component
SP60N03GTH
Public Made by Adomby adom
Siliup MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 11h ago |
| viewers | 11h ago |
| package.json | 11h ago |
| page.json | 11h ago |
| README.md | 11h ago |
| sp60n03gth-etched.glb | 11h ago |
| sp60n03gth-etched.step | 11h ago |
| sp60n03gth-hero.glb | 11h ago |
| sp60n03gth-hero.overlay.json | 11h ago |
| sp60n03gth.glb | 11h ago |
| sp60n03gth.kicad_mod | 11h ago |
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| sp60n03gth.lbr | 11h ago |
| sp60n03gth.step | 11h ago |
SP60N03GTH
Siliup · MOSFETs · TO-252
SP60N03GTH from Siliup, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; gate-source voltage is rated ±20 V (VGSS) per the absolute maximum ratings. |
| 2 | D | passive | Drain terminal; drain-source voltage is rated 60 V (VDSS) and continuous drain current 140 A at Tc=25°C. |
| 3 | S | passive | Source terminal; the gate-source voltage rating of ±20 V (VGSS) is referenced to this pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Siliup |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | 60 | V | 2 | |||
| Gate-Source Voltage | VGSS | -20 | 20 | V | 2 | ||
| Continuous Drain Current | ID | 140 | A | Tc=25°C | 2 | ||
| Continuous Drain Current | ID | 94 | A | Tc=100°C | 2 | ||
| Pulse Drain Current | IDM | 560 | A | Tested | 2 | ||
| Single Pulse Avalanche Energy | EAS | 441 | mJ | 2 | |||
| Power Dissipation | PD | 110 | W | Tc=25°C | 2 | ||
| Power Dissipation | PD | 44 | W | Tc=100°C | 2 | ||
| Maximum Junction Temperature | TJ | -55 | 150 | °C | 2 | ||
| Storage Temperature Range | TSTG | -55 | 150 | °C | 2 | ||
| Thermal Resistance Junction-to-Case | RθJC | 1.14 | °C/W | 2 | |||
| Drain-Source Breakdown Voltage | BVDSS | 60 | V | VGS=0V, ID=250mA | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | uA | VDS=48V, VGS=0V | 2 | ||
| Gate Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V, VDS=0V | 2 | |
| Gate Threshold Voltage | VGS(th) | 1.3 | 1.7 | 2.3 | V | VDS=VGS, ID=250uA | 2 |
| Drain-Source On-state Resistance | RDS(ON) | 3.1 | 3.9 | mΩ | VGS=10V, ID=20A | 2 | |
| Drain-Source On-state Resistance | RDS(ON) | 4 | 5.3 | mΩ | VGS=4.5V, ID=10A | 2 | |
| Source-Drain Diode Forward Voltage | VSD | 1.2 | V | VGS=0V, IS=1A, TJ=25℃ | 2 | ||
| Maximum Body-Diode Continuous Current | IS | 140 | A | 2 | |||
| Gate Resistance | RG | 2.4 | Ω | VDS=30V, VGS=0V, f=1MHz | 2 | ||
| Input Capacitance | Ciss | 4300 | pF | VGS=0V, VDS=30V, F=1MHz | 2 | ||
| Output Capacitance | Coss | 1700 | pF | VGS=0V, VDS=30V, F=1MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 73 | pF | VGS=0V, VDS=30V, F=1MHz | 2 | ||
| Total Gate Charge | Qg | 61 | nC | VDS=30V, VGS=10V, ID=20A | 2 | ||
| Gate-Source Charge | Qgs | 14 | nC | VDS=30V, VGS=10V, ID=20A | 2 | ||
| Gate-Drain Charge | Qgd | 12 | nC | VDS=30V, VGS=10V, ID=20A | 2 | ||
| Gate Plateau Voltage | Vplateau | 3.75 | V | VDS=30V, VGS=10V, ID=20A | 2 | ||
| Turn-On Delay Time | td(on) | 16 | nS | VDD=30V, ID=20A, VGS=10V, RG=3Ω | 2 | ||
| Rise Time | tr | 114 | nS | VDD=30V, ID=20A, VGS=10V, RG=3Ω | 2 | ||
| Turn-Off Delay Time | td(off) | 47.5 | nS | VDD=30V, ID=20A, VGS=10V, RG=3Ω | 2 | ||
| Fall Time | tf | 136.5 | nS | VDD=30V, ID=20A, VGS=10V, RG=3Ω | 2 | ||
| Reverse Recovery Time | Trr | 35 | nS | IS=50 A,di/dt=100 A/μs,TJ=25℃ | 2 | ||
| Reverse Recovery Charge | Qrr | 30 | nC | IS=50 A,di/dt=100 A/μs,TJ=25℃ | 2 |
CAD (KiCad official)
- Symbol:
SP60N03GTH - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
sp60n03gth-etched.step/sp60n03gth-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sp60n03gth.step/sp60n03gth.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Siliup datasheet (9 pp, sha256
7f6a23f7bd74aa6f, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).