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SC18IS606PWJ

NXP Semicon · Interface - Specialized · TSSOP-16

SC18IS606PWJ from NXP Semicon, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SDA bidirectional I2C-bus data line, operating at up to 400 kHz as a target.
2 SCL input I2C-bus clock input, supporting clock rates up to 400 kHz.
3 INT output Active LOW interrupt output; this open-drain pin must be pulled HIGH with a resistor and must not be held LOW at power on or reset.
4 RESET input Reset input, active LOW.
5 A2 input Address input 2, which sets the programmable bit A2 of the I2C-bus target address.
6 A1 input Address input 1, which sets the programmable bit A1 of the I2C-bus target address.
7 A0 input Address input 0, which sets the programmable bit A0 of the I2C-bus target address.
8 SS2/GPIO2 bidirectional SPI slave select output 2 (active LOW), or GPIO 2 when not used as an SPI chip select.
9 SS0/GPIO0 bidirectional SPI slave select output 0 (active LOW), or GPIO 0 when not used as an SPI chip select.
10 MOSI output Master Out, Slave In: SPI data output from the SC18IS606 master to the slave device.
11 SPICLK output SPI clock output generated by the SC18IS606 to clock data on MOSI and MISO, operating up to 1.8 Mbit/s.
12 VDD power_in Supply voltage, 1.71 V to 3.6 V.
13 VSS power_in Ground supply.
14 MISO input Master In, Slave Out: SPI data input to the SC18IS606 master from the slave device.
15 VREFP power_in Must be connected to VDD.
16 SS1/GPIO1 bidirectional SPI slave select output 1 (active LOW), or GPIO 1 when not used as an SPI chip select.

Key specifications

Parameter Value
Manufacturer NXP Semicon
Package TSSOP-16
Category Communication Interface Chip/UART/485/232
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
supply voltage VDD -0.5 4.6 V 12
bias ambient temperature Tamb(bias) -55 150 °C operating 12
storage temperature Tstg -65 150 °C 12
input voltage VI -0.5 5.4 V 5 V tolerant I/O pins; VDD ≥ 1.71 V 12
input voltage VI -0.5 3.6 V 3 V tolerant I/O - all pins 12
HIGH-level output current per input/output pin IOH(I/O) 8 mA 12
LOW-level output current per input/output pin IOL(I/O) 20 mA 12
maximum total I/O current II/O(tot)(max) 120 mA 12
total power dissipation per package Ptot/pack 1.5 W 12
supply voltage VDD 1.71 3.6 V 13
ambient operating temperature Tamb -40 105 °C 13
operating supply current IDD(oper) 2.1 4 mA VDD = 3.3 V 13
Idle mode supply current IDD(idle) 1.3 3.4 mA VDD = 3.3 V 13
total Power-down mode supply current IDD(tpd) 6 75 µA VDD = 3.3 V 13
LOW-level output voltage VOL 0.5 V IOL = 4 mA; 2.5 V ≤ VDD ≤ 3.6 V 13
input capacitance at gate Cig 15 pF 13
LOW-level input current IIL -80 µA logical 0; VI = 0.4 V 13
input leakage current ILI -10 10 µA all ports; VI = VIL or VIH 13
HIGH-LOW transition current ITHL -30 -450 µA all ports; logical 1-to-0; VI = 2.0 V at VDD = 3.6 V 13
pull-up current Ipu 10 50 90 µA 2.0 V ≤ VDD ≤ 3.6 V 13
pull-up current Ipu 7 50 85 µA 1.71 V ≤ VDD ≤ 2.0 V 13
pull-up current Ipu 0 0 0 µA VDD < VI < 5 V 13
glitch rejection time tgr 20 ns RESET pin 14
signal acceptance time tsa 125 ns RESET pin 14
signal acceptance time tsa 50 ns any pin except RESET 14
SPI operating frequency fSPI 1.875 MHz 14
SPI cycle time TSPICYC 533 ns 1.875 MHz 14
data set-up time tDS 10 ns 14
data hold time tDH 7 ns 14
data output valid time tV(Q) 2 ns 14

CAD (KiCad official)

  • Symbol: SC18IS606PWJ
  • Footprint: Package_SO:TSSOP-16_4.4x5mm_P0.65mm
  • 3D model: TSSOP-16 (KiCad packages3D, STEP)
  • 3D model files: sc18is606pwj-etched.step / sc18is606pwj-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sc18is606pwj.step / sc18is606pwj.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NXP Semicon datasheet (27 pp, sha256 f597e58a481bf76a, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF