component
SMBJ3V3HE3_B
Public Made by Adomby adom
Vishay Intertech ESD And Surge Protection (TVS/ESD), DO-214AA(SMB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSMBJ3V3HE3_B
Vishay Intertech · ESD And Surge Protection (TVS/ESD) · DO-214AA(SMB)
SMBJ3V3HE3_B from Vishay Intertech, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | DO-214AA(SMB) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum reverse leakage current at VWM | IR | 200 | µA | At VWM (stand-off voltage) | 2 | ||
| Maximum clamping voltage at IPP | VC | 7.3 | V | At IPP = 50 A, 10/1000 μs waveform | 2 | ||
| Maximum clamping voltage at IPPM | VC | 10.3 | V | At IPPM = 200 A, 8/20 μs waveform | 2 | ||
| Breakdown voltage | VBR | 4.1 | V | At IT = 1.0 mA | 2 | ||
| Stand-off voltage | VWM | 3.3 | V | 2 | |||
| Typical temperature coefficient of VBR | -5.3 | 10-4/°C | 2 | ||||
| Typical junction capacitance | CJ | 5200 | pF | At 0 V, min. 1 MHz | 2 | ||
| Peak pulse power dissipation | PPPM | 600 | W | 10/1000 μs; non-repetitive per fig. 1; TA = 25 °C | 1 | ||
| Peak pulse current, 10/1000 μs waveform | IPP | 50 | A | 10/1000 μs waveform (fig. 1) | 1 | ||
| Peak pulse current, 8/20 μs waveform | IPPM | 200 | A | 8/20 μs waveform (fig. 1) | 1 | ||
| Peak forward surge current | IFSM | 60 | A | 8.3 ms single half sine-wave | 1 | ||
| Power dissipation | PD | 5 | W | On infinite heatsink, TA = 75 °C | 1 | ||
| Operating junction and storage temperature range | TJ, TSTG | -65 | 175 | °C | 1 | ||
| Typical thermal resistance, junction to lead | RθJL | 20 | °C/W | Mounted on 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pads to each terminal | 2 | ||
| Typical thermal resistance, junction to ambient | RθJA | 100 | °C/W | Mounted on the recommended PCB pad layout | 2 |
CAD (KiCad official)
- Symbol:
SMBJ3V3HE3_B - Footprint:
Diode_SMD:D_SMB - 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files:
smbj3v3he3-b-etched.step/smbj3v3he3-b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smbj3v3he3-b.step/smbj3v3he3-b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Vishay Intertech datasheet (5 pp, sha256
ef2e03c799736904, retrieved 2026-10-14, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).