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S-L2N7002KLT1G

LRC · MOSFETs · SOT-23

S-L2N7002KLT1G from LRC, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate terminal with ESD protection (2000 V HBM); gate-source voltage limited to ±20 V, threshold 1.0 to 2.5 V at 250 µA.
2 Source passive Source terminal of the N-channel MOSFET, with body diode continuous source current limited to 300 mA.
3 Drain passive Drain terminal with 60 V maximum drain-source voltage, 320 mA continuous drain current at 25°C and 1.5 A pulsed.

Key specifications

Parameter Value
Manufacturer LRC
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage V(BR)DSS 60 Vdc VGS = 0, ID = 250 μAdc 2
Gate Threshold Voltage VGS(th) 1 Vdc VDS = VGS, ID = 250 μAdc 2
Negative Threshold Temperature Coefficient VGS(th)/TJ 4 mV/°C 2
Forward Transconductance gfs 80 mS VDS = 5.0 Vdc, ID = 200 mAdc 2
Drain-Source Voltage VDSS 60 Vdc 1
Gate-Source Voltage VGS -20 20 Vdc 1
Drain Current, steady state ID 380 mAdc TA = 25°C, steady state 1
Drain Current, steady state ID 270 mAdc TA = 85°C, steady state 1
Pulsed Drain Current IDM 1.5 A tp = 10 μs 1
Source Current (Body Diode) IS 300 mAdc 1
Junction and Storage Temperature TJ, Tstg -55 150 °C 1
Lead Temperature for Soldering Purposes TL 260 °C 1/8 in from case for 10 s 1
Gate-Source ESD Rating ESD HBM 2000 V HBM, Method 3015 1
Total Device Dissipation, steady state PD 300 mW FR-5 board, 1.0 x 0.75 x 0.062 in, steady state 1
Total Device Dissipation, t<5s PD 420 mW FR-5 board, t<5s 1
Junction-to-Ambient, steady state RθJA 417 °C/W FR-5 board, steady state 1
Junction-to-Ambient, t<5s RθJA 300 °C/W FR-5 board, t<5s 1

CAD (KiCad official)

  • Symbol: S-L2N7002KLT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: s-l2n7002klt1g-etched.step / s-l2n7002klt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); s-l2n7002klt1g.step / s-l2n7002klt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (6 pp, sha256 fff7d3bd8264ede0, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF