component
SMUN5114DW1T1G
Public Made by Adomby adom
onsemi Digital Transistors, SOT-363-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 7d ago |
| viewers | 7d ago |
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| page.json | 7d ago |
| README.md | 7d ago |
| smun5114dw1t1g-etched.glb | 7d ago |
| smun5114dw1t1g-etched.step | 7d ago |
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SMUN5114DW1T1G
onsemi · Digital Transistors · SOT-363-6
SMUN5114DW1T1G from onsemi, in a SOT-363-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | E2 | passive | Emitter of transistor Q2 in the dual bias resistor transistor (BRT) network, with Q2's monolithic base resistor (R1 = 10 kΩ) and base-emitter resistor (R2 = 47 kΩ) integrated in the package. |
| 2 | B2 | passive | Base (input) of transistor Q2, connected to the internal series base resistor R1 of the bias network. |
| 3 | C1 | passive | Collector of transistor Q1 in the dual BRT network; common maximum ratings for Q1 and Q2 are VCEO 50 Vdc and IC 100 mAdc continuous. |
| 4 | E1 | passive | Emitter of transistor Q1 in the dual BRT network, with its internal bias resistors integrated in the package. |
| 5 | B1 | passive | Base (input) of transistor Q1, connected to the internal series base resistor R1 of the bias network. |
| 6 | C2 | passive | Collector of transistor Q2 in the dual BRT network; common maximum ratings for Q1 and Q2 are VCEO 50 Vdc and IC 100 mAdc continuous. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOT-363-6 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector−Base Cutoff Current | ICBO | 100 | nAdc | VCB = 50 V, IE = 0 | 3 | ||
| Collector−Emitter Cutoff Current | ICEO | 500 | nAdc | VCE = 50 V, IB = 0 | 3 | ||
| Emitter−Base Cutoff Current | IEBO | 0.2 | mAdc | VEB = 6.0 V, IC = 0 | 3 | ||
| Collector−Base Breakdown Voltage | V(BR)CBO | 50 | Vdc | IC = 10 A, IE = 0 | 3 | ||
| Collector−Emitter Breakdown Voltage | V(BR)CEO | 50 | Vdc | IC = 2.0 mA, IB = 0 | 3 | ||
| DC Current Gain | hFE | 80 | 140 | IC = 5.0 mA, VCE = 10 V | 3 | ||
| Collector−Emitter Saturation Voltage | VCE(sat) | 0.25 | Vdc | IC = 10 mA, IB = 0.3 mA | 3 | ||
| Input Resistor | R1 | 7 | 10 | 13 | k | 3 | |
| Resistor Ratio | R1/R2 | 0.17 | 0.21 | 0.25 | 3 | ||
| Output Voltage (on) | VOL | 0.2 | Vdc | VCC = 5.0 V, VB = 2.5 V, RL = 1.0 k | 3 | ||
| Output Voltage (off) | VOH | 4.9 | Vdc | VCC = 5.0 V, VB = 0.5 V, RL = 1.0 k | 3 | ||
| Collector−Base Voltage | VCBO | 50 | Vdc | TA = 25°C, common for Q1 and Q2 | 1 | ||
| Collector−Emitter Voltage | VCEO | 50 | Vdc | TA = 25°C, common for Q1 and Q2 | 1 | ||
| Collector Current − Continuous | IC | 100 | mAdc | TA = 25°C, common for Q1 and Q2 | 1 | ||
| Input Forward Voltage | VIN(fwd) | 40 | Vdc | TA = 25°C, common for Q1 and Q2 | 1 | ||
| Input Reverse Voltage | VIN(rev) | 6 | Vdc | TA = 25°C, common for Q1 and Q2 | 1 | ||
| Total Device Dissipation, one junction heated | PD | 187 | mW | TA = 25°C (Note 1, FR-4 @ Minimum Pad) | 2 | ||
| Total Device Dissipation, one junction heated | PD | 256 | mW | TA = 25°C (Note 2, FR-4 @ 1.0 x 1.0 Inch Pad) | 2 | ||
| Derate above 25°C, one junction heated | 1.5 | mW/°C | Note 1, FR-4 @ Minimum Pad | 2 | |||
| Derate above 25°C, one junction heated | 2 | mW/°C | Note 2, FR-4 @ 1.0 x 1.0 Inch Pad | 2 | |||
| Thermal Resistance, Junction to Ambient, one junction heated | RJA | 670 | °C/W | Note 1, FR-4 @ Minimum Pad | 2 | ||
| Thermal Resistance, Junction to Ambient, one junction heated | RJA | 490 | °C/W | Note 2, FR-4 @ 1.0 x 1.0 Inch Pad | 2 | ||
| Total Device Dissipation, both junctions heated | PD | 250 | mW | Both junctions heated (Note 3); TA = 25°C (Note 1) | 2 | ||
| Total Device Dissipation, both junctions heated | PD | 385 | mW | Both junctions heated (Note 3); TA = 25°C (Note 2) | 2 | ||
| Derate above 25°C, both junctions heated | 2 | mW/°C | Both junctions heated (Note 3); Note 1 | 2 | |||
| Derate above 25°C, both junctions heated | 3 | mW/°C | Both junctions heated (Note 3); Note 2 | 2 | |||
| Thermal Resistance, Junction to Ambient, both junctions heated | RJA | 493 | °C/W | Both junctions heated (Note 3); Note 1 | 2 | ||
| Thermal Resistance, Junction to Ambient, both junctions heated | RJA | 325 | °C/W | Both junctions heated (Note 3); Note 2 | 2 | ||
| Thermal Resistance, Junction to Lead, both junctions heated | RJL | 188 | °C/W | Both junctions heated (Note 3); Note 1 | 2 | ||
| Thermal Resistance, Junction to Lead, both junctions heated | RJL | 208 | °C/W | Both junctions heated (Note 3); Note 2 | 2 | ||
| Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 2 | ||
| Resistor R2 nominal value (from title) | R2 | 47 | k | 1 |
CAD (KiCad official)
- Symbol:
SMUN5114DW1T1G - Footprint:
Package_TO_SOT_SMD:SOT-363_SC-70-6 - 3D model: SOT-363-6 (KiCad packages3D, STEP)
- 3D model files:
smun5114dw1t1g-etched.step/smun5114dw1t1g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smun5114dw1t1g.step/smun5114dw1t1g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (11 pp, sha256
97d44ee0af9229e2, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).