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SMC30J58CA

STMicroelectronics · ESD And Surge Protection (TVS/ESD) · SMC

SMC30J58CA from STMicroelectronics, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SMC
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse leakage current at 25 °C IRM 0.2 µA at VRM = 58 V, 25 °C 3
Reverse leakage current at 85 °C IRM 1 µA at VRM = 58 V, 85 °C 3
Breakdown voltage VBR 64.6 68 71.4 V at IR = 1 mA 3
Clamping voltage, 10/1000 µs surge VCL 93.6 V 10/1000 µs, IPP = 32 A 3
Peak pulse current, 10/1000 µs IPP 32 A 10/1000 µs 3
Dynamic resistance, 10/1000 µs RD 694 mΩ 10/1000 µs 3
Clamping voltage, 8/20 µs surge VCL 121 V 8/20 µs, IPP = 325 A 3
Peak pulse current, 8/20 µs IPP 325 A 8/20 µs 3
Dynamic resistance, 8/20 µs RD 153 mΩ 8/20 µs 3
Peak pulse voltage (ESD, IEC 61000-4-2 contact discharge) VPP 30 kV IEC 61000-4-2, C = 150 pF, R = 330 Ω, contact discharge 2
Peak pulse voltage (ESD, IEC 61000-4-2 air discharge) VPP 30 kV IEC 61000-4-2, C = 150 pF, R = 330 Ω, air discharge 2
Peak pulse power dissipation PPP 3000 W Tj initial = Tamb 2
Storage temperature range Tstg -65 175 °C 2
Operating junction temperature range Tj -55 175 °C 2
Maximum lead temperature for soldering TL 260 °C during 10 s 2
Temperature coefficient of breakdown voltage αT 10.4 10-4/°C VBR temperature coefficient, per note 1 (VBR at Tj = VBR at 25 °C × (1 + αT × (Tj − 25))) 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Lead finishing: matte tin plating Complies with the following standards 1

CAD (KiCad official)

  • Symbol: SMC30J58CA
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC (KiCad packages3D, STEP)
  • 3D model files: smc30j58ca-etched.step / smc30j58ca-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smc30j58ca.step / smc30j58ca.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (13 pp, sha256 cc1a4a76aad46747, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF