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Contents

README

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SM15T1G

onsemi · ESD And Surge Protection (TVS/ESD) · SOT-23

SM15T1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE passive Cathode of one of the two common-anode junctions; used with pin 3 for a unidirectional configuration for SM15T1G, which has a working peak reverse voltage (VRWM) of 15 V and a breakdown voltage of 16.7 V minimum at 1.0 mA.
2 CATHODE passive Cathode of the second common-anode junction; used with pin 3 for a second unidirectional configuration, or with pin 1 for a single bidirectional configuration, per the datasheet's Specification Features.
3 ANODE passive Common anode shared by both junctions; the datasheet's unidirectional circuits are tied to pins 1 and 3 or 2 and 3, and the SM15T1G pin 1 to pin 3 typical capacitance is 100 pF at 0 V.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Circuit Protection
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown Voltage (VBR), min VBR 16.7 V @ IT = 1.0 mA 2
Breakdown Voltage (VBR), max VBR 19.6 V @ IT = 1.0 mA 2
Maximum Reverse Leakage Current (IR) IR 1 µA @ VRWM 2
Maximum Reverse Peak Pulse Current (IPP) IPP 10 A 8/20 s pulse waveform per Figure 3 (Note 4) 2
Clamping Voltage (VC) VC 24 V @ IPP = 1 Amp 2
Working Peak Reverse Voltage (VRWM) VRWM 15 V 2
Peak Power Dissipation Ppk 300 W @ 20 s (Note 1), TL ≤ 25°C 2
IEC 61000-4-2 (ESD) Air -15 15 kV IEC 61000-4-2 (ESD), Air discharge; printed ±15 kV 2
IEC 61000-4-2 (ESD) Contact -26 26 kV IEC 61000-4-2 (ESD), Contact discharge; printed ±26 kV 2
IEC 61000-4-4 (EFT) 40 A IEC 61000-4-4 (EFT) 2
IEC 61000-4-5 (Lightning) 12 A IEC 61000-4-5 (Lightning) 2
Total Power Dissipation on FR-5 Board PD 225 mW @ TA = 25°C (Note 2), FR-5 board 2
Thermal Resistance, Junction-to-Ambient on FR-5 Board RθJA 556 °C/W FR-5 board (Note 2) 2
Total Power Dissipation on Alumina Substrate PD 300 mW @ TA = 25°C (Note 3), alumina substrate 2
Thermal Resistance, Junction-to-Ambient on Alumina Substrate RθJA 417 °C/W Alumina substrate (Note 3) 2
Junction and Storage Temperature Range TJ, Tstg -55 150 °C 2
Lead Solder Temperature (Maximum) TL 260 °C 10 second duration 2

CAD (KiCad official)

  • Symbol: SM15T1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: sm15t1g-etched.step / sm15t1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sm15t1g.step / sm15t1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (6 pp, sha256 8e7fda85cfb0bd8f, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF