# SMC30J58CA

**STMicroelectronics** · ESD And Surge Protection (TVS/ESD) · SMC

SMC30J58CA from STMicroelectronics, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | SMC |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse leakage current at 25 °C | IRM |  |  | 0.2 | µA | at VRM = 58 V, 25 °C | 3 |
| Reverse leakage current at 85 °C | IRM |  |  | 1 | µA | at VRM = 58 V, 85 °C | 3 |
| Breakdown voltage | VBR | 64.6 | 68 | 71.4 | V | at IR = 1 mA | 3 |
| Clamping voltage, 10/1000 µs surge | VCL |  |  | 93.6 | V | 10/1000 µs, IPP = 32 A | 3 |
| Peak pulse current, 10/1000 µs | IPP |  |  | 32 | A | 10/1000 µs | 3 |
| Dynamic resistance, 10/1000 µs | RD |  |  | 694 | mΩ | 10/1000 µs | 3 |
| Clamping voltage, 8/20 µs surge | VCL |  |  | 121 | V | 8/20 µs, IPP = 325 A | 3 |
| Peak pulse current, 8/20 µs | IPP |  |  | 325 | A | 8/20 µs | 3 |
| Dynamic resistance, 8/20 µs | RD |  |  | 153 | mΩ | 8/20 µs | 3 |
| Peak pulse voltage (ESD, IEC 61000-4-2 contact discharge) | VPP |  |  | 30 | kV | IEC 61000-4-2, C = 150 pF, R = 330 Ω, contact discharge | 2 |
| Peak pulse voltage (ESD, IEC 61000-4-2 air discharge) | VPP |  |  | 30 | kV | IEC 61000-4-2, C = 150 pF, R = 330 Ω, air discharge | 2 |
| Peak pulse power dissipation | PPP |  |  | 3000 | W | Tj initial = Tamb | 2 |
| Storage temperature range | Tstg | -65 |  | 175 | °C |  | 2 |
| Operating junction temperature range | Tj | -55 |  | 175 | °C |  | 2 |
| Maximum lead temperature for soldering | TL |  |  | 260 | °C | during 10 s | 2 |
| Temperature coefficient of breakdown voltage | αT |  | 10.4 |  | 10-4/°C | VBR temperature coefficient, per note 1 (VBR at Tj = VBR at 25 °C × (1 + αT × (Tj − 25))) | 3 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | • Lead finishing: matte tin plating Complies with the following standards | 1 |

## CAD (KiCad official)

- Symbol: `SMC30J58CA`
- Footprint: `Diode_SMD:D_SMC`
- 3D model: SMC (KiCad packages3D, STEP)
- 3D model files: `smc30j58ca-etched.step` / `smc30j58ca-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smc30j58ca.step` / `smc30j58ca.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [STMicroelectronics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8604309737999507456) (13 pp, sha256 `cc1a4a76aad46747`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smc30j58ca-datasheet.pdf)