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Contents

README

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SI1307EDL-T1-GE3-VB

VBsemi Elec · MOSFETs · SOT-323(SC-70)

SI1307EDL-T1-GE3-VB from VBsemi Elec, in a SOT-323(SC-70). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate of the P-channel MOSFET; the datasheet gives the gate-source voltage limit as ±12 V and the gate-source threshold as -0.45 V to -1.5 V.
2 S passive Source of the P-channel MOSFET; the datasheet gives the body diode data (pulse forward current -6 A, forward voltage -0.8 V to -1.2 V at IF = -0.7 A) but no separate per-pin limit.
3 D passive Drain of the P-channel MOSFET; the datasheet limits drain-source voltage to -20 V and lists continuous drain current of -3.1 A at TC = 25 °C in the product summary.

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package SOT-323(SC-70)
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -20 V 1
Gate-Source Voltage VGS -12 12 V 1
Continuous Drain Current ID -1.4 A TA = 25 °C, note b 1
Continuous Drain Current ID -1.1 A TA = 70 °C, note b 1
Pulsed Drain Current IDM -6 A 1
Continuous Source-Drain Diode Current IS -0.4 A TC = 25 °C 1
Continuous Source-Drain Diode Current IS -0.3 A TA = 25 °C 1
Maximum Power Dissipation PD 0.5 W TC = 25 °C 1
Maximum Power Dissipation PD 0.3 W TC = 70 °C 1
Maximum Power Dissipation PD 0.4 W TA = 25 °C, note a 1
Operating Junction and Storage Temperature Range TJ, Tstg -50 150 °C 1
Soldering Recommendations (Peak Temperature) 260 °C 1
Gate-Source Threshold Voltage VGS(th) -0.45 -1.5 V VDS = VGS, ID = -250 µA 2
Gate-Source Leakage IGSS -100 100 nA VDS = 0 V, VGS = ±8 V 2
Zero Gate Voltage Drain Current IDSS -1 µA VDS = -20 V, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS -10 µA VDS = -20 V, VGS = 0 V, TJ = 55 °C 2
On-State Drain Current ID(on) -2 A VDS ≤ -5 V, VGS = -4.5 V 2
Drain-Source On-State Resistance RDS(on) 0.08 Ω VGS = -4.5 V, ID = -1.4 A 2
Drain-Source On-State Resistance RDS(on) 0.1 Ω VGS = -2.5 V, ID = -1.2 A 2
Body Diode Voltage VSD -0.8 -1.2 V IF = -0.7 A 2
Turn-On Delay Time (VGEN = -4.5 V) td(on) 12 20 ns VDD = -10 V, RL = 9.1 Ω, ID = -1.1 A, VGEN = -4.5 V, Rg = 1 Ω 2
Rise Time (VGEN = -4.5 V) tr 20 30 ns VDD = -10 V, RL = 9.1 Ω, ID = -1.1 A, VGEN = -4.5 V, Rg = 1 Ω 2
Fall Time (VGEN = -4.5 V) tf 9 18 ns VDD = -10 V, RL = 9.1 Ω, ID = -1.1 A, VGEN = -4.5 V, Rg = 1 Ω 2
Turn-On Delay Time (VGEN = -8 V) td(on) 5 10 ns VDD = -10 V, RL = 9.1 Ω, ID = -1.1 A, VGEN = -8 V, Rg = 1 Ω 2
Rise Time (VGEN = -8 V) tr 10 20 ns VDD = -10 V, RL = 9.1 Ω, ID = -1.1 A, VGEN = -8 V, Rg = 1 Ω 2
Turn-Off Delay Time (VGEN = -8 V) td(off) 18 27 ns VDD = -10 V, RL = 9.1 Ω, ID = -1.1 A, VGEN = -8 V, Rg = 1 Ω 2
Fall Time (VGEN = -8 V) tf 7 14 ns VDD = -10 V, RL = 9.1 Ω, ID = -1.1 A, VGEN = -8 V, Rg = 1 Ω 2
Continuous Source-Drain Diode Current IS -2.4 A TC = 25 °C 2
Pulse Diode Forward Current ISM -6 A 2
Body Diode Reverse Recovery Time trr 18 27 ns IF = -0.7 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Body Diode Reverse Recovery Charge Qrr 7 14 nC IF = -0.7 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Total Gate Charge Qg 4.3 6.5 nC VDS = -10 V, VGS = -4.5 V, ID = -1.4 A 2
Total Gate Charge Qg 2.7 4.1 nC VDS = -10 V, VGS = -2.5 V, ID = -1.4 A 2
Gate Resistance Rg 7 14 Ω f = 1 MHz 2
Drain-Source Breakdown Voltage VDS -20 V VGS = 0 V, ID = -250 µA 2
VDS Temperature Coefficient VDS/TJ -14 mV/°C ID = -250 µA 2
VGS(th) Temperature Coefficient VGS(th)/TJ 2.4 mV/°C 2
On-State Forward Transconductance gfs 5 S VDS = -5 V, ID = -1.4 A 2
Input Capacitance Ciss 272 pF VDS = -10 V, VGS = 0 V, f = 1 MHz 2
Output Capacitance Coss 55 pF VDS = -10 V, VGS = 0 V, f = 1 MHz 2
Reverse Transfer Capacitance Crss 44 pF VDS = -10 V, VGS = 0 V, f = 1 MHz 2
Gate-Source Charge Qgs 0.7 nC 2
Gate-Drain Charge Qgd 1 nC 2
Reverse Recovery Fall Time ta 7 ns IF = -0.7 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Reverse Recovery Rise Time tb 11 ns IF = -0.7 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Junction-to-Ambient Thermal Resistance (t = 10 s) RthJA 250 300 °C/W t = 10 s, surface mounted (notes a, b) 2
Junction-to-Foot (Drain) Thermal Resistance (Steady State) RthJF 225 270 °C/W Steady state 2
Junction-to-Ambient Thermal Resistance (Steady State) RthJA 360 °C/W Steady state, note b 2

CAD (KiCad official)

  • Symbol: SI1307EDL-T1-GE3-VB
  • Footprint: Package_TO_SOT_SMD:SOT-323_SC-70
  • 3D model: SOT-323(SC-70) (KiCad packages3D, STEP)
  • 3D model files: si1307edl-t1-ge3-vb-etched.step / si1307edl-t1-ge3-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si1307edl-t1-ge3-vb.step / si1307edl-t1-ge3-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (9 pp, sha256 f75f8ef89113def7, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF