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SSP61CN1902MR

Public Made by Adom

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Shanghai Siproin Microelectronics Monitors & Reset Circuits, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SSP61CN1902MR

Shanghai Siproin Microelectronics · Monitors & Reset Circuits · SOT-23

SSP61CN1902MR from Shanghai Siproin Microelectronics, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT output N-channel open-drain detector output that is Hi-Z when VDD is above VDET(+) and pulled to VSS when VDD is at or below VDET(-), with 1 mA typ sink current at VOUT=0.2V and a 2V supply, and needs an external pull-up resistor (100kΩ shown in the application circuit).
2 GND power_in Ground (VSS) reference pin of the voltage detector.
3 VIN power_in Supply and voltage-sense input (VDD) with 0.7V to 10V operating voltage and an absolute maximum rating of -0.3V to 8V.

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOT-23
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage -0.3 8 V 5
Operating Temperature -40 85 ℃ 5
Storage Temperature -50 125 ℃ 5
Operating Voltage VDD 0.7 10 V 5
Output Sink Current IOL 0.5 1 mA 2V VOUT=0.2V 5
Operating Current IDD 0.7 2.3 μA Vin=1.5V 5
Operating Current IDD 0.8 2.7 μA Vin=2.0V 5
Operating Current IDD 0.9 3 μA Vin=3.0V 5
Operating Current IDD 1 3.2 μA Vin=4.0V 5
Operating Current IDD 1.1 3.6 μA Vin=5.0V 5
Detection Voltage Temperature Coefficient -100 100 ppm/℃ -25℃<Ta<125℃ 5
Thermal Resistance, Junction to Ambient (SOT23-3) θJA 500 ℃/W No ambient airflow, no heat sink 5
Power Dissipation (SOT23-3) PD 0.2 W Ta=25℃ 5

CAD (KiCad official)

  • Symbol: SSP61CN1902MR
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: ssp61cn1902mr-etched.step / ssp61cn1902mr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ssp61cn1902mr.step / ssp61cn1902mr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (9 pp, sha256 6b4be5ac3b382d5c, retrieved 2026-11-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF