component
SP60N03GHTH
Public Made by Adomby adom
Siliup MOSFETs, TO-252-2L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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SP60N03GHTH
Siliup · MOSFETs · TO-252-2L
SP60N03GHTH from Siliup, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the N-channel MOSFET; the absolute maximum gate-source voltage is ±20 V (VGSS). |
| 2 | D | passive | Drain terminal; the drain-source voltage is rated 60 V (VDSS) and the continuous drain current is 110 A at Tc=25°C. |
| 3 | S | passive | Source terminal; the maximum body-diode continuous current IS is rated 110 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Siliup |
| Package | TO-252-2L |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | 60 | V | 2 | |||
| Gate-Source Voltage | VGSS | -20 | 20 | V | 2 | ||
| Continuous Drain Current | ID | 110 | A | Tc=25°C | 2 | ||
| Continuous Drain Current | ID | 75 | A | Tc=100°C | 2 | ||
| Pulse Drain Current Tested | IDM | 440 | A | 2 | |||
| Single Pulse Avalanche Energy | EAS | 784 | mJ | 2 | |||
| Power Dissipation | PD | 110 | W | Tc=25°C | 2 | ||
| Thermal Resistance Junction-to-Case | RθJC | 1.14 | °C/W | 2 | |||
| Maximum Junction Temperature | TJ | -55 | 150 | °C | 2 | ||
| Storage Temperature Range | TSTG | -55 | 150 | °C | 2 | ||
| Drain-Source Breakdown Voltage | BVDSS | 60 | V | VGS=0V, ID=250mA | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | uA | VDS=48V, VGS=0V | 2 | ||
| Gate Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V, VDS=0V | 2 | |
| Gate Threshold Voltage | VGS(th) | 2 | 2.5 | 4 | V | VDS=VGS, ID=250uA | 2 |
| Drain-Source On-state Resistance | RDS(ON) | 3.7 | 4.7 | mΩ | VGS=10V, ID=20A | 2 | |
| Source-Drain Diode Forward Voltage | VSD | 1.2 | V | VGS=0V, IS=1A, TJ=25℃ | 2 | ||
| Maximum Body-Diode Continuous Current | IS | 110 | A | 2 | |||
| Input Capacitance | Ciss | 4250 | pF | VGS=0V, VDS=30V, F=1MHz | 2 | ||
| Output Capacitance | Coss | 975 | pF | 2 | |||
| Reverse Transfer Capacitance | Crss | 41 | pF | 2 | |||
| Total Gate Charge | Qg | 42 | nC | VDS=30V, VGS=10V, ID=20A | 2 | ||
| Gate-Source Charge | Qgs | 12 | nC | 2 | |||
| Gate-Drain Charge | Qgd | 10 | nC | 2 | |||
| Turn-On Delay Time | td(on) | 13.5 | nS | VDD=30V, ID=20A, VGS=10V, RG=3Ω | 2 | ||
| Rise Time | tr | 96 | nS | 2 | |||
| Turn-Off Delay Time | td(off) | 40 | nS | 2 | |||
| Fall Time | tf | 115 | nS | 2 | |||
| Reverse Recovery Time | Trr | 35 | nS | IS=60 A,di/dt=100 A/μs,TJ=25℃ | 2 | ||
| Reverse Recovery Charge | Qrr | 30 | nC | 2 |
CAD (KiCad official)
- Symbol:
SP60N03GHTH - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252-2L (KiCad packages3D, STEP)
- 3D model files:
sp60n03ghth-etched.step/sp60n03ghth-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sp60n03ghth.step/sp60n03ghth.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Siliup datasheet (5 pp, sha256
9c31742b1669d652, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SP60N03GHTH
**Siliup** · MOSFETs · TO-252-2L
SP60N03GHTH from Siliup, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the N-channel MOSFET; the absolute maximum gate-source voltage is ±20 V (VGSS). |
| 2 | D | passive | Drain terminal; the drain-source voltage is rated 60 V (VDSS) and the continuous drain current is 110 A at Tc=25°C. |
| 3 | S | passive | Source terminal; the maximum body-diode continuous current IS is rated 110 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Siliup |
| Package | TO-252-2L |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | | | 60 | V | | 2 |
| Gate-Source Voltage | VGSS | -20 | | 20 | V | | 2 |
| Continuous Drain Current | ID | | | 110 | A | Tc=25°C | 2 |
| Continuous Drain Current | ID | | | 75 | A | Tc=100°C | 2 |
| Pulse Drain Current Tested | IDM | | | 440 | A | | 2 |
| Single Pulse Avalanche Energy | EAS | | | 784 | mJ | | 2 |
| Power Dissipation | PD | | | 110 | W | Tc=25°C | 2 |
| Thermal Resistance Junction-to-Case | RθJC | | | 1.14 | °C/W | | 2 |
| Maximum Junction Temperature | TJ | -55 | | 150 | °C | | 2 |
| Storage Temperature Range | TSTG | -55 | | 150 | °C | | 2 |
| Drain-Source Breakdown Voltage | BVDSS | 60 | | | V | VGS=0V, ID=250mA | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 1 | uA | VDS=48V, VGS=0V | 2 |
| Gate Leakage Current | IGSS | -100 | | 100 | nA | VGS=±20V, VDS=0V | 2 |
| Gate Threshold Voltage | VGS(th) | 2 | 2.5 | 4 | V | VDS=VGS, ID=250uA | 2 |
| Drain-Source On-state Resistance | RDS(ON) | | 3.7 | 4.7 | mΩ | VGS=10V, ID=20A | 2 |
| Source-Drain Diode Forward Voltage | VSD | | | 1.2 | V | VGS=0V, IS=1A, TJ=25℃ | 2 |
| Maximum Body-Diode Continuous Current | IS | | | 110 | A | | 2 |
| Input Capacitance | Ciss | | 4250 | | pF | VGS=0V, VDS=30V, F=1MHz | 2 |
| Output Capacitance | Coss | | 975 | | pF | | 2 |
| Reverse Transfer Capacitance | Crss | | 41 | | pF | | 2 |
| Total Gate Charge | Qg | | 42 | | nC | VDS=30V, VGS=10V, ID=20A | 2 |
| Gate-Source Charge | Qgs | | 12 | | nC | | 2 |
| Gate-Drain Charge | Qgd | | 10 | | nC | | 2 |
| Turn-On Delay Time | td(on) | | 13.5 | | nS | VDD=30V, ID=20A, VGS=10V, RG=3Ω | 2 |
| Rise Time | tr | | 96 | | nS | | 2 |
| Turn-Off Delay Time | td(off) | | 40 | | nS | | 2 |
| Fall Time | tf | | 115 | | nS | | 2 |
| Reverse Recovery Time | Trr | | 35 | | nS | IS=60 A,di/dt=100 A/μs,TJ=25℃ | 2 |
| Reverse Recovery Charge | Qrr | | 30 | | nC | | 2 |
## CAD (KiCad official)
- Symbol: `SP60N03GHTH`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252-2L (KiCad packages3D, STEP)
- 3D model files: `sp60n03ghth-etched.step` / `sp60n03ghth-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sp60n03ghth.step` / `sp60n03ghth.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Siliup datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603376538075348992) (5 pp, sha256 `9c31742b1669d652`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/sp60n03ghth-datasheet.pdf)