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SI2309CDS-T1-GE3-MS

MSKSEMI · MOSFETs · SOT-23

SI2309CDS-T1-GE3-MS from MSKSEMI, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the P-channel MOSFET; gate-source voltage is rated ±20 V (VGS).
2 S passive Source terminal; the body diode continuous source current is rated -1.8 A (IS) and the pulsed source current -3.6 A (ISM).
3 D passive Drain terminal; drain-source voltage is rated -60 V (VDS) with continuous drain current -1.8 A at TA=25℃.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -60 V VGS=0V, ID=-250uA 3
Drain-Source Leakage Current IDSS -1 uA VDS=-60V, VGS=0V, TJ=25℃ 3
Drain-Source Leakage Current IDSS -10 uA VDS=-48V, VGS=0V, TJ=125℃ 3
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 3
Static Drain-Source On-Resistance RDS(ON) 200 300 mΩ VGS=-10V, ID=-1.8A 3
Static Drain-Source On-Resistance RDS(ON) 300 400 mΩ VGS=-4.5V, ID=-1.5A 3
Gate Threshold Voltage VGS(th) -1 -1.7 -2.5 V VGS=VDS, ID=-250uA 3
Continuous Source Current IS -1.8 A VG=VD=0V, Force Current 3
Pulsed Source Current ISM -3.6 A 3
Diode Forward Voltage VSD -1.2 V VGS=0V, IS=-1A, TJ=25℃ 3
Drain-Source Voltage VDS -60 V Tc=25℃ unless otherwise noted 2
Gate-Source Voltage VGS -20 20 V Tc=25℃ unless otherwise noted 2
Drain Current, Continuous ID -1.8 A TA=25℃ 2
Drain Current, Continuous ID -1.5 A TA=70℃ 2
Drain Current, Pulsed IDM -8 A 2
Power Dissipation PD 1.56 W TA=25℃ 2
Power Dissipation, Derate above 25℃ PD 0.012 W/℃ Derate above 25℃ 2
Storage Temperature Range TSTG -55 150 ℃ 2
Operating Junction Temperature Range TJ -55 150 ℃ 2
Thermal Resistance Junction to Ambient RθJA 80 ℃/W 2

CAD (KiCad official)

  • Symbol: SI2309CDS-T1-GE3-MS
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: si2309cds-t1-ge3-ms-etched.step / si2309cds-t1-ge3-ms-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si2309cds-t1-ge3-ms.step / si2309cds-t1-ge3-ms.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (6 pp, sha256 8f05532a52525e88, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF