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SN65MLVD204BDR

Texas Instruments · Pre-ordered Chips · SOIC-8

SN65MLVD204BDR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 R output Receiver output pin.
2 RE input Receiver enable pin; High = Disable, Low = Enable.
3 DE input Driver enable pin; High = Enable, Low = Disable.
4 D input Driver input pin.
5 GND power_in Power supply ground.
6 A bidirectional Differential I/O bus terminal A; voltage at any bus terminal is limited to -1.4 V to 3.8 V per the recommended operating conditions.
7 B bidirectional Differential I/O bus terminal B; voltage at any bus terminal is limited to -1.4 V to 3.8 V per the recommended operating conditions.
8 VCC power_in Power supply pin, 3.3 V nominal (3 V to 3.6 V recommended).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage, VCC VCC 3 3.3 3.6 V 6
High-level input voltage VIH 2 V 6
Low-level input voltage VIL 0 0.8 V 6
Voltage at any bus terminal VA or VB VA, VB -1.4 3.8 V 6
Differential load resistance RL 30 50 Ω 6
Signaling rate 1/tUI 100 Mbps 6
Operating free-air temperature for D package TA -40 85 °C 6
Supply voltage range VCC -0.5 4 V 6
Input voltage range D, DE, RE -0.5 4 V 6
Input voltage range A, B -1.8 4 V 6
Output voltage range R -0.3 4 V 6
Output voltage range A, B -1.8 4 V 6
Storage temperature Tstg -65 150 °C 6
Supply current, driver only ICC 13 22 mA RE and DE at VCC, RL = 50 Ω, All others open 7
Supply current, both disabled ICC 1 4 mA RE at VCC, DE at 0 V, RL = No Load, All others open 7
Supply current, both enabled ICC 16 24 mA RE at 0 V, DE at VCC, RL = 50 Ω, All others open 7
Supply current, receiver only ICC 4 13 mA RE at 0 V, DE at 0 V, All others open 7
Device power dissipation PD 100 mW RL = 50 Ω, Input to D is a 50-MHz 50% duty cycle square wave, DE = high, RE = low, TA = 85°C 7
Differential output voltage magnitude /VAB/ 480 650 mV See Figure 7-2 7
Change in differential output voltage magnitude between logic states Δ/VAB/ -50 50 mV 7
Steady-state common-mode output voltage VOS(SS) 0.8 1.2 V See Figure 7-3 7
Change in steady-state common-mode output voltage between logic states ΔVOS(SS) -50 50 mV 7
Peak-to-peak common-mode output voltage VOS(PP) 150 mV 7
Maximum steady-state open-circuit output voltage A VA(OC) 0 2.4 V See Figure 7-7 7
Maximum steady-state open-circuit output voltage B VB(OC) 0 2.4 V 7
Voltage overshoot, low-to-high level output VP(H) 1.2 VSS See Figure 7-5 7
Voltage overshoot, high-to-low level output VP(L) -0.2 VSS See Figure 7-5 7
High-level input current (D, DE) IIH 0 10 µA VIH = 2 V to VCC 7
Low-level input current (D, DE) IIL 0 10 µA VIL = GND to 0.8 V 7
Differential short-circuit output current magnitude /IOS/ 24 mA See Figure 7-4 7
High-level output voltage (R) VOH 2.4 V IOH = -8 mA 8
Low-level output voltage (R) VOL 0.4 V IOL = 8 mA 8
High-level input current (RE) IIH -10 0 µA VIH = 2 V to VCC 8
Low-level input current (RE) IIL -10 0 µA VIL = GND to 0.8 V 8
High-impedance output current (R) IOZ -10 15 µA VO = 0 V or 3.6 V 8
Receiver or transceiver with driver disabled input current IA IA 0 32 µA VA = 3.8 V, VB = 1.2 V 8
Receiver or transceiver with driver disabled input current IA IA -20 20 µA VA = 0 V or 2.4 V, VB = 1.2 V 8
Receiver or transceiver with driver disabled input current IA IA -32 0 µA VA = -1.4 V, VB = 1.2 V 8
Receiver or transceiver with driver disabled differential input current (IA, IB) IAB -4 4 µA VA = VB, 1.4 ≤ VA ≤ 3.8 V 8
Transceiver with driver disabled input capacitance CA CA 12 pF VB = 1.2 V 8
Transceiver with driver disabled input capacitance CB CB 12 pF VA = 1.2 V 8
Transceiver with driver disabled differential input capacitance CAB 7 pF 8
Transceiver with driver disabled input capacitance balance (CA/CB) CA/B 0.99 1.01 8
Propagation delay time, low-to-high-level output (driver) tpLH 2 2.5 3.5 ns See Figure 7-5 8
Propagation delay time, high-to-low-level output (driver) tpHL 2 2.5 3.5 ns See Figure 7-5 8
Differential output signal rise time tr 2 ns 9
Differential output signal fall time tf 2 ns 9
Pulse skew (/tpHL, tpLH/) tsk(p) 150 ps 9
Part-to-part skew tsk(pp) 0.9 ns 9
Propagation delay time, low-to-high-level output (receiver) tPLH 2 6 10 ns CL = 15 pF, See Figure 7-10 9
Propagation delay time, high-to-low-level output (receiver) tPHL 2 6 10 ns CL = 15 pF, See Figure 7-10 9
Junction-to-ambient thermal resistance (D SOIC) RθJA 112.2 °C/W 6
Junction-to-case (top) thermal resistance (D SOIC) RθJC(top) 56.7 °C/W 6
Junction-to-board thermal resistance (D SOIC) RθJB 52.8 °C/W 6
Junction-to-top characterization parameter (D SOIC) ψJT 10.3 °C/W 6
Junction-to-board characterization parameter (D SOIC) ψJB 52.3 °C/W 6

CAD (KiCad official)

  • Symbol: SN65MLVD204BDR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: sn65mlvd204bdr-etched.step / sn65mlvd204bdr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn65mlvd204bdr.step / sn65mlvd204bdr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (54 pp, sha256 71566c73a87ab2a8, retrieved 2026-11-02, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF