component

SI8640BC-B-IS1

Public Made by Adom

by adom

Skyworks Solutions Digital Isolators, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentsignal isolation devicessi8640bc-b-is1factory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 2d ago
viewers si8640bc-b-is1: viewers · Ray 2d ago
package.json Publish 0.1.0 · Ray 2d ago
page.json Set visibility: public · Ray 2d ago
README.md Publish 0.1.0 · Ray 2d ago
si8640bc-b-is1-etched.glb Publish 0.1.0 · Ray 2d ago
si8640bc-b-is1-etched.step si8640bc-b-is1: factory component page (tier=mfr) · Ray 2d ago
si8640bc-b-is1-hero.glb si8640bc-b-is1: hero GLB from the etched model (keeps the MPN mark) · Ray 2d ago
si8640bc-b-is1-hero.overlay.json Publish 0.1.0 · Ray 2d ago
si8640bc-b-is1.glb Publish 0.1.0 · Ray 2d ago
si8640bc-b-is1.kicad_mod Publish 0.1.0 · Ray 2d ago
si8640bc-b-is1.kicad_sym Publish 0.1.0 · Ray 2d ago
si8640bc-b-is1.lbr Publish 0.1.0 · Ray 2d ago
si8640bc-b-is1.step Publish 0.1.0 · Ray 2d ago

SI8640BC-B-IS1

Skyworks Solutions · Digital Isolators · SOIC-16

SI8640BC-B-IS1 from Skyworks Solutions, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Side 1 power supply, operating over 2.5 V to 5.5 V and requiring a 0.1 µF bypass capacitor to GND1 placed as close as possible to the package.
2 GND1 power_in Side 1 ground; on narrow-body devices this pin must be externally connected to the respective ground.
3 A1 input Side 1 digital input.
4 A2 input Side 1 digital input.
5 A3 bidirectional Side 1 digital input or output.
6 A4 bidirectional Side 1 digital input or output.
7 NC unconnected No connect on Si8640; not internally connected and can be left floating, tied to VDD, or tied to GND.
8 GND1 power_in Side 1 ground; on narrow-body devices this pin must be externally connected to the respective ground.
9 GND2 power_in Side 2 ground; on narrow-body devices this pin must be connected to external ground.
10 EN2 input Side 2 active high enable; when disabled (EN = 0) the output pins are driven into a high-impedance state.
11 B4 bidirectional Side 2 digital input or output.
12 B3 bidirectional Side 2 digital input or output.
13 B2 output Side 2 digital output.
14 B1 output Side 2 digital output.
15 GND2 power_in Side 2 ground; on narrow-body devices this pin must be connected to external ground.
16 VDD2 power_in Side 2 power supply, operating over 2.5 V to 5.5 V and requiring a 0.1 µF bypass capacitor to GND2.

Key specifications

Parameter Value
Manufacturer Skyworks Solutions
Package SOIC-16
Category Signal Isolation Devices
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VDD1, VDD2 2.375 5.5 V Recommended operating 12
Ambient Operating Temperature TA -40 25 125 °C Recommended operating 12
Junction Operating Temperature TJ 150 °C Recommended operating 12
Supply Voltage VDD1, VDD2 -0.5 7 V Absolute maximum 28
Input Voltage VI -0.5 V Max VDD + 0.5 28
Output Voltage VO -0.5 V Max VDD + 0.5 28
Output Current Drive Channel IO 10 mA Absolute maximum 28
Storage Temperature TSTG -65 150 °C Absolute maximum 28
Junction Temperature TJ 150 °C Absolute maximum 28
Lead Solder Temperature 260 °C 10 s 28
VDD Undervoltage Threshold rising VDDUV+ 1.95 2.24 2.375 V VDD1, VDD2 rising 12
VDD Undervoltage Threshold falling VDDUV- 1.88 2.16 2.325 V VDD1, VDD2 falling 12
VDD Undervoltage Hysteresis VDDHYS 50 70 95 mV 12
Positive-Going Input Threshold VT+ 1.4 1.67 1.9 V All inputs rising 12
Negative-Going Input Threshold VT- 1 1.23 1.4 V All inputs falling 12
Input Hysteresis VHYS 0.38 0.44 0.5 V 12
High Level Input Voltage VIH 2 V 12
Low Level Input Voltage VIL 0.8 V 12
High Level Output Voltage VOH 4.8 V loh = -4 mA; min VDD1, VDD2, 0.4 12
Low Level Output Voltage VOL 0.2 0.4 V lol = 4 mA 12
Input Leakage Current IL -10 10 µA Si864xxA/B/C/D 12
Output Impedance ZO 50 Ω 12
DC Supply Current VDD1 IDD1 1 1.6 mA Si8640Bx, Ex; VI = 0(Bx), 1(Ex) 13
DC Supply Current VDD2 IDD2 2.4 3.8 mA Si8640Bx, Ex; VI = 0(Bx), 1(Ex) 13
DC Supply Current VDD1 IDD1 6.1 9.2 mA Si8640Bx, Ex; VI = 1(Bx), 0(Ex) 13
DC Supply Current VDD2 IDD2 2.5 4 mA Si8640Bx, Ex; VI = 1(Bx), 0(Ex) 13
1 Mbps Supply Current VDD1 IDD1 3.6 5 mA Si8640Bx, Ex; all inputs 500 kHz square wave, CI = 15 pF 13
1 Mbps Supply Current VDD2 IDD2 2.9 4 mA Si8640Bx, Ex; all inputs 500 kHz square wave, CI = 15 pF 13
10 Mbps Supply Current VDD1 IDD1 3.6 5 mA Si8640xA/B/C/D; all inputs 5 MHz square wave, CI = 15 pF 13
10 Mbps Supply Current VDD2 IDD2 4 5.6 mA Si8640xA/B/C/D; all inputs 5 MHz square wave, CI = 15 pF 13
100 Mbps Supply Current VDD1 IDD1 3.6 5 mA Si8640xA/B/C/D; all inputs 50 MHz square wave, CI = 15 pF 14
100 Mbps Supply Current VDD2 IDD2 17.5 22.8 mA Si8640xA/B/C/D; all inputs 50 MHz square wave, CI = 15 pF 14
Maximum Data Rate 0 150 Mbps Si864xBx, Ex 14
Minimum Pulse Width 5 ns Si864xBx, Ex 14
Propagation Delay tPHL, tPLH 5 8 13 ns See Figure 4.2 14
Pulse Width Distortion PWD 0.2 4.5 ns /tPLH, tPHL/; see Figure 4.2 14
Propagation Delay Skew tPSK(P-P) 2 4.5 ns 14
Channel-Channel Skew tPSK 0.4 2.5 ns 14
Output Rise Time tr 2.5 4 ns CL = 15 pF 14
Output Fall Time tf 2.5 4 ns CL = 15 pF 15
Peak Eye Diagram Jitter tJIT(PK) 350 ps See Figure 2.3 15
Enable to Data Valid ten1 6 11 ns See Figure 4.1 15
Enable to Data Tri-State ten2 8 12 ns See Figure 4.1 15
Input power loss to valid default output tSD 8 12 ns See Figure 3.1 15
Start-up Time tSU 15 40 µs 15

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 35

CAD (KiCad official)

  • Symbol: SI8640BC-B-IS1
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: si8640bc-b-is1-etched.step / si8640bc-b-is1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si8640bc-b-is1.step / si8640bc-b-is1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Skyworks Solutions datasheet (46 pp, sha256 032aeb8b1ade5e14, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF