component
SM15T1G
Public Made by Adomby adom
onsemi ESD And Surge Protection (TVS/ESD), SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
SM15T1G
onsemi · ESD And Surge Protection (TVS/ESD) · SOT-23
SM15T1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CATHODE | passive | Cathode of one of the two common-anode junctions; used with pin 3 for a unidirectional configuration for SM15T1G, which has a working peak reverse voltage (VRWM) of 15 V and a breakdown voltage of 16.7 V minimum at 1.0 mA. |
| 2 | CATHODE | passive | Cathode of the second common-anode junction; used with pin 3 for a second unidirectional configuration, or with pin 1 for a single bidirectional configuration, per the datasheet's Specification Features. |
| 3 | ANODE | passive | Common anode shared by both junctions; the datasheet's unidirectional circuits are tied to pins 1 and 3 or 2 and 3, and the SM15T1G pin 1 to pin 3 typical capacitance is 100 pF at 0 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOT-23 |
| Category | Circuit Protection |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage (VBR), min | VBR | 16.7 | V | @ IT = 1.0 mA | 2 | ||
| Breakdown Voltage (VBR), max | VBR | 19.6 | V | @ IT = 1.0 mA | 2 | ||
| Maximum Reverse Leakage Current (IR) | IR | 1 | µA | @ VRWM | 2 | ||
| Maximum Reverse Peak Pulse Current (IPP) | IPP | 10 | A | 8/20 s pulse waveform per Figure 3 (Note 4) | 2 | ||
| Clamping Voltage (VC) | VC | 24 | V | @ IPP = 1 Amp | 2 | ||
| Working Peak Reverse Voltage (VRWM) | VRWM | 15 | V | 2 | |||
| Peak Power Dissipation | Ppk | 300 | W | @ 20 s (Note 1), TL ≤ 25°C | 2 | ||
| IEC 61000-4-2 (ESD) Air | -15 | 15 | kV | IEC 61000-4-2 (ESD), Air discharge; printed ±15 kV | 2 | ||
| IEC 61000-4-2 (ESD) Contact | -26 | 26 | kV | IEC 61000-4-2 (ESD), Contact discharge; printed ±26 kV | 2 | ||
| IEC 61000-4-4 (EFT) | 40 | A | IEC 61000-4-4 (EFT) | 2 | |||
| IEC 61000-4-5 (Lightning) | 12 | A | IEC 61000-4-5 (Lightning) | 2 | |||
| Total Power Dissipation on FR-5 Board | PD | 225 | mW | @ TA = 25°C (Note 2), FR-5 board | 2 | ||
| Thermal Resistance, Junction-to-Ambient on FR-5 Board | RθJA | 556 | °C/W | FR-5 board (Note 2) | 2 | ||
| Total Power Dissipation on Alumina Substrate | PD | 300 | mW | @ TA = 25°C (Note 3), alumina substrate | 2 | ||
| Thermal Resistance, Junction-to-Ambient on Alumina Substrate | RθJA | 417 | °C/W | Alumina substrate (Note 3) | 2 | ||
| Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 2 | ||
| Lead Solder Temperature (Maximum) | TL | 260 | °C | 10 second duration | 2 |
CAD (KiCad official)
- Symbol:
SM15T1G - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
sm15t1g-etched.step/sm15t1g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sm15t1g.step/sm15t1g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (6 pp, sha256
8e7fda85cfb0bd8f, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SM15T1G
**onsemi** · ESD And Surge Protection (TVS/ESD) · SOT-23
SM15T1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CATHODE | passive | Cathode of one of the two common-anode junctions; used with pin 3 for a unidirectional configuration for SM15T1G, which has a working peak reverse voltage (VRWM) of 15 V and a breakdown voltage of 16.7 V minimum at 1.0 mA. |
| 2 | CATHODE | passive | Cathode of the second common-anode junction; used with pin 3 for a second unidirectional configuration, or with pin 1 for a single bidirectional configuration, per the datasheet's Specification Features. |
| 3 | ANODE | passive | Common anode shared by both junctions; the datasheet's unidirectional circuits are tied to pins 1 and 3 or 2 and 3, and the SM15T1G pin 1 to pin 3 typical capacitance is 100 pF at 0 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOT-23 |
| Category | Circuit Protection |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage (VBR), min | VBR | 16.7 | | | V | @ IT = 1.0 mA | 2 |
| Breakdown Voltage (VBR), max | VBR | | | 19.6 | V | @ IT = 1.0 mA | 2 |
| Maximum Reverse Leakage Current (IR) | IR | | | 1 | µA | @ VRWM | 2 |
| Maximum Reverse Peak Pulse Current (IPP) | IPP | | | 10 | A | 8/20 s pulse waveform per Figure 3 (Note 4) | 2 |
| Clamping Voltage (VC) | VC | | 24 | | V | @ IPP = 1 Amp | 2 |
| Working Peak Reverse Voltage (VRWM) | VRWM | | 15 | | V | | 2 |
| Peak Power Dissipation | Ppk | | | 300 | W | @ 20 s (Note 1), TL ≤ 25°C | 2 |
| IEC 61000-4-2 (ESD) Air | | -15 | | 15 | kV | IEC 61000-4-2 (ESD), Air discharge; printed ±15 kV | 2 |
| IEC 61000-4-2 (ESD) Contact | | -26 | | 26 | kV | IEC 61000-4-2 (ESD), Contact discharge; printed ±26 kV | 2 |
| IEC 61000-4-4 (EFT) | | | | 40 | A | IEC 61000-4-4 (EFT) | 2 |
| IEC 61000-4-5 (Lightning) | | | | 12 | A | IEC 61000-4-5 (Lightning) | 2 |
| Total Power Dissipation on FR-5 Board | PD | | | 225 | mW | @ TA = 25°C (Note 2), FR-5 board | 2 |
| Thermal Resistance, Junction-to-Ambient on FR-5 Board | RθJA | | | 556 | °C/W | FR-5 board (Note 2) | 2 |
| Total Power Dissipation on Alumina Substrate | PD | | | 300 | mW | @ TA = 25°C (Note 3), alumina substrate | 2 |
| Thermal Resistance, Junction-to-Ambient on Alumina Substrate | RθJA | | | 417 | °C/W | Alumina substrate (Note 3) | 2 |
| Junction and Storage Temperature Range | TJ, Tstg | -55 | | 150 | °C | | 2 |
| Lead Solder Temperature (Maximum) | TL | | | 260 | °C | 10 second duration | 2 |
## CAD (KiCad official)
- Symbol: `SM15T1G`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `sm15t1g-etched.step` / `sm15t1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sm15t1g.step` / `sm15t1g.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [onsemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589979987643031552) (6 pp, sha256 `8e7fda85cfb0bd8f`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/sm15t1g-datasheet.pdf)