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SN65HVD72EIM

Public Made by Adom

by adom

HGSEMI RS-485 / RS-422 ICs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SN65HVD72EIM

HGSEMI · RS-485 / RS-422 ICs · SOP-8

SN65HVD72EIM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: with RE low, RO is high when A-B is at least 200mV and low when A-B is at most -200mV (the datasheet's function table lists the -50mV threshold for RO high, with RO high-impedance when RE is high).
2 RE input Receiver output enable, active low: RO is enabled when RE is low and high-impedance when RE is high; RE high with DE low puts the device into low-power shutdown.
3 DE input Driver output enable: the driver outputs are active when DE is high and high-impedance when DE is low; DE has a hot-plug input structure and DE low with RE high enters low-power shutdown.
4 DI input Driver input: with DE high, a low on DI drives output A low and B high, and a high on DI drives A high and B low.
5 GND power_in Ground reference for the device.
6 A bidirectional Non-inverting receiver input and non-inverting driver output on the RS-485 bus; the bus pins are ESD protected to ±16kV (IEC 61000-4-2 contact and air-gap, ±16kV HBM).
7 B bidirectional Inverting receiver input and inverting driver output on the RS-485 bus; the bus pins are ESD protected to ±16kV (IEC 61000-4-2 contact and air-gap, ±16kV HBM).
8 VCC power_in Positive supply: 3.15V ≤ VCC ≤ 3.45V, with a 0.1µF capacitor to ground recommended.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (absolute maximum) VCC 6 V 4
Control input voltage RE, DE -0.3 6 V 4
Driver input voltage DI -0.3 6 V 4
Driver output voltage A,B -7 12 V 4
Receiver input voltage A,B -7 12 V 4
Receiver output voltage RO -0.3 V Printed max is VCC+0.3 V (not numeric) 4
Continuous power dissipation, 8SOP 500 mW TA=+70℃ 4
Operating temperature range, SN65HVDxxEI (industrial) -40 85 ℃ SN65HVDxxEI 4
Storage temperature -65 150 ℃ 4
Lead temperature (soldering) TLEAD 260 ℃ Soldering 10 s 4
Supply voltage (recommended) VCC 3.15 3.45 V 4
Differential driver output voltage, RS-422 load VOD 2 V Fig 1, RL=100Ω (RS-422); printed max is VCC (not numeric) 4
Differential driver output voltage, RS-485 load VOD 1.5 V Fig 1, RL=54Ω (RS-485); printed max is VCC (not numeric) 4
Change in magnitude of differential driver output voltage ΔVOD 0.2 V Fig 1, RL=100Ω or RL=54Ω 4
Driver common-mode output voltage VOC 3 V Fig 1, RL=100Ω or RL=54Ω 4
Change in magnitude of common-mode output voltage ΔVOC 0.2 V Fig 1, RL=100Ω or RL=54Ω 4
Input high voltage VIH 2 V DE, DI, garbled pin (RE) 5
Input low voltage VIL 0.8 V DE, DI 5
Input current IIN -1 1 μA DE, DI, garbled pin (RE) 5
Input current (A, B), full duplex IA, IB 125 μA DE=GND, VCC=GND or VCC, VIN=12V 5
Input current (A, B), full duplex IA, IB -75 μA DE=GND, VCC=GND or VCC, VIN=-7V 5
Output leakage current (Y, Z), full duplex IO 125 μA DE=GND, VCC=GND or VCC, VIN=12V 5
Output leakage current (Y, Z), full duplex IO -100 μA DE=GND, VCC=GND or VCC, VIN=-7V 5
Driver short-circuit output current IOSD 250 mA 0≤VOUT≤12V 5
