component
RX3P07CBHC16
Public Made by Adomby adom
ROHM Semicon MOSFETs, TO-220AB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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RX3P07CBHC16
ROHM Semicon · MOSFETs · TO-220AB
RX3P07CBHC16 from ROHM Semicon, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate terminal; gate-source voltage is limited to ±20V and the gate threshold is 2.0 to 4.0V at ID = 1mA. |
| 2 | Drain | passive | Drain terminal, connected to the mounting tab; drain-source voltage is rated at 100V with continuous current of ±70A at Tc = 25°C (±120A silicon limit). |
| 3 | Source | passive | Source terminal, with the body diode running from source to drain, rated for 70A continuous forward current. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | TO-220AB |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain - Source voltage | VDSS | 100 | V | 1 | |||
| Continuous drain current (silicon limit) | ID | -120 | 120 | A | VGS=10V; limited by silicon chip capability (*1) | 1 | |
| Continuous drain current | ID | -70 | 70 | A | Tc = 25°C (VGS=10V) (*2) | 1 | |
| Pulsed drain current | IDP | -480 | 480 | A | Pw ≤ 10μs, Duty cycle ≤ 1% (*3) | 1 | |
| Gate - Source voltage | VGSS | -20 | 20 | V | 1 | ||
| Avalanche current, single pulse | IAS | 35 | A | *4 | 1 | ||
| Avalanche energy, single pulse | EAS | 99 | mJ | *4 | 1 | ||
| Power dissipation | PD | 135 | W | Tc = 25°C, limited only by maximum temperature allowed (*2) | 1 | ||
| Junction temperature | Tj | 150 | ℃ | 1 | |||
| Operating junction and storage temperature range | Tstg | -55 | 150 | ℃ | 1 | ||
| Thermal resistance, junction - case | RthJC | 0.92 | ℃/W | *2 Tc=25℃, limited only by maximum temperature allowed | 2 | ||
| Drain - Source breakdown voltage | V(BR)DSS | 100 | V | VGS = 0V, ID = 1mA | 2 | ||
| Breakdown voltage temperature coefficient | ΔV(BR)DSS/ΔTj | 62.3 | mV/℃ | ID = 1mA, referenced to 25℃ | 2 | ||
| Zero gate voltage drain current | IDSS | 5 | μA | VDS = 100V, VGS = 0V | 2 | ||
| Gate - Source leakage current | IGSS | -500 | 500 | nA | VGS = ±20V, VDS = 0V | 2 | |
| Gate threshold voltage | VGS(th) | 2 | 4 | V | VDS = VGS, ID = 1mA | 2 | |
| Gate threshold voltage temperature coefficient | ΔVGS(th)/ΔTj | -4.5 | mV/℃ | ID = 1mA, referenced to 25℃ | 2 | ||
| Static drain - source on - state resistance | RDS(on) | 4 | 5.2 | mΩ | VGS = 10V, ID = 70A (*5 Pulsed) | 2 | |
| Static drain - source on - state resistance | RDS(on) | 4.8 | 7.2 | mΩ | VGS = 6V, ID = 35A (*5 Pulsed) | 2 | |
| Gate resistance | RG | 0.9 | Ω | 2 | |||
| Forward transfer admittance | /Yfs/ | 30 | S | VDS = 5V, ID = 35A (*5 Pulsed) | 2 | ||
| Input capacitance | Ciss | 4650 | pF | VGS = 0V | 3 | ||
| Output capacitance | Coss | 890 | pF | VDS = 50V | 3 | ||
| Reverse transfer capacitance | Crss | 33 | pF | f = 1MHz | 3 | ||
| Turn - on delay time | td(on) | 40 | ns | VDD ⋍ 50V, VGS = 10V, ID = 35A, RL ⋍ 1.42Ω, RG = 10Ω (*5) | 3 | ||
| Rise time | tr | 37 | ns | VDD ⋍ 50V, VGS = 10V, ID = 35A, RL ⋍ 1.42Ω, RG = 10Ω (*5) | 3 | ||
| Turn - off delay time | td(off) | 99 | ns | VDD ⋍ 50V, VGS = 10V, ID = 35A, RL ⋍ 1.42Ω, RG = 10Ω (*5) | 3 | ||
| Fall time | tf | 60 | ns | VDD ⋍ 50V, VGS = 10V, ID = 35A, RL ⋍ 1.42Ω, RG = 10Ω (*5) | 3 | ||
| Total gate charge | Qg | 73 | nC | VDD ⋍ 50V, ID = 50A, VGS = 10V (*5) | 3 | ||
| Total gate charge | Qg | 48 | nC | VDD ⋍ 50V, ID = 50A, VGS = 6V (*5) | 3 | ||
| Gate - Source charge | Qgs | 16.4 | nC | VDD ⋍ 50V, ID = 50A (*5) | 3 | ||
| Gate - Drain charge | Qgd | 18.9 | nC | VDD ⋍ 50V, ID = 50A (*5) | 3 | ||
| Continuous forward current | IS | 70 | A | Ta = 25℃ | 3 | ||
| Pulse forward current | ISP | 480 | A | *3 (Pw ≤ 10μs, Duty cycle ≤ 1%) | 3 | ||
| Forward voltage | VSD | 1.2 | V | VGS = 0V, IS = 70A (*5) | 3 | ||
| Reverse recovery time | trr | 74 | ns | IS = 50A, VGS = 0V, di/dt = 100A/μs (*5) | 3 | ||
| Reverse recovery charge | Qrr | 190 | nC | IS = 50A, VGS = 0V, di/dt = 100A/μs (*5) | 3 |
CAD (KiCad official)
- Symbol:
RX3P07CBHC16 - Footprint:
Package_TO_SOT_THT:TO-220-3_Vertical - 3D model: TO-220AB (KiCad packages3D, STEP)
- 3D model files:
rx3p07cbhc16-etched.step/rx3p07cbhc16-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rx3p07cbhc16.step/rx3p07cbhc16.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (13 pp, sha256
beefe6a8a08effb5, retrieved 2026-10-29, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).