component
SHT41I-AD1B-R2
Public Made by Adomby adom
Sensirion Global Sourcing Parts, DFN-4(1.5x1.5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownSHT41I-AD1B-R2
Sensirion · Global Sourcing Parts · DFN-4(1.5x1.5)
SHT41I-AD1B-R2 from Sensirion, in a DFN-4(1.5x1.5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SDA | bidirectional | Serial data line for the I2C interface, bidirectional. |
| 2 | SCL | input | Serial clock line for the I2C interface, unidirectional input. |
| 3 | VDD | power_in | Supply voltage; the datasheet gives VDD = 2.3 V to 5.5 V. |
| 4 | VSS | power_in | Ground reference for the sensor. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Sensirion |
| Package | DFN-4(1.5x1.5) |
| Category | Global Sourcing Parts |
| Pins | 4 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VDD | 2.3 | 3.3 | 5.5 | V | - | 7 |
| Power-up/down level | VPOR | 0.7 | 2.3 | V | Static power supply | 7 | |
| Supply current (heater on), nominal heater 200 mW | IDD | 40 | 80 | mA | Nomin. heater 200mW | 7 | |
| Supply current (heater on), nominal heater 110 mW | IDD | 22 | 44 | mA | Nomin. heater 110mW | 7 | |
| Supply current (heater on), nominal heater 20 mW | IDD | 4 | 8 | mA | Nomin. heater 20mW | 7 | |
| Low level input voltage | VIL | 0 | V | 7 | |||
| Pull up resistors | Rp | 820 | Ω | VDD < 3.0 V | 7 | ||
| Pull up resistors | Rp | 390 | Ω | VDD ≥ 3.0 V | 7 | ||
| Low level output voltage | VOL | 0.4 | V | VDD ≥ 2.3 V, Rp ≥ 820 Ω | 7 | ||
| Cap bus load (fast mode) | Cb | 400 | pF | Rp ≥ 820 Ω: fast mode | 7 | ||
| Cap bus load (fast mode plus) | Cb | 340 | pF | Rp ≥ 390 Ω, VDD ≥ 3.0 V: fast mode plus | 7 | ||
| Power-up time | tPU | 0.3 | 1 | ms | After hard reset, VDD ≥ VPOR | 8 | |
| Soft reset time | tSR | 1 | ms | After soft reset | 8 | ||
| Measurement duration, low repeatability | tMEAS,l | 1.3 | 1.6 | ms | Low repeatability | 8 | |
| Measurement duration, medium repeatability | tMEAS,m | 3.7 | 4.5 | ms | Med. repeatability | 8 | |
| Measurement duration, high repeatability | tMEAS,h | 6.9 | 8.3 | ms | High repeatability | 8 | |
| Heater-on duration, long pulse | tHeater | 0.81 | 1 | 1.19 | s | Long pulse | 8 |
| Heater-on duration, short pulse | tHeater | 0.08 | 0.1 | 0.12 | s | Short pulse | 8 |
| Supply voltage (absolute maximum) | VDD | -0.3 | 6 | V | 8 | ||
| Max voltage on any pin (lower limit) | VSS | -0.3 | V | Relative to VSS | 8 | ||
| Operating temperature range | -40 | 125 | °C | 8 | |||
| Storage temperature range | -40 | 150 | °C | 8 | |||
| ESD HBM | 4 | kV | ESD HBM | 8 | |||
| ESD CDM | 750 | V | ESD CDM | 8 | |||
| Latch up | 100 | mA | JESD78 Class II, 125 °C | 8 | |||
| Recommended normal temperature range | 5 | 60 | °C | Recommended normal temperature and humidity range | 6 | ||
| Recommended normal humidity range | 20 | 80 | %RH | Recommended normal temperature and humidity range | 6 | ||
| Junction-to-ambient thermal resistance, heater off, die pad soldered | RθJA | 246 | K/W | Heater off, die pad soldered | 14 | ||
| Junction-to-ambient thermal resistance, heater on, die pad soldered | RθJA | 308 | K/W | Heater on, die pad soldered | 14 | ||
| Junction-to-ambient thermal resistance, heater off, die pad not soldered | RθJA | 297 | K/W | Heater off, die pad not soldered | 14 | ||
| Junction-to-ambient thermal resistance, heater on, die pad not soldered | RθJA | 357 | K/W | Heater on, die pad not soldered | 14 | ||
| Junction-to-case thermal resistance, heater off, die pad soldered | RθJC | 189 | K/W | Heater off, die pad soldered | 14 | ||
| Junction-to-case thermal resistance, heater on, die pad soldered | RθJC | 255 | K/W | Heater on, die pad soldered | 14 | ||
| Junction-to-case thermal resistance, heater off, die pad not soldered | RθJC | 191 | K/W | Heater off, die pad not soldered | 14 | ||
| Junction-to-case thermal resistance, heater on, die pad not soldered | RθJC | 257 | K/W | Heater on, die pad not soldered | 14 | ||
| Junction-to-board thermal resistance, heater off, die pad soldered | RθJB | 159 | K/W | Heater off, die pad soldered | 14 | ||
| Junction-to-board thermal resistance, heater on, die pad soldered | RθJB | 225 | K/W | Heater on, die pad soldered | 14 | ||
| Junction-to-board thermal resistance, heater off, die pad not soldered | RθJB | 193 | K/W | Heater off, die pad not soldered | 14 | ||
| Junction-to-board thermal resistance, heater on, die pad not soldered | RθJB | 258 | K/W | Heater on, die pad not soldered | 14 | ||
| Junction-to-board characterization parameter, heater off, die pad soldered | ΨJB | 159 | K/W | Heater off, die pad soldered | 14 | ||
| Junction-to-board characterization parameter, heater on, die pad soldered | ΨJB | 223 | K/W | Heater on, die pad soldered | 14 | ||
| Junction-to-board characterization parameter, heater off, die pad not soldered | ΨJB | 191 | K/W | Heater off, die pad not soldered | 14 | ||
| Junction-to-board characterization parameter, heater on, die pad not soldered | ΨJB | 254 | K/W | Heater on, die pad not soldered | 14 | ||
| Junction-to-top characterization parameter, heater off, die pad soldered | ΨJT | 38 | K/W | Heater off, die pad soldered | 14 | ||
| Junction-to-top characterization parameter, heater on, die pad soldered | ΨJT | 105 | K/W | Heater on, die pad soldered | 14 | ||
| Junction-to-top characterization parameter, heater off, die pad not soldered | ΨJT | 44 | K/W | Heater off, die pad not soldered | 14 | ||
| Junction-to-top characterization parameter, heater on, die pad not soldered | ΨJT | 112 | K/W | Heater on, die pad not soldered | 14 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | SHT4xI-Digital is provided in an open-cavity dual flat no lead (DFN) package. The humidity sensor opening is centered on the top side of the package. The sensor chip is made of silicon, hosted on a co | 12 |
CAD (KiCad official)
- Symbol:
SHT41I-AD1B-R2 - Footprint:
Sensor_Humidity:Sensirion_DFN-4_1.5x1.5mm_P0.8mm_SHT4x_NoCentralPad - 3D model: DFN-4(1.5x1.5), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.55 mm nominal QFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
sht41i-ad1b-r2-etched.step/sht41i-ad1b-r2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sht41i-ad1b-r2.step/sht41i-ad1b-r2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Sensirion datasheet (21 pp, sha256
c43fa5baeb8c7595, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).