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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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SMBJ33CA-TR

STMicroelectronics · TVS · SMB(DO-214AA)

SMBJ33CA-TR from STMicroelectronics, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Bidirectional TVS terminal (no polarity) with 33 V stand-off (VRM), VBR 36.7 V min to 38.6 V max at 1 mA, and max VCL 53.3 V at 11.8 A (10/1000 µs).
2 A2 passive Second bidirectional TVS terminal (no polarity, interchangeable with the other terminal), clamping to 53.3 V max at 11.8 A (10/1000 µs) with 600 W peak pulse power in either direction.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SMB(DO-214AA)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse leakage current IRM 0.2 µA at VRM, 25 °C 3
Reverse leakage current IRM 1 µA at VRM, 85 °C 3
Breakdown voltage VBR 36.7 38.6 V at IR = 1 mA 3
Clamping voltage 10/1000 µs VCL 53.3 V 10/1000 µs, IPP = 11.8 A 3
Dynamic resistance 10/1000 µs RD 1.08 Ω 10/1000 µs 3
Clamping voltage 8/20 µs VCL 69.7 V 8/20 µs, IPP = 57 A 3
Dynamic resistance 8/20 µs RD 0.512 Ω 8/20 µs 3
Voltage temperature coefficient αT 10 10^-4/°C 3
Stand-off voltage VRM 33 V 3
Peak pulse power dissipation PPP 600 W Tj initial = Tamb, Tamb = 25 °C 2
Operating junction temperature range Tj -55 150 °C 2
Storage temperature range Tstg -65 150 °C 2
Maximum lead temperature for soldering TL 260 °C during 10 s 2
Thermal resistance junction to leads Rth(j-l) 20 °C/W 2
Thermal resistance junction to ambient Rth(j-a) 100 °C/W on printed circuit on recommended pad layout 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper versus copper surface under each lead (printed 5

CAD (KiCad official)

  • Symbol: SMBJ33CA-TR
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: smbj33ca-tr-etched.step / smbj33ca-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smbj33ca-tr.step / smbj33ca-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (11 pp, sha256 6d6fe330cf55be51, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF