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SN74HC374D

lingxingic · Flip Flops · SOP-20-300mil

SN74HC374D from lingxingic, in a SOP-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OE input Active-low output enable; when OE is high the Q0-Q7 outputs are forced to high impedance, and OE changes do not affect the flip-flop state.
2 Q0 tri_state Three-state non-inverted data output of flip-flop 0, high impedance when OE is high.
3 D0 input Data input to flip-flop 0, stored on the rising edge of CP; input has internal clamp diodes allowing voltages above VCC through a series resistor.
4 D1 input Data input to flip-flop 1, stored on the rising edge of CP; input has internal clamp diodes allowing voltages above VCC through a series resistor.
5 Q1 tri_state Three-state non-inverted data output of flip-flop 1, high impedance when OE is high.
6 Q2 tri_state Three-state non-inverted data output of flip-flop 2, high impedance when OE is high.
7 D2 input Data input to flip-flop 2, stored on the rising edge of CP; input has internal clamp diodes allowing voltages above VCC through a series resistor.
8 D3 input Data input to flip-flop 3, stored on the rising edge of CP; input has internal clamp diodes allowing voltages above VCC through a series resistor.
9 Q3 tri_state Three-state non-inverted data output of flip-flop 3, high impedance when OE is high.
10 GND power_in Ground reference, 0 V.
11 CP input Clock input; data is latched on the low-to-high (rising) edge, with setup and hold times per the AC characteristics.
12 Q4 tri_state Three-state non-inverted data output of flip-flop 4, high impedance when OE is high.
13 D4 input Data input to flip-flop 4, stored on the rising edge of CP; input has internal clamp diodes allowing voltages above VCC through a series resistor.
14 D5 input Data input to flip-flop 5, stored on the rising edge of CP; input has internal clamp diodes allowing voltages above VCC through a series resistor.
15 Q5 tri_state Three-state non-inverted data output of flip-flop 5, high impedance when OE is high.
16 Q6 tri_state Three-state non-inverted data output of flip-flop 6, high impedance when OE is high.
17 D6 input Data input to flip-flop 6, stored on the rising edge of CP; input has internal clamp diodes allowing voltages above VCC through a series resistor.
18 D7 input Data input to flip-flop 7, stored on the rising edge of CP; input has internal clamp diodes allowing voltages above VCC through a series resistor.
19 Q7 tri_state Three-state non-inverted data output of flip-flop 7, high impedance when OE is high.
20 VCC power_in Supply voltage; recommended range 2.0 V to 6.0 V for SN74HC374 and 4.5 V to 5.5 V for SN74HCT374.