Driver short-circuit output current IOSD -250 mA -7≤VOUT≤VCC 5
Driver short-circuit foldback output current IOSDF 20 mA VCC-1V≤VOUT≤VCC+0.5V 5
Driver short-circuit foldback output current IOSDF -20 mA -0.5V≤VOUT≤+1V 5
Receiver differential threshold voltage VTH -200 -125 -50 mV -7V≤VCM≤12V 5
Receiver output low voltage VOL 0.4 V IO=4mA, VID=-200mV 5
Receiver tri-state output current IOZR -1 1 μA 0≤VO≤VCC 5
Receiver input resistance RIN 96 kΩ -7V≤VCM≤12V 5
Receiver output short-circuit current IOSR 7 95 mA 0V≤VRO≤VCC; printed as ±7 and ±95 mA 5
Supply current, no load, DE=VCC Icc 400 900 μA No load; RE=VCC; DI=GND or VCC; DE=VCC 6
Supply current, no load, DE=GND Icc 330 600 μA No load; RE=VCC; DI=GND or VCC; DE=GND 6
Supply current, no load, DE=VCC (RE=GND) Icc 400 1000 μA No load; RE=GND; DI=GND or VCC; DE=VCC 6
Supply current, no load, DE=GND (RE=GND) Icc 330 800 μA No load; RE=GND; DI=GND or VCC; DE=GND 6
Standby mode supply current ISHDN 0.05 10 μA DE=GND, RE=VCC 6
Driver propagation delay, low-to-high tDPLH 500 2600 ns Fig 2 and 5, RL=54Ω, CL=50pF 6
Driver propagation delay, high-to-low tDPHL 500 2600 ns Fig 2 and 5, RL=54Ω, CL=50pF 6
Driver output skew /tDPLH-tDPHL/ -200 200 ns Fig 2 and 5, RL=54Ω, CL=50pF 6
Driver rise and fall time tDR, tDF 650 2500 ns Fig 2 and 5, RL=54Ω, CL=50pF 6
Maximum data rate, driver (115 kbps part) fMAX 115 kbps 6
Driver enable to output high tDZH 3500 ns Fig 3 and 6, CL=100pF, S3 closed 6
Driver enable to output low tDZL 3500 ns Fig 3 and 6, CL=100pF, S2 closed 7
Driver low to disable time tDLZ 100 ns Fig 3 and 6, CL=15pF, S2 closed 7
Driver high to disable time tDHZ 100 ns Fig 3 and 6, CL=15pF, S3 closed 7
Driver enable from standby to output high tDZH(SHDN) 5500 ns Fig 3 and 6, CL=15pF, S3 closed 7
Driver enable from standby to output low tDZL(SHDN) 5500 ns Fig 3 and 6, CL=15pF, S2 closed 7
Standby time, driver tSHDN 50 350 700 ns Note 4 7
Receiver propagation delay tRPLH, tRPHL 200 ns Fig 7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns 7
Receiver output skew /tRPLH-tRPHL/ -30 30 ns Fig 7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns 7
Maximum data rate, receiver (115 kbps part) fMAX 115 kbps 7
Receiver enable to output low tRZL 50 ns Fig 4 and 9, S1=-1.5V, S2 to VCC 7
Receiver enable to output high tRZH 50 ns Fig 4 and 9, S1=+1.5V, S2 to GND 7
Receiver low to disable time tRLZ 50 ns Fig 4 and 9, S1=-1.5V, S2 to VCC 7
Receiver high to disable time tRHZ 50 ns Fig 4 and 9, S1=+1.5V, S2 to GND 7
Receiver enable from standby to output high tRZH(SHDN) 5500 ns Fig 4 and 9, S1=-1.5V, S2 to VCC 7
Receiver enable from standby to output low tRZL(SHDN) 5500 ns Fig 4 and 9, S1=+1.5V, S2 to GND 7
Standby time, receiver tSHDN 50 700 ns Note 4 7

CAD (KiCad official)

  • Symbol: SN65HVD72EIM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: sn65hvd72eim-etched.step / sn65hvd72eim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn65hvd72eim.step / sn65hvd72eim.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (20 pp, sha256 81ed86cf3caebd1f, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF