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verification.json Verified: Published by the parts factory: tier lcsc, 9 pins · Ray 5d ago

SI7139DP-T1-GE3-VB

VBsemi Elec · MOSFETs · DFN5x6-8

SI7139DP-T1-GE3-VB from VBsemi Elec, in a DFN5x6-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source terminal of the P-channel MOSFET, with VDS rated at -30 V and continuous drain current of -120 A at TC = 25 °C (package limited).
2 S passive Source terminal of the P-channel MOSFET, with VDS rated at -30 V and continuous drain current of -120 A at TC = 25 °C (package limited).
3 S passive Source terminal of the P-channel MOSFET, with VDS rated at -30 V and continuous drain current of -120 A at TC = 25 °C (package limited).
4 G input Gate terminal of the P-channel MOSFET, with gate-source voltage rated at ±20 V and threshold VGS(th) between -1.0 V and -3.0 V.
5 D passive Drain terminal of the P-channel MOSFET, with RDS(on) of 0.004 Ω at VGS = -10 V and pulsed drain current of -280 A.
6 D passive Drain terminal of the P-channel MOSFET, with RDS(on) of 0.004 Ω at VGS = -10 V and pulsed drain current of -280 A.
7 D passive Drain terminal of the P-channel MOSFET, with RDS(on) of 0.004 Ω at VGS = -10 V and pulsed drain current of -280 A.
8 D passive Drain terminal of the P-channel MOSFET, with RDS(on) of 0.004 Ω at VGS = -10 V and pulsed drain current of -280 A.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package DFN5x6-8
Category Transistors/Thyristors
Pins 9

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper d. The DFN5x6 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cann 1

CAD (KiCad official)

  • Symbol: SI7139DP-T1-GE3-VB
  • Footprint: Package_DFN_QFN:DFN-S-8-1EP_6x5mm_P1.27mm
  • 3D model: DFN5x6-8 (KiCad packages3D, STEP)
  • 3D model files: si7139dp-t1-ge3-vb-etched.step / si7139dp-t1-ge3-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si7139dp-t1-ge3-vb.step / si7139dp-t1-ge3-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (8 pp, sha256 2292e17d0a21d67c, retrieved 2026-11-02, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF