component
SE4060GB
Public Made by Adomby adom
SINO IC MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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SE4060GB
SINO IC · MOSFETs · TO-252
SE4060GB from SINO IC, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate terminal of the N-channel MOSFET, with a maximum gate-source voltage of ±20 V and an on-resistance of 7.5 mΩ typ at VGS=10 V. |
| 2 | Drain | passive | Drain terminal, rated for 45 V drain-source voltage and 56 A continuous (150 A pulsed) drain current. |
| 3 | Source | passive | Source terminal of the N-channel MOSFET, the reference for the gate drive and the body-diode anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SINO IC |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 45 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Drain Current, Continuous | ID | 56 | A | 1 | |||
| Drain Current, Pulsed | 150 | A | 1 | ||||
| Avalanche Energy, Single Pulsed | EAS | 20 | mJ | Single Pulsed | 1 | ||
| Power Dissipation | PD | 62.5 | W | 1 | |||
| Operating Junction Temperature Range | TJ | -55 | 150 | ℃ | 1 | ||
| Drain-Source Breakdown Voltage | BVDSS | 45 | V | VGS=0 V, ID=250μA | 2 | ||
| Drain to Source Leakage Current | IDSS | 1 | μA | VDS= 500V, VGS=0V | 2 | ||
| Gate-Body Leakage Current | IGSS | 100 | nA | VGS=30V | 2 | ||
| Gate Threshold Voltage | VGS(th) | 1 | 1.55 | 2.2 | V | VDS= VGS, ID=250μA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | 7.5 | 9.5 | mΩ | VGS=10V, ID=20A | 2 | |
| Static Drain-Source On-Resistance | RDS(ON) | 10 | 14 | mΩ | VGS=4.5V, ID=10A | 2 | |
| Diode Forward Voltage | VSD | 0.9 | 1.2 | V | VGS=0V, IS=20A | 2 | |
| Thermal Resistance, Junction to Ambient | RθJA | 50 | ℃/W | 1 | |||
| Transconductance | gFS | 25 | S | VDS=5V, ID=20A | 2 | ||
| Input Capacitance | Ciss | 942 | pF | VGS=0V, VDS=20V, f=1MHz | 2 | ||
| Output Capacitance | Coss | 309 | pF | VGS=0V, VDS=20V, f=1MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 29 | pF | VGS=0V, VDS=20V, f=1MHz | 2 | ||
| Total Gate Charge | Qg | 14.5 | nC | VGS=10V, VDS=20V, ID=10A | 2 | ||
| Gate Source Charge | Qgs | 2 | nC | VGS=10V, VDS=20V, ID=10A | 2 | ||
| Gate Drain Charge | Qgd | 2.5 | nC | VGS=10V, VDS=20V, ID=10A | 2 | ||
| Turn-On Delay Time | td(on) | 6 | ns | VDS=20V, RGEN=10Ω, ID=10A | 2 | ||
| Turn-Off Delay Time | td(off) | 21 | ns | VDS=20V, RGEN=10Ω, ID=10A | 2 | ||
| Turn-On Rise Time | td(r) | 5 | ns | VDS=20V, RGEN=10Ω, ID=10A | 2 | ||
| Turn-Off Fall Time | td(f) | 5 | ns | VDS=20V, RGEN=10Ω, ID=10A | 2 | ||
| Reverse Recovery Time | trr | 24 | ns | VGS=0V, IS=10A, dIF/dt=100A/μs | 2 | ||
| Reverse Recovery Charge | QRR | 19 | nC | VGS=0V, IS=10A, dIF/dt=100A/μs | 2 |
CAD (KiCad official)
- Symbol:
SE4060GB - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
se4060gb-etched.step/se4060gb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);se4060gb.step/se4060gb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: SINO IC datasheet (7 pp, sha256
e44513c12af03345, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SE4060GB
**SINO IC** · MOSFETs · TO-252
SE4060GB from SINO IC, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate terminal of the N-channel MOSFET, with a maximum gate-source voltage of ±20 V and an on-resistance of 7.5 mΩ typ at VGS=10 V. |
| 2 | Drain | passive | Drain terminal, rated for 45 V drain-source voltage and 56 A continuous (150 A pulsed) drain current. |
| 3 | Source | passive | Source terminal of the N-channel MOSFET, the reference for the gate drive and the body-diode anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SINO IC |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | | | 45 | V | | 1 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | | 1 |
| Drain Current, Continuous | ID | | | 56 | A | | 1 |
| Drain Current, Pulsed | | | | 150 | A | | 1 |
| Avalanche Energy, Single Pulsed | EAS | | | 20 | mJ | Single Pulsed | 1 |
| Power Dissipation | PD | | | 62.5 | W | | 1 |
| Operating Junction Temperature Range | TJ | -55 | | 150 | ℃ | | 1 |
| Drain-Source Breakdown Voltage | BVDSS | 45 | | | V | VGS=0 V, ID=250μA | 2 |
| Drain to Source Leakage Current | IDSS | | | 1 | μA | VDS= 500V, VGS=0V | 2 |
| Gate-Body Leakage Current | IGSS | | | 100 | nA | VGS=30V | 2 |
| Gate Threshold Voltage | VGS(th) | 1 | 1.55 | 2.2 | V | VDS= VGS, ID=250μA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | | 7.5 | 9.5 | mΩ | VGS=10V, ID=20A | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | | 10 | 14 | mΩ | VGS=4.5V, ID=10A | 2 |
| Diode Forward Voltage | VSD | | 0.9 | 1.2 | V | VGS=0V, IS=20A | 2 |
| Thermal Resistance, Junction to Ambient | RθJA | | 50 | | ℃/W | | 1 |
| Transconductance | gFS | | 25 | | S | VDS=5V, ID=20A | 2 |
| Input Capacitance | Ciss | | 942 | | pF | VGS=0V, VDS=20V, f=1MHz | 2 |
| Output Capacitance | Coss | | 309 | | pF | VGS=0V, VDS=20V, f=1MHz | 2 |
| Reverse Transfer Capacitance | Crss | | 29 | | pF | VGS=0V, VDS=20V, f=1MHz | 2 |
| Total Gate Charge | Qg | | 14.5 | | nC | VGS=10V, VDS=20V, ID=10A | 2 |
| Gate Source Charge | Qgs | | 2 | | nC | VGS=10V, VDS=20V, ID=10A | 2 |
| Gate Drain Charge | Qgd | | 2.5 | | nC | VGS=10V, VDS=20V, ID=10A | 2 |
| Turn-On Delay Time | td(on) | | 6 | | ns | VDS=20V, RGEN=10Ω, ID=10A | 2 |
| Turn-Off Delay Time | td(off) | | 21 | | ns | VDS=20V, RGEN=10Ω, ID=10A | 2 |
| Turn-On Rise Time | td(r) | | 5 | | ns | VDS=20V, RGEN=10Ω, ID=10A | 2 |
| Turn-Off Fall Time | td(f) | | 5 | | ns | VDS=20V, RGEN=10Ω, ID=10A | 2 |
| Reverse Recovery Time | trr | | 24 | | ns | VGS=0V, IS=10A, dIF/dt=100A/μs | 2 |
| Reverse Recovery Charge | QRR | | 19 | | nC | VGS=0V, IS=10A, dIF/dt=100A/μs | 2 |
## CAD (KiCad official)
- Symbol: `SE4060GB`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `se4060gb-etched.step` / `se4060gb-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `se4060gb.step` / `se4060gb.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [SINO IC datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588902328267386880) (7 pp, sha256 `e44513c12af03345`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/se4060gb-datasheet.pdf)