component
SMBJ33CA-TR
Public Made by Adomby adom
STMicroelectronics TVS, SMB(DO-214AA). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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SMBJ33CA-TR
STMicroelectronics · TVS · SMB(DO-214AA)
SMBJ33CA-TR from STMicroelectronics, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Bidirectional TVS terminal (no polarity) with 33 V stand-off (VRM), VBR 36.7 V min to 38.6 V max at 1 mA, and max VCL 53.3 V at 11.8 A (10/1000 µs). |
| 2 | A2 | passive | Second bidirectional TVS terminal (no polarity, interchangeable with the other terminal), clamping to 53.3 V max at 11.8 A (10/1000 µs) with 600 W peak pulse power in either direction. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | SMB(DO-214AA) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse leakage current | IRM | 0.2 | µA | at VRM, 25 °C | 3 | ||
| Reverse leakage current | IRM | 1 | µA | at VRM, 85 °C | 3 | ||
| Breakdown voltage | VBR | 36.7 | 38.6 | V | at IR = 1 mA | 3 | |
| Clamping voltage 10/1000 µs | VCL | 53.3 | V | 10/1000 µs, IPP = 11.8 A | 3 | ||
| Dynamic resistance 10/1000 µs | RD | 1.08 | Ω | 10/1000 µs | 3 | ||
| Clamping voltage 8/20 µs | VCL | 69.7 | V | 8/20 µs, IPP = 57 A | 3 | ||
| Dynamic resistance 8/20 µs | RD | 0.512 | Ω | 8/20 µs | 3 | ||
| Voltage temperature coefficient | αT | 10 | 10^-4/°C | 3 | |||
| Stand-off voltage | VRM | 33 | V | 3 | |||
| Peak pulse power dissipation | PPP | 600 | W | Tj initial = Tamb, Tamb = 25 °C | 2 | ||
| Operating junction temperature range | Tj | -55 | 150 | °C | 2 | ||
| Storage temperature range | Tstg | -65 | 150 | °C | 2 | ||
| Maximum lead temperature for soldering | TL | 260 | °C | during 10 s | 2 | ||
| Thermal resistance junction to leads | Rth(j-l) | 20 | °C/W | 2 | |||
| Thermal resistance junction to ambient | Rth(j-a) | 100 | °C/W | on printed circuit on recommended pad layout | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | versus copper surface under each lead (printed | 5 |
CAD (KiCad official)
- Symbol:
SMBJ33CA-TR - Footprint:
Diode_SMD:D_SMB - 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files:
smbj33ca-tr-etched.step/smbj33ca-tr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smbj33ca-tr.step/smbj33ca-tr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (11 pp, sha256
6d6fe330cf55be51, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SMBJ33CA-TR
**STMicroelectronics** · TVS · SMB(DO-214AA)
SMBJ33CA-TR from STMicroelectronics, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Bidirectional TVS terminal (no polarity) with 33 V stand-off (VRM), VBR 36.7 V min to 38.6 V max at 1 mA, and max VCL 53.3 V at 11.8 A (10/1000 µs). |
| 2 | A2 | passive | Second bidirectional TVS terminal (no polarity, interchangeable with the other terminal), clamping to 53.3 V max at 11.8 A (10/1000 µs) with 600 W peak pulse power in either direction. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | SMB(DO-214AA) |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse leakage current | IRM | | | 0.2 | µA | at VRM, 25 °C | 3 |
| Reverse leakage current | IRM | | | 1 | µA | at VRM, 85 °C | 3 |
| Breakdown voltage | VBR | 36.7 | | 38.6 | V | at IR = 1 mA | 3 |
| Clamping voltage 10/1000 µs | VCL | | | 53.3 | V | 10/1000 µs, IPP = 11.8 A | 3 |
| Dynamic resistance 10/1000 µs | RD | | | 1.08 | Ω | 10/1000 µs | 3 |
| Clamping voltage 8/20 µs | VCL | | | 69.7 | V | 8/20 µs, IPP = 57 A | 3 |
| Dynamic resistance 8/20 µs | RD | | | 0.512 | Ω | 8/20 µs | 3 |
| Voltage temperature coefficient | αT | | | 10 | 10^-4/°C | | 3 |
| Stand-off voltage | VRM | | 33 | | V | | 3 |
| Peak pulse power dissipation | PPP | | | 600 | W | Tj initial = Tamb, Tamb = 25 °C | 2 |
| Operating junction temperature range | Tj | -55 | | 150 | °C | | 2 |
| Storage temperature range | Tstg | -65 | | 150 | °C | | 2 |
| Maximum lead temperature for soldering | TL | | | 260 | °C | during 10 s | 2 |
| Thermal resistance junction to leads | Rth(j-l) | | | 20 | °C/W | | 2 |
| Thermal resistance junction to ambient | Rth(j-a) | | | 100 | °C/W | on printed circuit on recommended pad layout | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | | versus copper surface under each lead (printed | 5 |
## CAD (KiCad official)
- Symbol: `SMBJ33CA-TR`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files: `smbj33ca-tr-etched.step` / `smbj33ca-tr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smbj33ca-tr.step` / `smbj33ca-tr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [STMicroelectronics datasheet](https://www.st.com/resource/en/datasheet/smbj33ca-tr.pdf) (11 pp, sha256 `6d6fe330cf55be51`, retrieved 2026-10-22, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/smbj33ca-tr-datasheet.pdf)