SI8400AB-B-IS from Skyworks Solutions, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	AVDD	power_in	Side A power supply terminal; connect to a source of 3.0 to 5.5 V.
2	ASDA	bidirectional	Side A data (open drain) input or output.
3	ASCL	bidirectional	Side A clock input or output; open drain I/O for Si8400/01.
4	AGND	power_in	Side A ground terminal.
5	BGND	power_in	Side B ground terminal.
6	BSCL	bidirectional	Side B clock input or output; open drain I/O for Si8400/01.
7	BSDA	bidirectional	Side B data (open drain) input or output.
8	BVDD	power_in	Side B power supply terminal; connect to a source of 3.0 to 5.5 V.

Key specifications

Parameter	Value
Manufacturer	Skyworks Solutions
Package	SOIC-8
Category	Signal Isolation Devices
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Storage Temperature	TSTG	-65		150	°C		4
Ambient Temperature Under Bias	TA	-40		125	°C		4
Supply Voltage (Revision B)	VDD	-0.5		6	V		4
Input Voltage	VI	-0.5			V		4
Output Voltage	VO	-0.5			V		4
Side A output current drive (I2C channels)	IO	-15		15	mA		4
Side B output current drive (I2C channels)	IO	-75		75	mA		4
Lead Solder Temperature				260	°C	10 s	4
Maximum Isolation Voltage				3600	VRMS	1 s	4
Maximum Working Insulation Voltage	VIORM			560	V peak		10
AVDD current	Idda		4.2	6.3	mA	All channels = 0 dc	4
BVDD current	Iddb		3.9	5.9	mA	All channels = 0 dc	4
AVDD current	Idda		2.3	3.5	mA	All channels = 1 dc	4
BVDD current	Iddb		1.9	2.9	mA	All channels = 1 dc	4
AVDD current	Idda		3.2	4.8	mA	All channels = 1.7 MHz	4
BVDD current	Iddb		2.9	4.4	mA	All channels = 1.7 MHz	4
Logic Input Threshold (Side A)	I2CVT	450	550	650	mV		5
Logic Low Output Voltage (Side A)	I2CVOL			910	mV	ISDAA = ISCLA = 3.0 mA	5
Logic Low Output Voltage (Side A)	I2CVOL			825	mV	ISDAA = ISCLA = 0.5 mA	5
Logic Low Output Voltage (Side A), full temperature range	I2CVOL			955	mV	TA = -40 to 125 °C, ISDAA = ISCLA = 3.0 mA (Table 3 note 3)	5
Logic Low Output Voltage (Side A), full temperature range	I2CVOL			875	mV	TA = -40 to 125 °C, ISDAA = ISCLA = 0.5 mA (Table 3 note 3)	5
Input/Output Logic Low Level Difference (Side A)	I2CV	50			mV		5
Logic Low Input Voltage (Side B)	I2CVIL			0.8	V		5
Logic High Input Voltage (Side B)	I2CVIH	2			V		5
Logic Low Output Voltage (Side B)	I2CVOL			400	mV	ISCLB = 35 mA	5
SCL and SDA Logic High Leakage (Side A)	Isdaa, Iscla		2	10	µA	SDAA, SCLA = VSSA	5
SCL and SDA Logic High Leakage (Side B)	Isdab, Isclb		2	10	µA	SDAB, SCLB = VSSB	5
VDD Undervoltage Threshold	VDDUV+	2.15	2.3	2.5	V	AVDD, BVDD rising	8
VDD Negative-going Lockout Hysteresis	VDDH-	45	75	95	mV	AVDD, BVDD falling	8
Start-up Time	tSTART		15	40	µs		8
Maximum I2C bus Frequency	Fmax			1.7	MHz		6
Propagation Delay, Side A to side B rising (5 V)	Tphab		25	29	ns	5 V operation; no bus capacitance, R1 = 1400, R2 = 499	6
Propagation Delay, Side A to side B falling (5 V)	Tplab		15	22	ns	5 V operation; no bus capacitance, R1 = 1400, R2 = 499	6
Propagation Delay, Side B to side A rising (5 V)	Tphba		20	30	ns	5 V operation; no bus capacitance, R1 = 1400, R2 = 499	6
Propagation Delay, Side B to side A falling (5 V)	Tplba		9	12	ns	5 V operation; no bus capacitance, R1 = 1400, R2 = 499	6
Propagation Delay, Side A to side B rising (3.3 V)	Tphab		28	35	ns	3.3 V operation; R1 = 806, R2 = 499	6
Propagation Delay, Side A to side B falling (3.3 V)	Tplab		13	18	ns	3.3 V operation; R1 = 806, R2 = 499	6
Propagation Delay, Side B to side A rising (3.3 V)	Tphba		20	40	ns	3.3 V operation; R1 = 806, R2 = 499	6
Propagation Delay, Side B to side A falling (3.3 V)	Tplba		10	15	ns	3.3 V operation; R1 = 806, R2 = 499	6
Pulse Width Distortion, Side A low to Side B low (5 V)	PWDAB		9	15	ns	5 V operation; no bus capacitance, R1 = 1400, R2 = 499	6
Pulse Width Distortion, Side B low to Side A low (5 V)	PWDBA		11	20	ns	5 V operation; no bus capacitance, R1 = 1400, R2 = 499	6
Pulse Width Distortion, Side A low to Side B low (3.3 V)	PWDAB		15	22	ns	3.3 V operation; R1 = 806, R2 = 499	6
Pulse Width Distortion, Side B low to Side A low (3.3 V)	PWDBA		11	30	ns	3.3 V operation; R1 = 806, R2 = 499	6
Case Temperature (safety limiting)	TS			150	°C	NB SOIC-8	10
Safety Input Current (NB SOIC-8)	IS			160	mA	AVDD, BVDD = 5.5 V, TJ = 150 °C, TA = 25 °C; JA = 140 °C/W (NB SOIC-8)	10
Device Power Dissipation (NB SOIC-8)	PD			220	W		10
Supply Voltage (AVDD, BVDD) operating range	VDD	3		5.5	V		4
Operating Ambient Temperature	TA	-40		125	°C		4
IC Junction-to-Air Thermal Resistance (NB SOIC-8)	θJA		140		°C/W		11

CAD (KiCad official)

Symbol: SI8400AB-B-IS
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: si8400ab-b-is-etched.step / si8400ab-b-is-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si8400ab-b-is.step / si8400ab-b-is.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Skyworks Solutions datasheet (34 pp, sha256 42eb9c2871c52c24, retrieved 2026-10-31, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

SI8400AB-B-IS

Verified SI8400AB-B-IS

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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