# SMAJ40CAE3

**MICROCHIP TECHNOLOGY / ATMEL** · Global Sourcing Parts · SMA(DO-214AC)

SMAJ40CAE3 from MICROCHIP TECHNOLOGY / ATMEL, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Bidirectional TVS terminal (C-bend lead) with no polarity marking, interchangeable with the other terminal, for the SMAJ40CA 40 V standoff (VWM) 500 W 10/1000 µs clamp. |
| 2 | A2 | passive | Bidirectional TVS terminal (C-bend lead) with no polarity marking, interchangeable with the other terminal, for the SMAJ40CA 40 V standoff (VWM) 500 W 10/1000 µs clamp. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MICROCHIP TECHNOLOGY / ATMEL |
| Package | SMA(DO-214AC) |
| Category | Global Sourcing Parts |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power dissipation | PPP |  |  | 500 | W | 10/1000 µs at 25ºC | 1 |
| Impulse repetition rate (duty factor) |  |  |  | 0.01 | % |  | 1 |
| Operating and storage temperature |  | -65 |  | 150 | ºC |  | 1 |
| Steady-state power dissipation |  |  |  | 5 | W | at TL = 75ºC | 1 |
| Steady-state power dissipation |  |  |  | 1.56 | W | at TA = 25ºC when mounted on FR4 PC board with recommended footprint | 1 |
| Solder temperature |  |  |  | 260 | ºC | for 10 s (maximum) | 1 |
| Clamping time (0 volts to V(BR) min.) | tclamping |  |  | 5 | ns | bidirectional (C or CA suffix) | 1 |
| Thermal resistance, junction to lead |  |  | 15 |  | ºC/W | mounted on FR4 PC board (1oz Cu) with recommended footprint | 1 |
| Thermal resistance, junction to ambient |  |  | 80 |  | ºC/W | mounted on FR4 PC board (1oz Cu) with recommended footprint | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | • TERMINALS: C-bend (modified J-bend) leads Tin￾Lead or RoHS compliant annealed matte-Tin plating solderable per MIL-STD-750, method 2026 | 1 |

## CAD (KiCad official)

- Symbol: `SMAJ40CAE3`
- Footprint: `Diode_SMD:D_SMA`
- 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
- 3D model files: `smaj40cae3-etched.step` / `smaj40cae3-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smaj40cae3.step` / `smaj40cae3.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MICROCHIP TECHNOLOGY / ATMEL datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589838550792908800) (5 pp, sha256 `b271a9ec62e26f59`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smaj40cae3-datasheet.pdf)