# SK6690DP8

**Suntek** · DC-DC Converters · ESOP-8

SK6690DP8 from Suntek, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BST | passive | Bootstrap pin: a capacitor connected between SW and BST is required to form a floating supply across the high-side switch driver. |
| 2 | VIN | power_in | Power supply input, operating range 4.5V to 38V (absolute maximum 42V), with a ceramic bypass capacitor placed close to the pin. |
| 3 | SW | power_out | Switching node pin connecting the internal high-side and low-side power MOSFETs to the inductor. |
| 4 | GND | power_in | Ground pin, shared with the exposed pad (pin 4/9 GND/EPAD). |
| 5 | FB | input | Feedback input for the adjustable version, connected to the center point of the external resistor divider; VFB is 0.923V typical (0.900V to 0.946V) for SK6690DP8. |
| 6 | NC | unconnected | No connection. |
| 7 | EN | input | Enable input: drive logic-high to enable the IC, drive logic-low to disable it and enter micro-power shutdown mode (rising threshold 1.1V, falling threshold 0.9V). |
| 8 | NC | unconnected | No connection. |
| 9 | EPAD | power_in | Exposed pad, ground (GND/EPAD, pin 4/9), to be connected to a large copper area for cooling. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Suntek |
| Package | ESOP-8 |
| Category | Power Supply Chip |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Feedback Voltage | VFB | 0.9 | 0.923 | 0.946 | V | VIN=12V, TA=25°C, SK6690DP8 | 4 |
| Input Voltage Range |  | 4.5 |  | 38 | V | VIN=12V, TA=25°C | 4 |
| Supply Current (Quiescent) |  |  | 0.6 | 0.8 | mA | VEN =3.0V | 4 |
| Supply Current (Shutdown) |  |  |  | 4 | uA | VEN =0 or EN = GND | 4 |
| Under-Voltage Lockout Wake up VIN Voltage |  |  | 3.8 | 4.1 | V |  | 4 |
| Under-Voltage Lockout Shutdown VIN Voltage |  |  | 3.2 | 3.5 | V |  | 4 |
| High-Side Switch On-Resistance |  |  | 25 |  | mΩ | ISW=100mA | 4 |
| Low-Side Switch On-Resistance |  |  | 15 |  | mΩ | ISW=-100mA | 4 |
| Valley Switch Current Limit |  |  | 4 |  | A |  | 4 |
| Over Voltage Protection Threshold |  |  | 38.5 |  | V |  | 4 |
| Switching Frequency |  |  | 500 |  | KHz |  | 4 |
| Maximum Duty Cycle |  |  | 82 |  | % | VFB=90% | 4 |
| Minimum Off-Time |  |  | 120 |  | nS |  | 4 |
| EN Rising Threshold |  |  | 1.1 |  | V |  | 4 |
| EN Falling Threshold |  |  | 0.9 |  | V |  | 4 |
| Under-Voltage Lockout Hysteresis VIN voltage |  |  | 300 |  | mV |  | 4 |
| Soft Start |  |  | 1.2 |  | mS |  | 4 |
| Thermal Shutdown |  |  | 160 |  | ℃ |  | 4 |
| Thermal Hysteresis |  |  | 30 |  | ℃ |  | 4 |
| VIN voltage |  | -0.3 |  | 42 | V |  | 3 |
| EN voltage |  | -0.3 |  | 42 | V |  | 3 |
| SW voltage |  | -0.3 |  |  | V | max printed as VIN+1V | 3 |
| SW voltage (10ns transient) |  | -5 |  |  | V | max printed as VIN+2V | 3 |
| BS voltage |  | -0.3 |  |  | V | max printed as Vsw+5V | 3 |
| FB voltage |  | -0.3 |  | 6 | V |  | 3 |
| Operating junction temperature | TJ | -40 |  | 150 | °C |  | 3 |
| Storage temperature | Tstg | -55 |  | 150 | °C |  | 3 |
| Lead Temperature |  |  |  | 260 | °C | Soldering, 10sec. | 3 |
| Operating junction temperature |  | -40 |  | 125 | °C |  | 3 |
| Operating temperature range |  | -40 |  | 85 | °C |  | 3 |
| Input voltage VIN | VIN | 4.5 |  | 38 | V |  | 3 |
| Output current |  | 0 |  | 3 | A |  | 3 |
| Junction-to-ambient thermal resistance | RθJA |  | 48.7 |  | °C/W |  | 4 |
| Junction-to-case (top) thermal resistance | RθJC(top) |  | 52.4 |  | °C/W |  | 4 |
| Junction-to-board thermal resistance | RθJB |  | 25.5 |  | °C/W |  | 4 |
| Junction-to-top characterization parameter | ψJT |  | 8.4 |  | °C/W |  | 4 |
| Junction-to-board characterization parameter | ψJB |  | 25.2 |  | °C/W |  | 4 |
| Junction-to-case (bottom) thermal resistance | θJCbot |  | 6.5 |  | °C/W |  | 4 |

## CAD (KiCad official)

- Symbol: `SK6690DP8`
- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm`
- 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files: `sk6690dp8-etched.step` / `sk6690dp8-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sk6690dp8.step` / `sk6690dp8.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Suntek datasheet](docs/sk6690dp8-datasheet.pdf) (12 pp, sha256 `fa5dcb7cb0431909`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sk6690dp8-datasheet.pdf)