SI8602AC-B-ISR from SILICON LABS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	AVDD	power_in	Side A power supply terminal; connect to a source of 3.0 to 5.5 V.
2	ASDA	bidirectional	Side A data (open drain) input or output.
3	ASCL	input	Side A clock input; for the Si8602 it is a standard CMOS input rather than open drain.
4	AGND	power_in	Side A ground terminal.
5	BGND	power_in	Side B ground terminal.
6	BSCL	output	Side B clock output; push-pull output for the Si8602.
7	BSDA	bidirectional	Side B data (open drain) input or output.
8	BVDD	power_in	Side B power supply terminal; connect to a source of 3.0 to 5.5 V.

Key specifications

Parameter	Value
Manufacturer	SILICON LABS
Package	SOIC-8
Category	Interface ICs
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Ambient Operating Temperature	TA	-40	25	125	°C		13
Supply Voltage AVDD	AVDD	3		5.5	V		13
Supply Voltage BVDD	BVDD	3		5.5	V		13
AVDD Current (Si8602)	Idda		1.8	2.7	mA	All channels = 0 dc	13
BVDD Current (Si8602)	Iddb		1.8	2.7	mA	All channels = 0 dc	13
AVDD Current (Si8602)	Idda		4.7	7.1	mA	All channels = 1 dc	13
BVDD Current (Si8602)	Iddb		3.1	4.7	mA	All channels = 1 dc	13
AVDD Current (Si8602)	Idda		2.5	3.8	mA	All channels = 1.7 MHz	13
BVDD Current (Si8602)	Iddb		2.1	3.2	mA	All channels = 1.7 MHz	13
Logic Input Threshold Side A	I2CVT (Side A)	410		540	mV	ISDAA, ISCLA (>0.5 mA, <3.0 mA)	14
Logic Low Output Voltage Side A	I2CVOL (Side A)	540		800	mV	ISDAA, ISCLA (>0.5 mA, <3.0 mA)	14
Input/Output Logic Low Level Difference Side A	I2CΔV (Side A)	50			mV	ISDAA, ISCLA (>0.5 mA, <3.0 mA)	14
Logic Low Input Voltage Side B	I2CVIL (Side B)			0.8	V		14
Logic High Input Voltage Side B	I2CVIH (Side B)	2			V		14
Logic Low Output Voltage Side B	I2CVOL (Side B)			500	mV	ISCLB = 35 mA	14
SDA Logic High Leakage Side A	Isdaa		2	10	µA	SDAA, SCLA = VSSA	14
SDA Logic High Leakage Side B	Isdab		2	10	µA	SDAB, SCLB = VSSB	14
Pin Capacitance Side A	CA		10		pF		14
Pin Capacitance Side B	CB		10		pF		14
Maximum I2C Bus Frequency	Fmax			1.7	MHz		15
Positive-Going Input Threshold	VT+	1.4	1.67	1.9	V	All inputs rising	16
Negative-Going Input Threshold	VT-	1	1.23	1.4	V	All inputs falling	16
Input Hysteresis	VHYS	0.38	0.44	0.5	V		16
High Level Input Voltage	VIH	2			V		16
Low Level Input Voltage	VIL			0.8	V		16
High Level Output Voltage	VOH	4.8			V	loh = -4 mA	16
Low Level Output Voltage	VOL		0.2	0.4	V	lol = 4 mA	16
Input Leakage Current	IL	-10		10	µA		16
Maximum Data Rate		0		10	Mbps		16
Minimum Pulse Width				40	ns		16
Propagation Delay	tPHL, tPLH			20	ns	See Figure 5.1 Propagation Delay Timing (Non-I2C Channels)	16
Pulse Width Distortion	PWD			12	ns	See Figure 5.1 Propagation Delay Timing (Non-I2C Channels)	16
Propagation Delay Skew	tPSK(P-P)			20	ns		16
Channel-Channel Skew	tPSK			10	ns		16
Output Rise Time	tr		2.5	4	ns	C3 = 15 pF	16
Output Fall Time	tf		2.5	4	ns	C3 = 15 pF	16
Output Impedance	ZO		50		Ω		16
Peak Eye Diagram Jitter	tJIT(PK)		350		ps		16
VDD Undervoltage Threshold Rising	VDDUV+	1.95	2.24	2.375	V	VDD1, VDD2 rising	17
VDD Undervoltage Threshold Falling	VDDUV-	1.88	2.16	2.325	V	VDD1, VDD2 falling	17
VDD Undervoltage Hysteresis	VDDHYS	50	70	95	mV		17
Common Mode Transient Immunity	CMTI	35	50		kV/µs	VI = VDD or 0 V; VCM = 1500 V	17
Shut Down Time from UVLO	tSD		3		µs		17
Start-up Time	tSTART		15	40	µs		17
IC Junction-to-Air Thermal Resistance (NB SOIC-8)	θJA		140		°C/W		21
Storage Temperature	TSTG	-65		150	ºC		22
Ambient Temperature Under Bias	TA	-40		125	ºC		22
Junction Temperature	TJ			150	°C		22
Supply Voltage	VDD	-0.5		7	V		22
Input Voltage	VI	-0.5			V		22
Output Voltage	VO	-0.5			V		22
Output Current Drive (non-I2C channels)	IO	-10		10	mA		22
Side A Output Current Drive (I2C channels)	IO	-15		15	mA		22
Side B Output Current Drive (I2C channels)	IO	-75		75	mA		22
Lead Solder Temperature				260	ºC	10 s	22
Maximum Isolation (Input to Output), NB SOIC-8				4500	VRMS	1 sec	22

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
housing	abs		13.3 Top Marking: 16-Pin Narrow Body SOIC .....................36 silabs.com / Building a more connected world. Rev. 1.72 / 3	3

CAD (KiCad official)

Symbol: SI8602AC-B-ISR
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: si8602ac-b-isr-etched.step / si8602ac-b-isr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si8602ac-b-isr.step / si8602ac-b-isr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: SILICON LABS datasheet (39 pp, sha256 1a5d29d7cad4bb14, retrieved 2026-11-02, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

SI8602AC-B-ISR

Verified SI8602AC-B-ISR

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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