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verification.json Verified: Published by the parts factory: tier lcsc, 8 pins · Ray 7d ago

SI8602AC-B-ISR

SILICON LABS · Digital Isolators · SOIC-8

SI8602AC-B-ISR from SILICON LABS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 AVDD power_in Side A power supply terminal; connect to a source of 3.0 to 5.5 V.
2 ASDA bidirectional Side A data (open drain) input or output.
3 ASCL input Side A clock input; for the Si8602 it is a standard CMOS input rather than open drain.
4 AGND power_in Side A ground terminal.
5 BGND power_in Side B ground terminal.
6 BSCL output Side B clock output; push-pull output for the Si8602.
7 BSDA bidirectional Side B data (open drain) input or output.
8 BVDD power_in Side B power supply terminal; connect to a source of 3.0 to 5.5 V.

Key specifications

Parameter Value
Manufacturer SILICON LABS
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient Operating Temperature TA -40 25 125 °C 13
Supply Voltage AVDD AVDD 3 5.5 V 13
Supply Voltage BVDD BVDD 3 5.5 V 13
AVDD Current (Si8602) Idda 1.8 2.7 mA All channels = 0 dc 13
BVDD Current (Si8602) Iddb 1.8 2.7 mA All channels = 0 dc 13
AVDD Current (Si8602) Idda 4.7 7.1 mA All channels = 1 dc 13
BVDD Current (Si8602) Iddb 3.1 4.7 mA All channels = 1 dc 13
AVDD Current (Si8602) Idda 2.5 3.8 mA All channels = 1.7 MHz 13
BVDD Current (Si8602) Iddb 2.1 3.2 mA All channels = 1.7 MHz 13
Logic Input Threshold Side A I2CVT (Side A) 410 540 mV ISDAA, ISCLA (>0.5 mA, <3.0 mA) 14
Logic Low Output Voltage Side A I2CVOL (Side A) 540 800 mV ISDAA, ISCLA (>0.5 mA, <3.0 mA) 14
Input/Output Logic Low Level Difference Side A I2CΔV (Side A) 50 mV ISDAA, ISCLA (>0.5 mA, <3.0 mA) 14
Logic Low Input Voltage Side B I2CVIL (Side B) 0.8 V 14
Logic High Input Voltage Side B I2CVIH (Side B) 2 V 14
Logic Low Output Voltage Side B I2CVOL (Side B) 500 mV ISCLB = 35 mA 14
SDA Logic High Leakage Side A Isdaa 2 10 µA SDAA, SCLA = VSSA 14
SDA Logic High Leakage Side B Isdab 2 10 µA SDAB, SCLB = VSSB 14
Pin Capacitance Side A CA 10 pF 14
Pin Capacitance Side B CB 10 pF 14
Maximum I2C Bus Frequency Fmax 1.7 MHz 15
Positive-Going Input Threshold VT+ 1.4 1.67 1.9 V All inputs rising 16
Negative-Going Input Threshold VT- 1 1.23 1.4 V All inputs falling 16
Input Hysteresis VHYS 0.38 0.44 0.5 V 16
High Level Input Voltage VIH 2 V 16
Low Level Input Voltage VIL 0.8 V 16
High Level Output Voltage VOH 4.8 V loh = -4 mA 16
Low Level Output Voltage VOL 0.2 0.4 V lol = 4 mA 16
Input Leakage Current IL -10 10 µA 16
Maximum Data Rate 0 10 Mbps 16
Minimum Pulse Width 40 ns 16
Propagation Delay tPHL, tPLH 20 ns See Figure 5.1 Propagation Delay Timing (Non-I2C Channels) 16
Pulse Width Distortion PWD 12 ns See Figure 5.1 Propagation Delay Timing (Non-I2C Channels) 16
Propagation Delay Skew tPSK(P-P) 20 ns 16
Channel-Channel Skew tPSK 10 ns 16
Output Rise Time tr 2.5 4 ns C3 = 15 pF 16
Output Fall Time tf 2.5 4 ns C3 = 15 pF 16
Output Impedance ZO 50 Ω 16
Peak Eye Diagram Jitter tJIT(PK) 350 ps 16
VDD Undervoltage Threshold Rising VDDUV+ 1.95 2.24 2.375 V VDD1, VDD2 rising 17
VDD Undervoltage Threshold Falling VDDUV- 1.88 2.16 2.325 V VDD1, VDD2 falling 17
VDD Undervoltage Hysteresis VDDHYS 50 70 95 mV 17
Common Mode Transient Immunity CMTI 35 50 kV/µs VI = VDD or 0 V; VCM = 1500 V 17
Shut Down Time from UVLO tSD 3 µs 17
Start-up Time tSTART 15 40 µs 17
IC Junction-to-Air Thermal Resistance (NB SOIC-8) θJA 140 °C/W 21
Storage Temperature TSTG -65 150 ºC 22
Ambient Temperature Under Bias TA -40 125 ºC 22
Junction Temperature TJ 150 °C 22
Supply Voltage VDD -0.5 7 V 22
Input Voltage VI -0.5 V 22
Output Voltage VO -0.5 V 22
Output Current Drive (non-I2C channels) IO -10 10 mA 22
Side A Output Current Drive (I2C channels) IO -15 15 mA 22
Side B Output Current Drive (I2C channels) IO -75 75 mA 22
Lead Solder Temperature 260 ºC 10 s 22
Maximum Isolation (Input to Output), NB SOIC-8 4500 VRMS 1 sec 22

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing abs 13.3 Top Marking: 16-Pin Narrow Body SOIC .....................36 silabs.com / Building a more connected world. Rev. 1.72 / 3 3

CAD (KiCad official)

  • Symbol: SI8602AC-B-ISR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: si8602ac-b-isr-etched.step / si8602ac-b-isr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si8602ac-b-isr.step / si8602ac-b-isr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SILICON LABS datasheet (39 pp, sha256 1a5d29d7cad4bb14, retrieved 2026-11-02, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF