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Contents

README

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S3MB-TP

MCC(Micro Commercial Components) · Diodes - General Purpose · SMB(DO-214AA)

S3MB-TP from MCC(Micro Commercial Components), in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode terminal, identified by the cathode mark on the SMB (DO-214AA) body; the S3MB blocks up to 1000V DC reverse voltage and passes 3.0A average forward current.
2 A passive Anode terminal at the end opposite the cathode mark; the S3MB has a maximum forward voltage of 1.15V at 3.0A.

Key specifications

Parameter Value
Manufacturer MCC(Micro Commercial Components)
Package SMB(DO-214AA)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Recurrent Peak Reverse Voltage VRRM 1000 V S3MB 1
Maximum RMS Voltage VRMS 700 V S3MB 1
Maximum DC Blocking Voltage VDC 1000 V S3MB 1
Average Forward Current IO 3 A TT=75°C 1
Non-Repetitive Peak Forward Surge Current IFSM 100 A 8.3ms, Half Sine Wave 1
Non-Repetitive Peak Forward Surge Current IFSM 200 A 1ms, Square Wave 1
Repetitive Peak Forward Surge Current IFRM 150 A 300us Surge Duration, 900 ms Between Surges 1
Maximum Instantaneous Forward Voltage VF 1.15 V IFM=3.0A; TJ=25°C 1
Maximum DC Reverse Current at Rated DC Blocking Voltage IR 10 μA TJ=25°C 1
Maximum DC Reverse Current at Rated DC Blocking Voltage IR 250 μA TJ=125°C 1
Operating Junction Temperature Range TJ -55 150 °C 1
Storage Temperature Range TSTG -55 150 °C 1
Typical Thermal Resistance Junction to Lead RθJL 10 °C/W Junction to Lead 1
Typical Junction Capacitance CJ 40 pF Measured at 1.0MHz, VR=4.0V 1

CAD (KiCad official)

  • Symbol: S3MB-TP
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: s3mb-tp-etched.step / s3mb-tp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); s3mb-tp.step / s3mb-tp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MCC(Micro Commercial Components) datasheet (3 pp, sha256 07c88d793765fa72, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF