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SI2301AHE3-TP

MCC Micro Commercial Components · MOSFETs · SOT-23

SI2301AHE3-TP from MCC Micro Commercial Components, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GATE input Gate of the P-channel MOSFET, with VGS(th) of -0.4 V to -1.0 V at VDS=VGS and ID=-250µA and gate-body leakage of ±100 nA at VGS=±10 V.
2 SOURCE passive Source of the P-channel MOSFET; the body diode forward voltage VSD is given as -1.2 V at VGS=0V and IS=-0.75A.
3 DRAIN passive Drain of the P-channel MOSFET; drain-source breakdown V(BR)DSS is -20 V at VGS=0V and ID=-250µA, with zero-gate drain current of -1 µA at VDS=-20V.

Key specifications

Parameter Value
Manufacturer MCC Micro Commercial Components
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -20 V 1
Gate-Source Voltage VGS -10 10 V 1
Drain Current-Continuous ID -3.4 A TA=25°C 1
Drain Current-Continuous ID -2.7 A TA=70°C 1
Drain Current-Pulse IDM -14 A Note 2 1
Power Dissipation PD 1 W 1
Operating Junction Temperature Range -55 150 °C 1
Storage Temperature Range -55 150 °C 1
Maximum Thermal Resistance Junction to Ambient 125 °C/W Note 2: Surface Mounted on FR4 Board t<5sec 1
Drain-Source Breakdown Voltage V(BR)DSS -20 V VGS=0V, ID=-250µA 2
Gate-Threshold Voltage VGS(th) -0.4 -0.62 -1 V VDS=VGS, ID=-250µA 2
Gate-Body Leakage Current IGSS -100 100 nA VGS =± 10V, VDS =0V 2
Zero Gate Voltage Drain Current IDSS -1 µA VDS =-20V, VGS =0V 2
Drain-Source On-Resistance RDS(on) 42 51 mΩ VGS=-4.5V, ID=-3.4A 2
Drain-Source On-Resistance RDS(on) 55 67 mΩ VGS=-2.5V, ID=-3.0A 2
Drain-Source On-Resistance RDS(on) 76 91 mΩ VGS=-1.8V, ID=-2.5A 2
Diode Forward Voltage VSD -1.2 V VGS=0V, IS=-0.75A 2

CAD (KiCad official)

  • Symbol: SI2301AHE3-TP
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: si2301ahe3-tp-etched.step / si2301ahe3-tp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si2301ahe3-tp.step / si2301ahe3-tp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MCC Micro Commercial Components datasheet (4 pp, sha256 e1a4174e6cce1f88, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF