component
S-LMBZ27VCLT1G
Public Made by Adomby adom
LRC Zener Diodes, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownS-LMBZ27VCLT1G
LRC · Zener Diodes · SOT-23
S-LMBZ27VCLT1G from LRC, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Anode of the first Zener diode, which is connected to the common cathode at pin 3; the datasheet gives a 25.65 V to 28.35 V breakdown voltage (VBR) at IT = 1 mA. |
| 2 | A2 | passive | Anode of the second Zener diode, which is connected to the common cathode at pin 3; the datasheet gives a 25.65 V to 28.35 V breakdown voltage (VBR) at IT = 1 mA. |
| 3 | K | passive | Common cathode of the two Zener diodes; the datasheet gives a maximum clamping voltage of 38 V at IPP = 1 A and a maximum peak power of 40 W at 1.0 ms. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | LRC |
| Package | SOT-23 |
| Category | Diodes |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage (IT = 1mA) | VBR | 25.65 | 27 | 28.35 | V | IT = 1mA | 2 |
| Maximum Reverse Leakage Current | IR | 50 | nA | VRWM = 22V | 2 | ||
| Clamping Voltage | VC | 38 | V | IPP=1A | 2 | ||
| Maximum Temperature Coefficient of VBR | θVBR | 24.3 | mV/°C | 2 | |||
| Junction Capacitance | Cj | 60 | pF | f=1MHz, Level=50mV, VR=0V | 2 | ||
| Working Peak Reverse Voltage Range | VRWM | 3 | 26 | V | 1 | ||
| Peak Power Dissipation | Ppk | 40 | W | @ 1.0 ms (Note 1) | 1 | ||
| Total Power Dissipation on FR-5 Board | PD | 225 | mW | (Note 2) @TA=25°C | 1 | ||
| Derate above 25°C (FR-5 Board) | PD | 1.8 | mW/°C | Derate above 25°C | 1 | ||
| Thermal Resistance Junction-to-Ambient (FR-5 Board) | RθJA | 556 | °C/W | 1 | |||
| Total Power Dissipation on Alumina Substrate | PD | 300 | mW | (Note 3) @TA=25°C | 1 | ||
| Derate above 25°C (Alumina Substrate) | PD | 2.4 | mW/°C | Derate above 25°C | 1 | ||
| Thermal Resistance Junction-to-Ambient (Alumina Substrate) | RθJA | 417 | °C/W | 1 | |||
| Junction and Storage Temperature Range | TJ,Tstg | -55 | 150 | °C | 1 | ||
| Lead Solder Temperature (Maximum) | TL | 260 | °C | 10 second duration | 1 |
CAD (KiCad official)
- Symbol:
S-LMBZ27VCLT1G - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
s-lmbz27vclt1g-etched.step/s-lmbz27vclt1g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);s-lmbz27vclt1g.step/s-lmbz27vclt1g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: LRC datasheet (6 pp, sha256
d0c014daf02af0ae, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).