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SMBJ3V3HE3_B

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Vishay Intertech ESD And Surge Protection (TVS/ESD), DO-214AA(SMB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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SMBJ3V3HE3_B

Vishay Intertech · ESD And Surge Protection (TVS/ESD) · DO-214AA(SMB)

SMBJ3V3HE3_B from Vishay Intertech, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package DO-214AA(SMB)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum reverse leakage current at VWM IR 200 µA At VWM (stand-off voltage) 2
Maximum clamping voltage at IPP VC 7.3 V At IPP = 50 A, 10/1000 μs waveform 2
Maximum clamping voltage at IPPM VC 10.3 V At IPPM = 200 A, 8/20 μs waveform 2
Breakdown voltage VBR 4.1 V At IT = 1.0 mA 2
Stand-off voltage VWM 3.3 V 2
Typical temperature coefficient of VBR -5.3 10-4/°C 2
Typical junction capacitance CJ 5200 pF At 0 V, min. 1 MHz 2
Peak pulse power dissipation PPPM 600 W 10/1000 μs; non-repetitive per fig. 1; TA = 25 °C 1
Peak pulse current, 10/1000 μs waveform IPP 50 A 10/1000 μs waveform (fig. 1) 1
Peak pulse current, 8/20 μs waveform IPPM 200 A 8/20 μs waveform (fig. 1) 1
Peak forward surge current IFSM 60 A 8.3 ms single half sine-wave 1
Power dissipation PD 5 W On infinite heatsink, TA = 75 °C 1
Operating junction and storage temperature range TJ, TSTG -65 175 °C 1
Typical thermal resistance, junction to lead RθJL 20 °C/W Mounted on 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pads to each terminal 2
Typical thermal resistance, junction to ambient RθJA 100 °C/W Mounted on the recommended PCB pad layout 2

CAD (KiCad official)

  • Symbol: SMBJ3V3HE3_B
  • Footprint: Diode_SMD:D_SMB
  • 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
  • 3D model files: smbj3v3he3-b-etched.step / smbj3v3he3-b-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smbj3v3he3-b.step / smbj3v3he3-b.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (5 pp, sha256 ef2e03c799736904, retrieved 2026-10-14, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF