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SI3457CDV-T1-GE3-VB

VBsemi Elec · MOSFETs · TSOP-6

SI3457CDV-T1-GE3-VB from VBsemi Elec, in a TSOP-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 D passive Drain terminal of the P-channel MOSFET, rated VDS -30 V with continuous drain current ID -4.8 A at TC = 25 °C and -4.0 A at TA = 25 °C (surface mounted).
2 D passive Drain terminal of the P-channel MOSFET, rated VDS -30 V with continuous drain current ID -4.8 A at TC = 25 °C and -4.0 A at TA = 25 °C (surface mounted).
3 G input Gate terminal of the P-channel MOSFET, with gate-source voltage limited to ±20 V per the absolute maximum ratings.
4 S passive Source terminal of the P-channel MOSFET; continuous source-drain diode current is rated -2.5 A at TC = 25 °C and -1.67 A at TA = 25 °C.
5 D passive Drain terminal of the P-channel MOSFET, rated VDS -30 V with continuous drain current ID -4.8 A at TC = 25 °C and -4.0 A at TA = 25 °C (surface mounted).
6 D passive Drain terminal of the P-channel MOSFET, rated VDS -30 V with continuous drain current ID -4.8 A at TC = 25 °C and -4.0 A at TA = 25 °C (surface mounted).

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package TSOP-6
Category Transistors/Thyristors
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -30 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current (TJ = 150 °C) ID -4.8 A TC = 25 °C 1
Continuous Drain Current (TJ = 150 °C) ID -4.1 A TC = 70 °C 1
Continuous Drain Current (TJ = 150 °C) ID -4 A TA = 25 °C; footnotes b, c 1
Continuous Drain Current (TJ = 150 °C) ID -3.5 A TA = 70 °C; footnotes b, c 1
Pulsed Drain Current IDM -20 A 1
Continuous Source-Drain Diode Current IS -2.5 A TC = 25 °C 1
Continuous Source-Drain Diode Current IS -1.67 A TA = 25 °C; footnotes b, c 1
Maximum Power Dissipation PD 3 W TC = 25 °C 1
Maximum Power Dissipation PD 2 W TC = 70 °C 1
Maximum Power Dissipation PD 1.3 W TA = 70 °C; footnotes b, c 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Maximum Junction-to-Ambient, t ≤ 5 s RthJA 55 62.5 °C/W t ≤ 5 s; footnotes b, d 1
Maximum Junction-to-Ambient, steady state RthJA 110 °C/W Steady state; per footnote d 1
Maximum Junction-to-Foot (Drain), steady state RthJF 34 41 °C/W Steady state 1
Drain-Source Breakdown Voltage VDS -30 V VGS = 0 V, ID = -250 µA 2
Gate-Source Threshold Voltage VGS(th) -0.5 -2 V VDS = VGS, ID = -250 µA 2
Gate-Source Leakage IGSS -100 100 nA VDS = 0 V, VGS = ±20 V 2
Zero Gate Voltage Drain Current IDSS -1 µA VDS = -30 V, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS -10 µA VDS = -30 V, VGS = 0 V, TJ = 55 °C 2
On-State Drain Current ID(on) -20 A VDS ≤ -5 V, VGS = -10 V 2
Drain-Source On-State Resistance RDS(on) 0.049 Ω VGS = -10 V, ID = -4.1 A 2
Drain-Source On-State Resistance RDS(on) 0.054 Ω VGS = -4.5 V, ID = -1.0 A 2
Total Gate Charge Qg 10 15 nC VDS = -15 V, VGS = -10 V, ID = -4.1 A 2
Total Gate Charge Qg 5.1 8 nC VDS = -15 V, VGS = -4.5 V, ID = -4.1 A 2
Turn-On Delay Time td(on) 40 60 ns VDD = -15 V, RL = 4.6 Ω, ID ≅ -3.3 A, VGEN = -4.5 V, Rg = 1 Ω 2
Rise Time tr 80 120 ns VDD = -15 V, RL = 4.6 Ω, ID ≅ -3.3 A, VGEN = -4.5 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 20 30 ns VDD = -15 V, RL = 4.6 Ω, ID ≅ -3.3 A, VGEN = -4.5 V, Rg = 1 Ω 2
Fall Time tf 12 20 ns VDD = -15 V, RL = 4.6 Ω, ID ≅ -3.3 A, VGEN = -4.5 V, Rg = 1 Ω 2
Turn-On Delay Time td(on) 5 10 ns VDD = -15 V, RL = 4.6 Ω, ID ≅ -3.3 A, VGEN = -10 V, Rg = 1 Ω 2
Rise Time tr 13 20 ns VDD = -15 V, RL = 4.6 Ω, ID ≅ -3.3 A, VGEN = -10 V, Rg = 1 Ω 2
Fall Time tf 10 15 ns VDD = -15 V, RL = 4.6 Ω, ID ≅ -3.3 A, VGEN = -10 V, Rg = 1 Ω 2
Body Diode Voltage VSD -0.8 -1.2 V IS = -3.3 A 2
Body Diode Reverse Recovery Time trr 20 30 ns IF = -3.3 A, di/dt = 100 A/µs, TJ = 25 °C 2
Body Diode Reverse Recovery Charge Qrr 20 30 nC IF = -3.3 A, di/dt = 100 A/µs, TJ = 25 °C 2

CAD (KiCad official)

  • Symbol: SI3457CDV-T1-GE3-VB
  • Footprint: Package_SO:TSOP-6_1.65x3.05mm_P0.95mm
  • 3D model: TSOP-6 (KiCad packages3D, STEP)
  • 3D model files: si3457cdv-t1-ge3-vb-etched.step / si3457cdv-t1-ge3-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si3457cdv-t1-ge3-vb.step / si3457cdv-t1-ge3-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (9 pp, sha256 3385961a796911a6, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF