# S3MB-TP

**MCC(Micro Commercial Components)** · Diodes - General Purpose · SMB(DO-214AA)

S3MB-TP from MCC(Micro Commercial Components), in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode terminal, identified by the cathode mark on the SMB (DO-214AA) body; the S3MB blocks up to 1000V DC reverse voltage and passes 3.0A average forward current. |
| 2 | A | passive | Anode terminal at the end opposite the cathode mark; the S3MB has a maximum forward voltage of 1.15V at 3.0A. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SMB(DO-214AA) |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | VRRM |  |  | 1000 | V | S3MB | 1 |
| Maximum RMS Voltage | VRMS |  |  | 700 | V | S3MB | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 1000 | V | S3MB | 1 |
| Average Forward Current | IO |  |  | 3 | A | TT=75°C | 1 |
| Non-Repetitive Peak Forward Surge Current | IFSM |  |  | 100 | A | 8.3ms, Half Sine Wave | 1 |
| Non-Repetitive Peak Forward Surge Current | IFSM |  |  | 200 | A | 1ms, Square Wave | 1 |
| Repetitive Peak Forward Surge Current | IFRM |  |  | 150 | A | 300us Surge Duration, 900 ms Between Surges | 1 |
| Maximum Instantaneous Forward Voltage | VF |  |  | 1.15 | V | IFM=3.0A; TJ=25°C | 1 |
| Maximum DC Reverse Current at Rated DC Blocking Voltage | IR |  |  | 10 | μA | TJ=25°C | 1 |
| Maximum DC Reverse Current at Rated DC Blocking Voltage | IR |  |  | 250 | μA | TJ=125°C | 1 |
| Operating Junction Temperature Range | TJ | -55 |  | 150 | °C |  | 1 |
| Storage Temperature Range | TSTG | -55 |  | 150 | °C |  | 1 |
| Typical Thermal Resistance Junction to Lead | RθJL |  | 10 |  | °C/W | Junction to Lead | 1 |
| Typical Junction Capacitance | CJ |  | 40 |  | pF | Measured at 1.0MHz, VR=4.0V | 1 |

## CAD (KiCad official)

- Symbol: `S3MB-TP`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files: `s3mb-tp-etched.step` / `s3mb-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `s3mb-tp.step` / `s3mb-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC(Micro Commercial Components) datasheet](docs/s3mb-tp-datasheet.pdf) (3 pp, sha256 `07c88d793765fa72`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/s3mb-tp-datasheet.pdf)