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docs rt6252bhgj6f: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
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pads.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
page.json rt6252bhgj6f: specified limits as data (metadata.characteristics, 28 rows from the datasheet) · Ray
README.md rt6252bhgj6f: specified limits as data (metadata.characteristics, 28 rows from the datasheet) · Ray
rt6252bhgj6f-etched.fit.json rt6252bhgj6f: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
rt6252bhgj6f-etched.glb rt6252bhgj6f: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
rt6252bhgj6f-etched.step rt6252bhgj6f: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
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rt6252bhgj6f.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect an… · Ray
rt6252bhgj6f.step Publish 0.1.0 · Ray

RT6252BHGJ6F

Richtek Tech · DC-DC Converters · TSOT-23-6

RT6252BHGJ6F from Richtek Tech, in a TSOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Power ground return for the IC and the low-side MOSFET source.
2 SW power_out Switch node between the internal high-side and low-side (synchronous rectifier) MOSFETs. Connect to the external inductor and to the bootstrap capacitor's low side.
3 VIN power_in Power input, 4.5V to 17V. Bypass directly to GND with an MLCC ≥ 20µF placed close to the pin.
4 FB input Feedback voltage input. Connect to the midpoint of the external resistor divider from VOUT to GND. Regulated to VFB ≈ 0.765V (±1%).
5 EN input Enable control input. Logic high enables the converter; tie to GND to disable. An internal REN_DN pulldown allows the pin to float to a shutdown state.
6 BOOT power_in Bootstrap capacitor node for the high-side gate driver. Connect a 0.1µF ceramic capacitor from BOOT to SW.

Key specifications

Parameter Value
Manufacturer Richtek Tech
Package TSOT-23-6
Category PMIC
Pins 6

Ordering variants

Same part, different packaging or reel option.

  • RT6252BHGJ6F
  • RT6252BHGJ6FH6F
  • RT6252BHGJ6FHGH6F

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Input Operating Voltage VIN 4.5 17 V 8
Under-Voltage Lockout Threshold VUVLO 3.7 4 4.3 V 8
Shutdown Current ISHDN 4 µA VEN = 0V 8
Enable Voltage Threshold, EN high-level input voltage VEN_H 1.16 1.25 1.34 V 8
Enable Voltage Threshold, EN low-level input voltage VEN_L 1.01 1.1 1.19 V 8
EN Pin Pull-Down Resistance REN_DN 225 450 900 k EN pin resistance to GND, VEN = 12V 8
Feedback Threshold Voltage VFB 758 765 772 mV VOUT = 1.05V 8
Feedback Input Current IFB -0.1 0 0.1 A VFB = 0.8V, TA = 25°C 8
Low-Side Switch Valley Current Limit ILIM_L 2.2 3.2 4.2 A 8
Minimum Off-Time tOFF_MIN 200 260 ns VFB = 0.5V 8
Supply Input Operating Voltage VIN 4.5 17 V 7
Junction Temperature Range TJ -40 125 °C 7
Supply Input Voltage VIN -0.3 20 V 7
Enable Voltage EN -0.3 20 V 7
Switch Voltage SW -0.3 20.3 V 7
Switch Voltage (transient) SW -5 25 V < 100ns 7
BOOT Voltage BOOT -0.3 26 V 7
BOOT to SW Voltage VBOOT - VSW -0.3 6 V 7
Feedback Voltage FB -0.3 6 V 7
Lead Temperature 260 °C Soldering, 10 sec. 7
Junction Temperature 150 °C 7
Storage Temperature Range -65 150 °C 7
Junction-to-ambient thermal resistance (JEDEC standard) θJA 88.7 °C/W JEDEC standard, TSOT-23-6 (FC) 7
Junction-to-case (top) thermal resistance θJC(Top) 76.9 °C/W TSOT-23-6 (FC) 7
Junction-to-case (bottom) thermal resistance θJC(Bottom) 6 °C/W TSOT-23-6 (FC) 7
Junction-to-ambient thermal resistance (specific EVB) θJA(EVB) 63.3 °C/W specific EVB, TSOT-23-6 (FC) 7
Junction-to-top characterization parameter JC(Top) 15.3 °C/W TSOT-23-6 (FC) 7
Junction-to-board characterization parameter JB 34.66 °C/W TSOT-23-6 (FC) 7

CAD (KiCad official)

  • Symbol: RT6252BHGJ6F
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: TSOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: rt6252bhgj6f-etched.step / rt6252bhgj6f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rt6252bhgj6f.step / rt6252bhgj6f.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
rt6252bhgj6f.step 97 KB You want the bare part, or you mark your own boards.
rt6252bhgj6f-etched.step 2.5 MB You want the part with RT6252BHGJ6F already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 590 faces against 117 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Richtek Tech datasheet (31 pp, sha256 b3073e6d0c76ec40, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF