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S-LMBZ27VCLT1G

Public Made by Adom

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LRC Zener Diodes, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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S-LMBZ27VCLT1G

LRC · Zener Diodes · SOT-23

S-LMBZ27VCLT1G from LRC, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of the first Zener diode, which is connected to the common cathode at pin 3; the datasheet gives a 25.65 V to 28.35 V breakdown voltage (VBR) at IT = 1 mA.
2 A2 passive Anode of the second Zener diode, which is connected to the common cathode at pin 3; the datasheet gives a 25.65 V to 28.35 V breakdown voltage (VBR) at IT = 1 mA.
3 K passive Common cathode of the two Zener diodes; the datasheet gives a maximum clamping voltage of 38 V at IPP = 1 A and a maximum peak power of 40 W at 1.0 ms.

Key specifications

Parameter Value
Manufacturer LRC
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown Voltage (IT = 1mA) VBR 25.65 27 28.35 V IT = 1mA 2
Maximum Reverse Leakage Current IR 50 nA VRWM = 22V 2
Clamping Voltage VC 38 V IPP=1A 2
Maximum Temperature Coefficient of VBR θVBR 24.3 mV/°C 2
Junction Capacitance Cj 60 pF f=1MHz, Level=50mV, VR=0V 2
Working Peak Reverse Voltage Range VRWM 3 26 V 1
Peak Power Dissipation Ppk 40 W @ 1.0 ms (Note 1) 1
Total Power Dissipation on FR-5 Board PD 225 mW (Note 2) @TA=25°C 1
Derate above 25°C (FR-5 Board) PD 1.8 mW/°C Derate above 25°C 1
Thermal Resistance Junction-to-Ambient (FR-5 Board) RθJA 556 °C/W 1
Total Power Dissipation on Alumina Substrate PD 300 mW (Note 3) @TA=25°C 1
Derate above 25°C (Alumina Substrate) PD 2.4 mW/°C Derate above 25°C 1
Thermal Resistance Junction-to-Ambient (Alumina Substrate) RθJA 417 °C/W 1
Junction and Storage Temperature Range TJ,Tstg -55 150 °C 1
Lead Solder Temperature (Maximum) TL 260 °C 10 second duration 1

CAD (KiCad official)

  • Symbol: S-LMBZ27VCLT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: s-lmbz27vclt1g-etched.step / s-lmbz27vclt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); s-lmbz27vclt1g.step / s-lmbz27vclt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (6 pp, sha256 d0c014daf02af0ae, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF