component
SGM3209YS8G
Public Made by Adomby adom
SGMICRO DC-DC Converters, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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SGM3209YS8G
SGMICRO · DC-DC Converters · SOIC-8
SGM3209YS8G from SGMICRO, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection. |
| 2 | CFLY+ | passive | Positive terminal of the flying capacitor, which connects to the external CFLY (10µF in the typical application). |
| 3 | GND | power_in | Ground reference for the device. |
| 4 | CFLY- | passive | Negative terminal of the flying capacitor, which connects to the external CFLY (10µF in the typical application). |
| 5 | OUT | power_out | Output pin that delivers the generated negative supply (-3V to -18V for an input of 3V to 18V), rated up to 100mA. |
| 6 | EN | input | Enable control pin: logic high enables the chip and logic low shuts it down; it has an internal 600kΩ pull-low resistor. |
| 7 | RP | passive | Switching frequency setting pin; connect one resistor (RSET) between RP and GND, located very close to the pin, to program the frequency from 120kHz to 1.25MHz. |
| 8 | IN | power_in | Power input pin, with an input voltage range of 3V to 18V (absolute maximum -0.3V to 22V to GND). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SGMICRO |
| Package | SOIC-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage Range | VIN | 3 | 18 | V | 2 | ||
| Operating Temperature Range | -40 | 85 | ℃ | 2 | |||
| Input Voltage Range | VIN | 3 | 18 | V | Full (-40℃ to +85℃) | 4 | |
| Maximum Output Current Range at OUT Pin | IOUT | 100 | mA | +25℃ | 4 | ||
| Output Voltage Ripple | VPP | 250 | mVP-P | IOUT = 100mA, RP Floating, +25℃ | 4 | ||
| Output Voltage Ripple | VPP | 40 | mVP-P | IOUT = 100mA, RSET = 82kΩ, +25℃ | 4 | ||
| Output Voltage Ripple | VPP | 35 | mVP-P | IOUT = 100mA, RSET = 0Ω, +25℃ | 4 | ||
| Quiescent Current | IQ | 0.9 | 1.4 | mA | RP Floating, IOUT = 0mA, +25℃ | 4 | |
| Quiescent Current | IQ | 4.3 | 5.5 | mA | RSET = 82kΩ, IOUT = 0mA, +25℃ | 4 | |
| Quiescent Current | IQ | 5.3 | 7 | mA | RSET = 0Ω, IOUT = 0mA, +25℃ | 4 | |
| Shutdown Mode Quiescent Current | IQ | 0.5 | 1.2 | μA | Shutdown Mode, VEN = 0V, +25℃ | 4 | |
| Internal Switching Frequency | fOSC | 100 | 120 | 145 | kHz | RP Floating, +25℃ | 4 |
| Internal Switching Frequency | fOSC | 850 | 1000 | 1160 | kHz | RSET = 82kΩ, +25℃ | 4 |
| Internal Switching Frequency | fOSC | 1050 | 1250 | 1520 | kHz | RSET = 0Ω, +25℃ | 4 |
| Impedance | RO | 15 | 19 | Ω | IOUT = 20mA, RP Floating, +25℃ | 4 | |
| Impedance | RO | 23 | 38 | Ω | IOUT = 20mA, RSET = 82kΩ, +25℃ | 4 | |
| Impedance | RO | 33 | 57 | Ω | IOUT = 20mA, RSET = 0Ω, +25℃ | 4 | |
| EN Logic Level High | VIH | 1.4 | V | VIN = 3V to 18V, Full (-40℃ to +85℃) | 4 | ||
| EN Logic Level Low | VIL | 0.6 | V | VIN = 3V to 18V, Full (-40℃ to +85℃) | 4 | ||
| EN Internal Pull Low Resistance | RPULL-LOW | 600 | kΩ | +25℃ | 4 | ||
| Thermal Shutdown Temperature | TSHDN | 150 | ℃ | 4 | |||
| Thermal Shutdown Hysteresis | ΔTSHDN | 20 | ℃ | 4 | |||
| IN to GND | VIN | -0.3 | 22 | V | 2 | ||
| OUT to GND | VOUT | 0.3 | V | Min printed as -(VIN + 0.3V) | 2 | ||
| EN, RP to GND | -0.3 | 6 | V | 2 | |||
| Junction Temperature | TJ | 150 | ℃ | 2 | |||
| Storage Temperature Range | TSTG | -65 | 150 | ℃ | 2 | ||
| Lead Temperature (Soldering) | 260 | ℃ | 10s | 2 |
CAD (KiCad official)
- Symbol:
SGM3209YS8G - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
sgm3209ys8g-etched.step/sgm3209ys8g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sgm3209ys8g.step/sgm3209ys8g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: SGMICRO datasheet (12 pp, sha256
d1a99397bd000a59, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).