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SI8400AB-B-IS

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Skyworks Solutions I2C Isolators, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentsignal isolation devicessi8400ab-b-isfactory-2.0.0extractor-text

Verified SI8400AB-B-IS

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier mfr, 8 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: SI8400AB-B-IS · SOIC-8 · 8 pins
  • ✓copper: 8 copper pads, none touching another net
  • ✓datasheet: all 8 pin names found in the 34-page datasheet
  • ✓distributor: lcsc C7011630, digikey SI8400AB-B-IS-ND, mouser 634-SI8400AB-B-IS
  • ✓family: SOIC-8_3.9x4.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-4yncociw/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • ✓package_fit: height and body within the datasheet's package drawing (datasheet p.26)
  • ✓pads: 8 pins = 8 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 8 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ si8400ab-b-is.kicad_sym✓ si8400ab-b-is.kicad_mod✓ si8400ab-b-is.step
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Ray Publish 0.1.0 66bbb0c 12h ago

SI8400AB-B-IS

Skyworks Solutions · I2C Isolators · SOIC-8

SI8400AB-B-IS from Skyworks Solutions, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 AVDD power_in Side A power supply terminal; connect to a source of 3.0 to 5.5 V.
2 ASDA bidirectional Side A data (open drain) input or output.
3 ASCL bidirectional Side A clock input or output; open drain I/O for Si8400/01.
4 AGND power_in Side A ground terminal.
5 BGND power_in Side B ground terminal.
6 BSCL bidirectional Side B clock input or output; open drain I/O for Si8400/01.
7 BSDA bidirectional Side B data (open drain) input or output.
8 BVDD power_in Side B power supply terminal; connect to a source of 3.0 to 5.5 V.

Key specifications

Parameter Value
Manufacturer Skyworks Solutions
Package SOIC-8
Category Signal Isolation Devices
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Storage Temperature TSTG -65 150 °C 4
Ambient Temperature Under Bias TA -40 125 °C 4
Supply Voltage (Revision B) VDD -0.5 6 V 4
Input Voltage VI -0.5 V 4
Output Voltage VO -0.5 V 4
Side A output current drive (I2C channels) IO -15 15 mA 4
Side B output current drive (I2C channels) IO -75 75 mA 4
Lead Solder Temperature 260 °C 10 s 4
Maximum Isolation Voltage 3600 VRMS 1 s 4
Maximum Working Insulation Voltage VIORM 560 V peak 10
AVDD current Idda 4.2 6.3 mA All channels = 0 dc 4
BVDD current Iddb 3.9 5.9 mA All channels = 0 dc 4
AVDD current Idda 2.3 3.5 mA All channels = 1 dc 4
BVDD current Iddb 1.9 2.9 mA All channels = 1 dc 4
AVDD current Idda 3.2 4.8 mA All channels = 1.7 MHz 4
BVDD current Iddb 2.9 4.4 mA All channels = 1.7 MHz 4
Logic Input Threshold (Side A) I2CVT 450 550 650 mV 5
Logic Low Output Voltage (Side A) I2CVOL 910 mV ISDAA = ISCLA = 3.0 mA 5
Logic Low Output Voltage (Side A) I2CVOL 825 mV ISDAA = ISCLA = 0.5 mA 5
Logic Low Output Voltage (Side A), full temperature range I2CVOL 955 mV TA = -40 to 125 °C, ISDAA = ISCLA = 3.0 mA (Table 3 note 3) 5
Logic Low Output Voltage (Side A), full temperature range I2CVOL 875 mV TA = -40 to 125 °C, ISDAA = ISCLA = 0.5 mA (Table 3 note 3) 5
Input/Output Logic Low Level Difference (Side A) I2CV 50 mV 5
Logic Low Input Voltage (Side B) I2CVIL 0.8 V 5
Logic High Input Voltage (Side B) I2CVIH 2 V 5
Logic Low Output Voltage (Side B) I2CVOL 400 mV ISCLB = 35 mA 5
SCL and SDA Logic High Leakage (Side A) Isdaa, Iscla 2 10 µA SDAA, SCLA = VSSA 5
SCL and SDA Logic High Leakage (Side B) Isdab, Isclb 2 10 µA SDAB, SCLB = VSSB 5
VDD Undervoltage Threshold VDDUV+ 2.15 2.3 2.5 V AVDD, BVDD rising 8
VDD Negative-going Lockout Hysteresis VDDH- 45 75 95 mV AVDD, BVDD falling 8
Start-up Time tSTART 15 40 µs 8
Maximum I2C bus Frequency Fmax 1.7 MHz 6
Propagation Delay, Side A to side B rising (5 V) Tphab 25 29 ns 5 V operation; no bus capacitance, R1 = 1400, R2 = 499 6
Propagation Delay, Side A to side B falling (5 V) Tplab 15 22 ns 5 V operation; no bus capacitance, R1 = 1400, R2 = 499 6
Propagation Delay, Side B to side A rising (5 V) Tphba 20 30 ns 5 V operation; no bus capacitance, R1 = 1400, R2 = 499 6
Propagation Delay, Side B to side A falling (5 V) Tplba 9 12 ns 5 V operation; no bus capacitance, R1 = 1400, R2 = 499 6
Propagation Delay, Side A to side B rising (3.3 V) Tphab 28 35 ns 3.3 V operation; R1 = 806, R2 = 499 6
Propagation Delay, Side A to side B falling (3.3 V) Tplab 13 18 ns 3.3 V operation; R1 = 806, R2 = 499 6
Propagation Delay, Side B to side A rising (3.3 V) Tphba 20 40 ns 3.3 V operation; R1 = 806, R2 = 499 6
Propagation Delay, Side B to side A falling (3.3 V) Tplba 10 15 ns 3.3 V operation; R1 = 806, R2 = 499 6
Pulse Width Distortion, Side A low to Side B low (5 V) PWDAB 9 15 ns 5 V operation; no bus capacitance, R1 = 1400, R2 = 499 6
Pulse Width Distortion, Side B low to Side A low (5 V) PWDBA 11 20 ns 5 V operation; no bus capacitance, R1 = 1400, R2 = 499 6
Pulse Width Distortion, Side A low to Side B low (3.3 V) PWDAB 15 22 ns 3.3 V operation; R1 = 806, R2 = 499 6
Pulse Width Distortion, Side B low to Side A low (3.3 V) PWDBA 11 30 ns 3.3 V operation; R1 = 806, R2 = 499 6
Case Temperature (safety limiting) TS 150 °C NB SOIC-8 10
Safety Input Current (NB SOIC-8) IS 160 mA AVDD, BVDD = 5.5 V, TJ = 150 °C, TA = 25 °C; JA = 140 °C/W (NB SOIC-8) 10
Device Power Dissipation (NB SOIC-8) PD 220 W 10
Supply Voltage (AVDD, BVDD) operating range VDD 3 5.5 V 4
Operating Ambient Temperature TA -40 125 °C 4
IC Junction-to-Air Thermal Resistance (NB SOIC-8) θJA 140 °C/W 11

CAD (KiCad official)

  • Symbol: SI8400AB-B-IS
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: si8400ab-b-is-etched.step / si8400ab-b-is-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si8400ab-b-is.step / si8400ab-b-is.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Skyworks Solutions datasheet (34 pp, sha256 42eb9c2871c52c24, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF