Symbol: `SSP61CN1902MR`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `ssp61cn1902mr-etched.step` / `ssp61cn1902mr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ssp61cn1902mr.step` / `ssp61cn1902mr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shanghai Siproin Microelectronics datasheet](docs/ssp61cn1902mr-datasheet.pdf) (9 pp, sha256 `6b4be5ac3b382d5c`, retrieved 2026-11-05, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ssp61cn1902mr-datasheet.pdf)