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SHT41I-AD1B-R2

Sensirion · Global Sourcing Parts · DFN-4(1.5x1.5)

SHT41I-AD1B-R2 from Sensirion, in a DFN-4(1.5x1.5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SDA bidirectional Serial data line for the I2C interface, bidirectional.
2 SCL input Serial clock line for the I2C interface, unidirectional input.
3 VDD power_in Supply voltage; the datasheet gives VDD = 2.3 V to 5.5 V.
4 VSS power_in Ground reference for the sensor.

Key specifications

Parameter Value
Manufacturer Sensirion
Package DFN-4(1.5x1.5)
Category Global Sourcing Parts
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD 2.3 3.3 5.5 V - 7
Power-up/down level VPOR 0.7 2.3 V Static power supply 7
Supply current (heater on), nominal heater 200 mW IDD 40 80 mA Nomin. heater 200mW 7
Supply current (heater on), nominal heater 110 mW IDD 22 44 mA Nomin. heater 110mW 7
Supply current (heater on), nominal heater 20 mW IDD 4 8 mA Nomin. heater 20mW 7
Low level input voltage VIL 0 V 7
Pull up resistors Rp 820 Ω VDD < 3.0 V 7
Pull up resistors Rp 390 Ω VDD ≥ 3.0 V 7
Low level output voltage VOL 0.4 V VDD ≥ 2.3 V, Rp ≥ 820 Ω 7
Cap bus load (fast mode) Cb 400 pF Rp ≥ 820 Ω: fast mode 7
Cap bus load (fast mode plus) Cb 340 pF Rp ≥ 390 Ω, VDD ≥ 3.0 V: fast mode plus 7
Power-up time tPU 0.3 1 ms After hard reset, VDD ≥ VPOR 8
Soft reset time tSR 1 ms After soft reset 8
Measurement duration, low repeatability tMEAS,l 1.3 1.6 ms Low repeatability 8
Measurement duration, medium repeatability tMEAS,m 3.7 4.5 ms Med. repeatability 8
Measurement duration, high repeatability tMEAS,h 6.9 8.3 ms High repeatability 8
Heater-on duration, long pulse tHeater 0.81 1 1.19 s Long pulse 8
Heater-on duration, short pulse tHeater 0.08 0.1 0.12 s Short pulse 8
Supply voltage (absolute maximum) VDD -0.3 6 V 8
Max voltage on any pin (lower limit) VSS -0.3 V Relative to VSS 8
Operating temperature range -40 125 °C 8
Storage temperature range -40 150 °C 8
ESD HBM 4 kV ESD HBM 8
ESD CDM 750 V ESD CDM 8
Latch up 100 mA JESD78 Class II, 125 °C 8
Recommended normal temperature range 5 60 °C Recommended normal temperature and humidity range 6
Recommended normal humidity range 20 80 %RH Recommended normal temperature and humidity range 6
Junction-to-ambient thermal resistance, heater off, die pad soldered RθJA 246 K/W Heater off, die pad soldered 14
Junction-to-ambient thermal resistance, heater on, die pad soldered RθJA 308 K/W Heater on, die pad soldered 14
Junction-to-ambient thermal resistance, heater off, die pad not soldered RθJA 297 K/W Heater off, die pad not soldered 14
Junction-to-ambient thermal resistance, heater on, die pad not soldered RθJA 357 K/W Heater on, die pad not soldered 14
Junction-to-case thermal resistance, heater off, die pad soldered RθJC 189 K/W Heater off, die pad soldered 14
Junction-to-case thermal resistance, heater on, die pad soldered RθJC 255 K/W Heater on, die pad soldered 14
Junction-to-case thermal resistance, heater off, die pad not soldered RθJC 191 K/W Heater off, die pad not soldered 14
Junction-to-case thermal resistance, heater on, die pad not soldered RθJC 257 K/W Heater on, die pad not soldered 14
Junction-to-board thermal resistance, heater off, die pad soldered RθJB 159 K/W Heater off, die pad soldered 14
Junction-to-board thermal resistance, heater on, die pad soldered RθJB 225 K/W Heater on, die pad soldered 14
Junction-to-board thermal resistance, heater off, die pad not soldered RθJB 193 K/W Heater off, die pad not soldered 14
Junction-to-board thermal resistance, heater on, die pad not soldered RθJB 258 K/W Heater on, die pad not soldered 14
Junction-to-board characterization parameter, heater off, die pad soldered ΨJB 159 K/W Heater off, die pad soldered 14
Junction-to-board characterization parameter, heater on, die pad soldered ΨJB 223 K/W Heater on, die pad soldered 14
Junction-to-board characterization parameter, heater off, die pad not soldered ΨJB 191 K/W Heater off, die pad not soldered 14
Junction-to-board characterization parameter, heater on, die pad not soldered ΨJB 254 K/W Heater on, die pad not soldered 14
Junction-to-top characterization parameter, heater off, die pad soldered ΨJT 38 K/W Heater off, die pad soldered 14
Junction-to-top characterization parameter, heater on, die pad soldered ΨJT 105 K/W Heater on, die pad soldered 14
Junction-to-top characterization parameter, heater off, die pad not soldered ΨJT 44 K/W Heater off, die pad not soldered 14
Junction-to-top characterization parameter, heater on, die pad not soldered ΨJT 112 K/W Heater on, die pad not soldered 14

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper SHT4xI-Digital is provided in an open-cavity dual flat no lead (DFN) package. The humidity sensor opening is centered on the top side of the package. The sensor chip is made of silicon, hosted on a co 12

CAD (KiCad official)

  • Symbol: SHT41I-AD1B-R2
  • Footprint: Sensor_Humidity:Sensirion_DFN-4_1.5x1.5mm_P0.8mm_SHT4x_NoCentralPad
  • 3D model: DFN-4(1.5x1.5), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.55 mm nominal QFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: sht41i-ad1b-r2-etched.step / sht41i-ad1b-r2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sht41i-ad1b-r2.step / sht41i-ad1b-r2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Sensirion datasheet (21 pp, sha256 c43fa5baeb8c7595, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF