component
SMAJ40CAE3
Public Made by Adomby adom
MICROCHIP TECHNOLOGY / ATMEL Global Sourcing Parts, SMA(DO-214AC). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownSMAJ40CAE3
MICROCHIP TECHNOLOGY / ATMEL · Global Sourcing Parts · SMA(DO-214AC)
SMAJ40CAE3 from MICROCHIP TECHNOLOGY / ATMEL, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Bidirectional TVS terminal (C-bend lead) with no polarity marking, interchangeable with the other terminal, for the SMAJ40CA 40 V standoff (VWM) 500 W 10/1000 µs clamp. |
| 2 | A2 | passive | Bidirectional TVS terminal (C-bend lead) with no polarity marking, interchangeable with the other terminal, for the SMAJ40CA 40 V standoff (VWM) 500 W 10/1000 µs clamp. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MICROCHIP TECHNOLOGY / ATMEL |
| Package | SMA(DO-214AC) |
| Category | Global Sourcing Parts |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power dissipation | PPP | 500 | W | 10/1000 µs at 25ºC | 1 | ||
| Impulse repetition rate (duty factor) | 0.01 | % | 1 | ||||
| Operating and storage temperature | -65 | 150 | ºC | 1 | |||
| Steady-state power dissipation | 5 | W | at TL = 75ºC | 1 | |||
| Steady-state power dissipation | 1.56 | W | at TA = 25ºC when mounted on FR4 PC board with recommended footprint | 1 | |||
| Solder temperature | 260 | ºC | for 10 s (maximum) | 1 | |||
| Clamping time (0 volts to V(BR) min.) | tclamping | 5 | ns | bidirectional (C or CA suffix) | 1 | ||
| Thermal resistance, junction to lead | 15 | ºC/W | mounted on FR4 PC board (1oz Cu) with recommended footprint | 1 | |||
| Thermal resistance, junction to ambient | 80 | ºC/W | mounted on FR4 PC board (1oz Cu) with recommended footprint | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | • TERMINALS: C-bend (modified J-bend) leads TinLead or RoHS compliant annealed matte-Tin plating solderable per MIL-STD-750, method 2026 | 1 |
CAD (KiCad official)
- Symbol:
SMAJ40CAE3 - Footprint:
Diode_SMD:D_SMA - 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
- 3D model files:
smaj40cae3-etched.step/smaj40cae3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smaj40cae3.step/smaj40cae3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MICROCHIP TECHNOLOGY / ATMEL datasheet (5 pp, sha256
b271a9ec62e26f59, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).