component
SP010N04AGHTD
Public Made by Adomby adom
Siliup MOSFETs, TO-263. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 18d ago |
| viewers | 18d ago |
| package.json | 18d ago |
| page.json | 18d ago |
| README.md | 18d ago |
| sp010n04aghtd-etched.glb | 18d ago |
| sp010n04aghtd-etched.step | 18d ago |
| sp010n04aghtd-hero.glb | 18d ago |
| sp010n04aghtd-hero.overlay.json | 18d ago |
| sp010n04aghtd.glb | 18d ago |
| sp010n04aghtd.kicad_mod | 18d ago |
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| sp010n04aghtd.lbr | 18d ago |
| sp010n04aghtd.step | 18d ago |
SP010N04AGHTD
Siliup · MOSFETs · TO-263
SP010N04AGHTD from Siliup, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate pin of the N-channel MOSFET, with gate-source voltage rated ±20 V and threshold of 2.6 to 3.4 V at 250 uA. |
| 2 | D | passive | Drain pin, rated for 100 V drain-source voltage and 130 A continuous current at Tc=25℃ (520 A pulsed). |
| 3 | S | passive | Source pin, carrying up to 130 A continuous current at Tc=25℃ and body-diode continuous current of 130 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Siliup |
| Package | TO-263 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 100 | V | Ta=25℃ | 2 | ||
| Gate-Source Voltage | VGS | -20 | 20 | V | Ta=25℃ | 2 | |
| Continuous Drain Current | ID | 130 | A | Tc=25℃ | 2 | ||
| Continuous Drain Current | ID | 87 | A | Tc=100℃ | 2 | ||
| Pulsed Drain Current | IDM | 520 | A | 2 | |||
| Single Pulse Avalanche Energy | EAS | 841 | mJ | VDD=50V, VGS=10V, L=0.5mH, RG=25Ω | 2 | ||
| Power Dissipation | PD | 180 | W | Tc=25℃ | 2 | ||
| Power Dissipation | PD | 72 | W | Tc=100℃ | 2 | ||
| Thermal Resistance Junction-to-Case | RθJC | 0.69 | ℃/W | 2 | |||
| Storage Temperature Range | TSTG | -55 | 150 | ℃ | 2 | ||
| Operating Junction Temperature Range | TJ | -55 | 150 | ℃ | 2 | ||
| Drain-Source Breakdown Voltage | BVDSS | 100 | V | VGS=0V, ID=250uA | 2 | ||
| Drain Cut-Off Current | IDSS | 1 | uA | VDS=80V, VGS=0V, TJ=25℃ | 2 | ||
| Gate Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V, VDS=0V | 2 | |
| Gate Threshold Voltage | VGS(th) | 2.6 | 3 | 3.4 | V | VGS=VDS, ID=250uA | 2 |
| Drain-Source ON Resistance | RDS(ON) | 3.9 | 5.2 | mΩ | VGS=10V, ID=30A | 2 | |
| Source-Drain Diode Forward Voltage | VSD | 1.2 | V | VGS=0V, IS=1A, TJ=25℃ | 2 | ||
| Maximum Body-Diode Continuous Current | IS | 130 | A | 2 | |||
| Gate Resistance | RG | 2.8 | Ω | f=1MHz | 2 | ||
| Input Capacitance | Ciss | 4251 | pF | VDS=50V, VGS=0V, f=1.0MHz | 2 | ||
| Output Capacitance | Coss | 692 | pF | VDS=50V, VGS=0V, f=1.0MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 26 | pF | VDS=50V, VGS=0V, f=1.0MHz | 2 | ||
| Total Gate Charge | Qg | 69 | nC | VDS=50V, VGS=10V, ID=20A | 2 | ||
| Gate-Source Charge | Qgs | 24 | nC | VDS=50V, VGS=10V, ID=20A | 2 | ||
| Gate-Drain Charge | Qgd | 18 | nC | VDS=50V, VGS=10V, ID=20A | 2 | ||
| Gate Plateau Voltage | Vplateau | 5.6 | V | VDS=50V, VGS=10V, ID=20A | 2 | ||
| Turn-On Delay Time | td(on) | 12 | nS | VGS=10V, VDS=50V, RL=2.5Ω, RG=3.0Ω | 2 | ||
| Rise Time | tr | 23 | nS | VGS=10V, VDS=50V, RL=2.5Ω, RG=3.0Ω | 2 | ||
| Turn-Off Delay Time | td(off) | 37 | nS | VGS=10V, VDS=50V, RL=2.5Ω, RG=3.0Ω | 2 | ||
| Fall Time | tf | 16 | nS | VGS=10V, VDS=50V, RL=2.5Ω, RG=3.0Ω | 2 | ||
| Reverse Recovery Time | Trr | 65 | nS | IS=20A, di/dt=100A/us, TJ=25℃ | 2 | ||
| Reverse Recovery Charge | Qrr | 126 | nC | IS=20A, di/dt=100A/us, TJ=25℃ | 2 |
CAD (KiCad official)
- Symbol:
SP010N04AGHTD - Footprint:
Package_TO_SOT_SMD:TO-263-2 - 3D model: TO-263 (KiCad packages3D, STEP)
- 3D model files:
sp010n04aghtd-etched.step/sp010n04aghtd-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sp010n04aghtd.step/sp010n04aghtd.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Siliup datasheet (8 pp, sha256
09c7baa8ba7938c6, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).