Key specifications

Parameter Value
Manufacturer lingxingic
Package SOP-20-300mil
Category Logic
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC -0.5 7 V 6
Input clamp current IIK -20 20 mA VI<-0.5V 或 VI>VCC+0.5V 6
Output clamp current IOK -20 20 mA VO<-0.5V 或 VO>VCC+0.5V 6
Output current IO -35 35 mA -0.5V<VO<VCC+0.5V 6
Supply current ICC 70 mA 6
Ground current IGND -70 mA 6
Storage temperature Tstg -65 150 ℃ 6
Total power dissipation Ptot 500 mW 6
Soldering temperature TL 260 ℃ 10秒; SOP/TSSOP/SOP(M) 6
Supply voltage VCC 2 5 6 V SN74HC374 7
Input voltage VI 0 V SN74HC374; max printed as VCC 7
Output voltage VO 0 V SN74HC374; max printed as VCC 7
Input rise and fall rate Δt/ΔV 625 ns/V VCC=2.0V 7
Input rise and fall rate Δt/ΔV 1.67 139 ns/V VCC=4.5V 7
Input rise and fall rate Δt/ΔV 83 ns/V VCC=6.0V 7
Operating ambient temperature Tamb -40 125 ℃ SN74HC374 7
High-level input voltage VIH 1.5 V Tamb=-40℃~+125℃; VCC=2.0V 9
High-level input voltage VIH 3.15 V Tamb=-40℃~+125℃; VCC=4.5V 9
High-level input voltage VIH 4.2 V Tamb=-40℃~+125℃; VCC=6.0V 9
Low-level input voltage VIL 0.5 V Tamb=-40℃~+125℃; VCC=2.0V 9
Low-level input voltage VIL 1.35 V Tamb=-40℃~+125℃; VCC=4.5V 9
Low-level input voltage VIL 1.8 V Tamb=-40℃~+125℃; VCC=6.0V 9
High-level output voltage VOH 1.9 V Tamb=-40℃~+125℃; VI=VIH或VIL; IO=-20uA; VCC=2.0V 9
High-level output voltage VOH 4.4 V Tamb=-40℃~+125℃; VI=VIH或VIL; IO=-20uA; VCC=4.5V 9
High-level output voltage VOH 5.9 V Tamb=-40℃~+125℃; VI=VIH或VIL; IO=-20uA; VCC=6.0V 9
High-level output voltage VOH 3.7 V Tamb=-40℃~+125℃; VI=VIH或VIL; IO=-6.0mA; VCC=4.5V 9
High-level output voltage VOH 5.2 V Tamb=-40℃~+125℃; VI=VIH或VIL; IO=-7.8mA; VCC=6.0V 9
Low-level output voltage VOL 0.1 V Tamb=-40℃~+125℃; VI=VIH或VIL; IO=20uA; VCC=2.0V 9
Low-level output voltage VOL 0.4 V Tamb=-40℃~+125℃; VI=VIH或VIL; IO=6.0mA; VCC=4.5V 9
Input leakage current II -1 1 uA Tamb=-40℃~+125℃; VI=VCC或GND; VCC=6.0V 9
Off-state output current IOZ -10 10 uA Tamb=-40℃~+125℃; VI=VIH或VIL; VCC=6.0V; VO=VCC或GND 9
Quiescent supply current ICC 160 uA Tamb=-40℃~+125℃; VI=VCC或GND; IO=0A; VCC=6.0V 9
CP to Qn propagation delay tpd 250 ns Tamb=-40℃~+125℃; 见图6; VCC=2.0V 13
CP to Qn propagation delay tpd 50 ns Tamb=-40℃~+125℃; 见图6; VCC=4.5V 13
CP to Qn propagation delay tpd 43 ns Tamb=-40℃~+125℃; 见图6; VCC=6.0V 13
OE to Qn enable time ten 225 ns Tamb=-40℃~+125℃; 见图7; VCC=2.0V 13
OE to Qn enable time ten 45 ns Tamb=-40℃~+125℃; 见图7; VCC=4.5V 13
OE to Qn enable time ten 38 ns Tamb=-40℃~+125℃; 见图7; VCC=6.0V 13
OE to Qn disable time tdis 225 ns Tamb=-40℃~+125℃; 见图7; VCC=2.0V 13
OE to Qn disable time tdis 45 ns Tamb=-40℃~+125℃; 见图7; VCC=4.5V 13
OE to Qn disable time tdis 38 ns Tamb=-40℃~+125℃; 见图7; VCC=6.0V 13
Qn output transition time tt 90 ns Tamb=-40℃~+125℃; Qn output; 见图6; VCC=2.0V 13
Qn output transition time tt 18 ns Tamb=-40℃~+125℃; Qn output; 见图6; VCC=4.5V 13
Qn output transition time tt 15 ns Tamb=-40℃~+125℃; Qn output; 见图6; VCC=6.0V 13
CP pulse width tW 120 ns Tamb=-40℃~+125℃; CP高电平或低电平; 见图6; VCC=2.0V 13
CP pulse width tW 24 ns Tamb=-40℃~+125℃; CP高电平或低电平; 见图6; VCC=4.5V 13
CP pulse width tW 20 ns Tamb=-40℃~+125℃; CP高电平或低电平; 见图6; VCC=6.0V 13
Dn to CP setup time tsu 90 ns Tamb=-40℃~+125℃; 见图6; VCC=2.0V 13
Dn to CP setup time tsu 18 ns Tamb=-40℃~+125℃; 见图6; VCC=4.5V 13
Dn to CP setup time tsu 15 ns Tamb=-40℃~+125℃; 见图6; VCC=6.0V 13
Dn to CP hold time th 5 ns Tamb=-40℃~+125℃; 见图6; VCC=2.0V 13
Maximum clock frequency fmax 4 MHz Tamb=-40℃~+125℃; CP input; 见图6; VCC=2.0V 13
Maximum clock frequency fmax 20 MHz Tamb=-40℃~+125℃; CP input; 见图6; VCC=4.5V 13
Maximum clock frequency fmax 24 MHz Tamb=-40℃~+125℃; CP input; 见图6; VCC=6.0V 13

CAD (KiCad official)

  • Symbol: SN74HC374D
  • Footprint: Package_SO:SOP-20_7.5x12.8mm_P1.27mm
  • 3D model: SOP-20-300mil, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 2.65 mm nominal SOIC height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: sn74hc374d-etched.step / sn74hc374d-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn74hc374d.step / sn74hc374d.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: lingxingic datasheet (21 pp, sha256 e6d21ba7a671b3e3, retrieved 2026-10-21, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF